JPS58168284A - Multiple series photocoupler - Google Patents
Multiple series photocouplerInfo
- Publication number
- JPS58168284A JPS58168284A JP57052032A JP5203282A JPS58168284A JP S58168284 A JPS58168284 A JP S58168284A JP 57052032 A JP57052032 A JP 57052032A JP 5203282 A JP5203282 A JP 5203282A JP S58168284 A JPS58168284 A JP S58168284A
- Authority
- JP
- Japan
- Prior art keywords
- lead
- light emitting
- common
- light
- elements
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000003287 optical effect Effects 0.000 claims description 16
- 230000008878 coupling Effects 0.000 claims description 15
- 238000010168 coupling process Methods 0.000 claims description 15
- 238000005859 coupling reaction Methods 0.000 claims description 15
- 239000011347 resin Substances 0.000 abstract description 6
- 229920005989 resin Polymers 0.000 abstract description 6
- 238000004519 manufacturing process Methods 0.000 description 6
- 238000010586 diagram Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 238000000034 method Methods 0.000 description 2
- 241001670157 Gymnura Species 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 210000000554 iris Anatomy 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/12—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof structurally associated with, e.g. formed in or on a common substrate with, one or more electric light sources, e.g. electroluminescent light sources, and electrically or optically coupled thereto
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Electromagnetism (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Photo Coupler, Interrupter, Optical-To-Optical Conversion Devices (AREA)
Abstract
Description
【発明の詳細な説明】
本発明は光結合素子を多連にした場合の多連光結合素子
に関する。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a multiple optical coupling device in which multiple optical coupling devices are arranged.
多連光結合素子は同一パッケージ内に複数の一対からな
る発光素子と受光素子とで構成されており、通常各チャ
ネル毎に光を媒体として電気信号の伝達を行なっている
。A multiple optical coupling device is composed of a plurality of pairs of a light emitting device and a light receiving device in the same package, and usually transmits electrical signals using light as a medium for each channel.
従来のこの多連光結合素子の構造は第１図に示すように
１チヤネルだけで少なくとも４端子を有しており、例え
ば４チヤネル構造では１６端子が必要となっている。一
方、使用面ではシーケンス・コントローラ、端末等の入
出力部アイソレージ１ン用として１装置当り、かなりの
数で使われており、各チャンネル毎の使用条件はほとん
ど同じである場合が多い。また尚−電源使用の為に素子
外部での配線により各チャネルの発光側アノード端子を
共通にしたり、受光側のコレクタ端子あるいはエミッタ
端子を共通にしてコントロールする場合が多くなって来
てい暮。この為、第１図のような従来の多連光ｉ合素子
の使用では数量が増すとより大きな実装スペースが必要
となり、実装工数も多くなるという欠点がありた。また
製造面においても各チャネルが共通部分を持たないため
チャネル数が増すとと比例的に工数、材料等が多くなっ
てしまっていた。□
本発明の目的とする所はこの多連光結合素子のの共通部
分を見い出し、共通化する方法によって素子を小形化に
すると共に実装面での工数及び夾装面積勢を低減させる
事にある。また製造面においてはこの新構造により製造
工数及び使用材料の低減を図ることにある。As shown in FIG. 1, the conventional structure of this multiple optical coupling device has at least four terminals in just one channel. For example, a four-channel structure requires 16 terminals. On the other hand, in terms of usage, they are used in large numbers per device as input/output isolation channels for sequence controllers, terminals, etc., and the usage conditions for each channel are often almost the same. In addition, in order to use the power supply, it is becoming increasingly common for each channel to use a common anode terminal on the light emitting side by wiring outside the device, or to use a common collector terminal or emitter terminal on the light receiving side for control. For this reason, the use of the conventional multiple optical i-combiner as shown in FIG. 1 has the disadvantage that as the number increases, a larger mounting space is required and the number of mounting steps increases. In addition, in terms of manufacturing, each channel does not have a common part, so as the number of channels increases, the number of man-hours, materials, etc. increase proportionally. □ The purpose of the present invention is to find the common parts of multiple optical coupling devices and use a common method to miniaturize the device and reduce the number of man-hours and mounting area required for mounting. . In terms of manufacturing, this new structure aims to reduce manufacturing man-hours and materials used.
以下、図面に従って詳細に説明する。A detailed explanation will be given below according to the drawings.
第１図は従来の多連光結合素子の平面構造図例であり、
４チヤネルより成っている光結合素子例である。本構造
は発光素子１９と受光素子２０、また発光素子２３と受
光素子２４郷で表わされるペアで各々４個の独立した光
結合素子が形成され、各々のチャネルはリード１．２，
１５．１６また３１４．１３．１４勢の４ＰＩＮリード
で構成されている。−例として今、素子１９．２０のペ
アについてその構造を説明する発光素子１９ｔｌ−ドフ
レーム２上にマウントされ、ボンディング線２１によっ
てリードフレームｌに接続され発光側を形成している。FIG. 1 is an example of a planar structure diagram of a conventional multiple optical coupling device.
This is an example of an optical coupling device consisting of 4 channels. In this structure, pairs represented by a light emitting element 19 and a light receiving element 20, and a light emitting element 23 and a light receiving element 24 form four independent optical coupling elements, and each channel has leads 1, 2,
It consists of 4PIN leads from 15.16 and 314.13.14. - By way of example, we will now describe the structure of a pair of elements 19.20, the light emitting elements 19tl - mounted on the lead frame 2 and connected to the lead frame l by bonding wires 21 to form the light emitting side.
受光側は同様に受光素子２０がリードフレーム１６上に
マウントされボンディング１１２２によってリードフレ
ーム１５にＩ！続されている。光の伝達ができるＩＩＫ
透光性樹脂１７で画素子はおおわれ、最終的に外来光防
止用の不透光性樹脂１８が全体をおおつている構造であ
る。On the light receiving side, the light receiving element 20 is similarly mounted on the lead frame 16 and attached to the lead frame 15 by bonding 1122. It is continued. IIK that can transmit light
The pixel element is covered with a light-transmitting resin 17, and finally the entire structure is covered with a non-light-transmitting resin 18 for preventing external light.
各チャネルは総て同じ構造となっている。All channels have the same structure.
第２図、菖３１１１は本発明による多連光結合素子（４
チャネル光結合素子）の平面構造図例である。In FIG. 2, the irises 3111 are multiple optical coupling elements (4
FIG. 2 is an example of a planar structural diagram of a channel optical coupling device.
１例として第２ｗＡについて説明する。The second wA will be explained as an example.
第２図は各チャネルの共通７ノードリード５１、及び共
通コレクタリード５２を持つ事に特徴を持つ・本構造は
第１図の従来形と類似しているがリードフレーム数が少
なく、小さい構造となりている。製造方法は最初のチャ
ネルのみ従来と同じ方法で行い、次チャネルより共通リ
ードを使用する。Figure 2 is characterized by having common 7 node leads 51 and common collector leads 52 for each channel. - This structure is similar to the conventional type shown in Figure 1, but it has a smaller number of lead frames and a smaller structure. ing. The manufacturing method is the same as the conventional method only for the first channel, and a common lead is used from the next channel.
即ち、発光素子２３はリード４上にマウントされ、ボン
ディング＠２５によって最初のチャネルで使用したリー
ド５１に接続され、共用されている。That is, the light emitting element 23 is mounted on the lead 4 and connected to the lead 51 used in the first channel by bonding@25, so that the light emitting element 23 is shared.
受光素子も同様リード５２を共用している。The light receiving elements also share the lead 52.
本方法によれば製造材料１ｍ造工数が低減されると共に
使用面においても実装工数、実骸面積等が低減される。According to this method, the number of man-hours required for manufacturing 1 meter of manufacturing material is reduced, and in terms of use, the number of man-hours for mounting, the area of the actual structure, etc. are also reduced.
また量産性も秀れている。It also has excellent mass productivity.
第３図はリードフレーム面積を第２図よりさらに少なく
した本ので各チャネルの共通リード５１゜５３１でボン
ディング線群２７．２８によって各チャネルの素子間を
接続している本発明の他の実施例である。FIG. 3 shows another embodiment of the present invention in which the lead frame area is further reduced than that in FIG. 2, and the elements of each channel are connected by bonding wire groups 27 and 28 using common leads 51 and 531 of each channel. It is.
第１図は従来の多連光結合素子の平面構造図。
第２図は本発明による多連光°結合素子の平面構造図例
。第３図は本発明による多連光結合素子の他の平面構造
図例。
１．３．５．７・・・・・・発光素子側７ノ＝ドリード
、２．４．６．８・・・・・・発光素子側カソードリー
ド、９．１１，１３．１５・・・・・・受光素子側エイ
、タリード、１０，１２，１４．１６・・・・・・受光
素子側コレクタリード、１７・・・・・・透光性樹脂、
１８・・・・・・不透光性樹脂、１９．２３・・・・・
・発光素子、２０．２４・・・・・・受光素子、２１．
２５・・・・・・発光側ボンディング線、２２．２６・
°°・・・受光側ボンディング線、２７・・・・・・発
光側ボンディング線群、２８・・・・・・受光側ボンデ
ィング線評％！Ｓｌ・・・・・・発光側共通７ノード、
５２・・・・・・受光側共通；レクタリード、５３・旧
・・受光側共通工ζツタリード。FIG. 1 is a plan view of a conventional multiple optical coupling device. FIG. 2 is an example of a planar structural diagram of a multiple optical coupling device according to the present invention. FIG. 3 is another example of a planar structure of the multiple optical coupling device according to the present invention. 1.3.5.7... 7 leads on the light emitting element side, 2.4.6.8... Cathode lead on the light emitting element side, 9.11, 13.15... ... Light receiving element side stingray, tally lead, 10, 12, 14.16... Light receiving element side collector lead, 17... Transparent resin,
18... Opaque resin, 19.23...
- Light emitting element, 20.24... Light receiving element, 21.
25... Light emitting side bonding wire, 22.26.
°°... Light-receiving side bonding line, 27... Light-emitting side bonding line group, 28... Light-receiving side bonding line evaluation %! Sl... 7 nodes common on the light emitting side,
52...Common to the light receiving side; Rector lead, 53. Old...Common to the light receiving side ζ Tsuta lead.
Claims (1)
受光素子との組合せから成る多連光結合素子において、
発光側のアノードあるいはカソード端子を共通とした構
造、または受光側のコレクタあるいはエミ、り、または
それに準するものを共通端子とした構造を有したことを
特徴とする光結合素子。In a multiple optical coupling device consisting of a combination of a plurality of light emitting elements and a plurality of light receiving elements housed in the same package,
1. An optical coupling element characterized by having a structure in which an anode or cathode terminal on a light emitting side is used as a common terminal, or a structure in which a collector, an emitter, or a similar terminal on a light receiving side is used as a common terminal.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57052032A JPS58168284A (en) | 1982-03-30 | 1982-03-30 | Multiple series photocoupler |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57052032A JPS58168284A (en) | 1982-03-30 | 1982-03-30 | Multiple series photocoupler |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS58168284A true JPS58168284A (en) | 1983-10-04 |
Family
ID=12903465
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP57052032A Pending JPS58168284A (en) | 1982-03-30 | 1982-03-30 | Multiple series photocoupler |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58168284A (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6080283A (en) * | 1983-10-07 | 1985-05-08 | Oki Electric Ind Co Ltd | Photo-coupled semiconductor device |
| JPS61199062U (en) * | 1985-05-31 | 1986-12-12 | ||
| JPH0295307U (en) * | 1989-01-13 | 1990-07-30 | ||
| JPH0463656U (en) * | 1990-10-12 | 1992-05-29 | ||
| US5629534A (en) * | 1994-03-23 | 1997-05-13 | Nippondenso Co., Ltd. | Semiconductor device |
| US6759667B2 (en) * | 2000-05-11 | 2004-07-06 | Sharp Kabushiki Kaisha | Photocoupling device and method of manufacturing the same |
-
1982
- 1982-03-30 JP JP57052032A patent/JPS58168284A/en active Pending
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6080283A (en) * | 1983-10-07 | 1985-05-08 | Oki Electric Ind Co Ltd | Photo-coupled semiconductor device |
| JPH0232793B2 (en) * | 1983-10-07 | 1990-07-23 | Oki Electric Ind Co Ltd | |
| JPS61199062U (en) * | 1985-05-31 | 1986-12-12 | ||
| JPH0295307U (en) * | 1989-01-13 | 1990-07-30 | ||
| JPH0463656U (en) * | 1990-10-12 | 1992-05-29 | ||
| US5629534A (en) * | 1994-03-23 | 1997-05-13 | Nippondenso Co., Ltd. | Semiconductor device |
| US6759667B2 (en) * | 2000-05-11 | 2004-07-06 | Sharp Kabushiki Kaisha | Photocoupling device and method of manufacturing the same |
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