JPS58165358A - Manufacture of semiconductor device and lead frame used therefor - Google Patents
Manufacture of semiconductor device and lead frame used thereforInfo
- Publication number
- JPS58165358A JPS58165358A JP4738382A JP4738382A JPS58165358A JP S58165358 A JPS58165358 A JP S58165358A JP 4738382 A JP4738382 A JP 4738382A JP 4738382 A JP4738382 A JP 4738382A JP S58165358 A JPS58165358 A JP S58165358A
- Authority
- JP
- Japan
- Prior art keywords
- gate
- lead frame
- resin
- frame
- supporting plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 8
- 239000004065 semiconductor Substances 0.000 title abstract description 3
- 239000011347 resin Substances 0.000 claims abstract description 33
- 229920005989 resin Polymers 0.000 claims abstract description 33
- 238000000465 moulding Methods 0.000 claims abstract description 12
- 238000000034 method Methods 0.000 claims abstract description 6
- 239000004020 conductor Substances 0.000 description 3
- 238000005520 cutting process Methods 0.000 description 3
- 230000007547 defect Effects 0.000 description 3
- 238000004140 cleaning Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 239000012634 fragment Substances 0.000 description 1
- 210000003127 knee Anatomy 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 238000011084 recovery Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Lead Frames For Integrated Circuits (AREA)
Abstract
Description
【発明の詳細な説明】
本発明はレジンパッケージ型半導体装置の製造方法およ
びそれに用いるリードフレームＫＭする。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method for manufacturing a resin packaged semiconductor device and a lead frame KM used therein.
レジンパッケージ１１４１導体装置は、第１ａｉｌ１１
ｍｌＫ示すように、リードフレームｌの中央のタブ２上
にチップ３を１１定したＩｌ、タブ２の周辺に内端を臨
ます多数のリード４の内端とチップ３の電極となワイヤ
５で接続し、その後、同図１６）に示すよ５に所望ｍｔ
−レジンモールドしてレジンパッケージ６で被い、不要
なリードフレーム部分を切断除去するととによって製造
している。The resin package 1141 conductor device is
As shown, a chip 3 is placed on the central tab 2 of the lead frame 1, and the inner ends of the leads 4 are placed around the tab 2. Connect, and then set the desired mt to 5 as shown in Figure 16).
- It is manufactured by resin molding, covering with a resin package 6, and cutting and removing unnecessary lead frame parts.
ところで、中導体装置における外部端子（リード）敵の
増大化、小塵化によって、リードは平面ＸＹ方向の４方
向ＶＣ＊出しかつリード間隔も狭くナル、このため、レ
ジンモールドによる封止（おいては、第２＠ＩＫ示すよ
うに、レジンを注入するゲー）７（注入レジンの硬化状
ｌＩＫよって示す、）はリードフレームｌの一隅１１に
設けられるととになる。また、リード４およびダム８を
支持する支持板９もリードフレームｌの４隅に位置する
ことから、ゲート７はこの一つの支持板９に重なってし
まう、このため、ｍｓ図で示すよ５に、ゲート７の壷中
Ｋまで支持板９が延在し、レジ／モールド後のゲートブ
レイク時にゲート７内で硬化したレジン部分とレジンパ
ッケージ６との境界部分で確実に破断が行なわれなくな
り、第４１１ｔａ１〜（Ｃ１で示すようなゲート残りと
称する不良が生じてしまう。モールド復においては、ゲ
ート７の先端部分のレジン硬化部分が最も薄くなるよう
に設計され、ゲートブレイク時にこの薄い境界部分で応
力集中によって破断が生じるようになっている。しかし
、支持板９の端面ば打ち抜きによって形成されるため、
粗面となっていたりしてレジンとの密着性が高かったり
することから、ゲートブレイクは支持板９の内側（同図
１１１参照）％支持板９の端部（同図１ｂｌ参照）、境
界にクラック１０が入るがブレイクは同図ｔａｌと同様
に支持板９の内側（同図１０Ｉ参照）で行なわれること
もある。このようにゲート残りがあると、＊道中の振動
等によってゲート残り部分が脱落し、搬送テーブルとレ
ジンパッケージ６やリードフレーム１との関に挾まった
りしてレジンパッケージ６に傷を付けたり、リードフレ
ームが１１形したりする。このためリード切断成形機に
おける製品詰り等の故障の原因となる。そこで。By the way, due to the increase in the number of external terminals (leads) in medium conductor devices and the reduction in dust, the leads have VC* in four directions in the plane XY direction and the lead spacing is narrow and narrow. As shown in the second IK, a resin injecting gate 7 (indicated by a hardened state of the injected resin IK) is provided at one corner 11 of the lead frame l. Furthermore, since the support plates 9 that support the leads 4 and the dams 8 are also located at the four corners of the lead frame l, the gate 7 overlaps with this one support plate 9. Therefore, as shown in the ms diagram, , the support plate 9 extends to the middle K of the pot of the gate 7, and when the gate breaks after registering/molding, the resin part hardened in the gate 7 and the boundary part between the resin package 6 are prevented from being broken reliably. 411ta1 ~ (A defect called gate residue as shown by C1 occurs.In mold recovery, the resin hardened part at the tip of the gate 7 is designed to be the thinnest, and stress is generated at this thin boundary part at the time of gate break. The breakage is caused by concentration. However, since the end face of the support plate 9 is formed by punching,
Since the surface is rough and has high adhesion with the resin, the gate break is performed on the inside of the support plate 9 (see 111 in the same figure), the edge of the support plate 9 (see 1bl in the same figure), and on the boundary. A crack 10 occurs, but the break may occur inside the support plate 9 (see 10I in the same figure) as in tal in the same figure. If there is any remaining gate in this way, the remaining part of the gate may fall off due to vibrations during transport, get caught between the transport table and the resin package 6 or the lead frame 1, and cause damage to the resin package 6 or cause damage to the leads. The frame is 11-shaped. This causes failures such as product clogging in the lead cutting and forming machine. Therefore.
従来はゲート残りや脱落レジン片を除責する作業も必要
となり、レジンモールド作業の作業性が低下する。Conventionally, it was also necessary to remove remaining gates and fallen resin pieces, which reduced the workability of resin molding operations.
したがって１本発明の目的はゲートブレイク時にゲート
レジ７部分がレジンパッケージの縁で破断するようにし
て、生部体装置の生産性、歩留の向上を図ることにある
。Therefore, one object of the present invention is to improve the productivity and yield of living body devices by making the gate register 7 portion break at the edge of the resin package when the gate breaks.
以下、実施例により本発明なＩ！明する。Hereinafter, the present invention will be explained with reference to Examples. I will clarify.
第ｓｇは本発明の一実施例によるレジンモールド１１亭
導体装置の製造方法、特にレジンモールド状態を示す平
ｌＩｔ図である。この実施例のリードフレームｌでは、
略四角形枠状に延在するダム８によってリード４が支持
されている。また、矩形棒状ダム８の四−は支持板９に
よ〜てリード７レー□、・１．１．′。sg is a plan view showing a method of manufacturing a resin molded conductor device according to an embodiment of the present invention, particularly a state of the resin mold. In the lead frame l of this example,
The lead 4 is supported by a dam 8 extending in the shape of a substantially rectangular frame. Further, the four leads of the rectangular rod-shaped dam 8 are connected by the support plate 9 to the leads 7, □, 1.1. '.
ム１の棒１１に′支持されている。また、レジンモール
ド時のゲートランナー２は一隅の支持板９に沿って設け
られている。この支持板９はレジンの流出が円滑に行な
われるように一枚板となっている。また、第６図および
第７図に示すようにグートラ／す１２から続く先細とな
るゲート７に対応する部分には支持板９は位置しないよ
５に、グートラ／す１２の先端部に対応する部分から支
持板いる。この鋏片片１３はそれ
ぞれゲート７の両側に沿って１て延在して、それぞれダ
ム８の一端に接続している。したがって。It is supported on the rod 11 of the frame 1. Furthermore, the gate runner 2 during resin molding is provided along the support plate 9 at one corner. This support plate 9 is a single plate so that the resin can flow out smoothly. In addition, as shown in FIGS. 6 and 7, the support plate 9 is not located in the part corresponding to the tapered gate 7 continuing from the goutler/su 12. There is a support plate from the part. The scissor pieces 13 each extend along both sides of the gate 7 and are connected to one end of the dam 8, respectively. therefore.
グー）７に対応するダム部分は相互に直ｗ！綾触するど
となく、一方の分妓片１３．支持板９．他方の分絃片１
３を経由してそれ、それ連結する＊造となっている。Goo) The dam parts corresponding to 7 are directly aligned with each other lol! 13. Support plate 9. Other string piece 1
It is a * structure that connects it via 3.
このため、第７図でも示すよ５に、支持板９の縁はゲー
ト７から外れ、幅広でかつ厚いゲートランナ１２内に位
置するようになり、レジ／モールレイク時には第８図で
示すよ５Ｋ。For this reason, as shown in Fig. 7, the edge of the support plate 9 is separated from the gate 7 and is located within the wide and thick gate runner 12, and during the cash register/mall lake, as shown in Fig. 8, the edge of the support plate 9 is separated from the gate 7. .
レジンパッケージ６との境界であるゲート７の先端が最
も応力集中が大きいことから、この境界で破断し、ｉ来
ジンとの密着状況に関与されなく
なり、ゲートブレイク不良は発生しな（なる。なお８本
発明のリードフレーム］はレジ／モールド後の強度を低
下させないために、レジン強度の強いゲートランチ１２
に支持板９０分鋏片１３Ｉｋ一部分釣に重なるよ５Ｋし
てある。Since the tip of the gate 7, which is the boundary with the resin package 6, has the highest concentration of stress, it will break at this boundary and will no longer be involved in the adhesion with the resin, and no gate break failure will occur. 8] The lead frame of the present invention is made of a gate launch 12 with strong resin strength in order not to reduce the strength after registration/molding.
On the support plate 90 minutes, the scissors piece 13Ik is 5K so that it partially overlaps with the hook.
このような実施例によれば、レジンモールド後のランナ
プレイタ作業が確実となり、モールド型等の清浄化も容
易となることから、モールド作業が１．４倍程度向上す
る。また、ランチブレイク時にリードフレームの変形が
起きないため、リード切断成形ニーでの自動−の製品−
りがなくなり、不良鈍生な防止できるようＫなる。According to such an embodiment, the runner plater work after resin molding becomes reliable, and the cleaning of the mold etc. becomes easy, so that the molding work is improved by about 1.4 times. In addition, since the lead frame does not deform during the lunch break, automatic products with lead cutting and forming knees can be used.
This eliminates the risk of deterioration and prevents defects and slow growth.
なお１本発明は前記実施例ＫｉＩ電されない。Note that the present invention is not limited to the above embodiment KiI.
以上のように％亭尭−によれば、リードフレームはレジ
／モールド後のゲートブレイク時にゲートレジン部分が
レジ７パツケージの縁で確実に破断するようなパターン
になっていることから、ゲートブレイク不良は侮生しな
くなる。この結＊。As mentioned above, according to % Tei, the lead frame has a pattern that ensures that the gate resin part breaks at the edge of the register 7 package during gate break after register/mold, so gate break failure occurs. will no longer be offensive. This conclusion*.
ゲート＾りの除★作業、ゲート＾り片の脱落による脱落
レジ７片の除未作業が不要となり、レジンモールドの作
業性が向上し、かつ脱落レジ７片による不良発生が防止
できることによる歩留の向上ｔｌ−図ることができる。This eliminates the need to remove the gate edges and remove the 7 register pieces that fell off due to the falling gate edges, improving the workability of the resin mold, and increasing yield by preventing defects caused by the 7 falling register pieces. It is possible to improve tl-.
第１図圏、（ｂ）は生部体装置の製造方法を示す断面図
、第２図は従来の生部体装置の製造方法を示す平Ｉ［ｔ
ｖ！Ｊ、第３図は同じ（一部の断面図、第４図１ｍｌ〜
ＩＣＩは同じくゲートブレイク時の不良ブレイク状Ｓな
示す断面図、第５図は本発明の一実施例による生部体装
置の製造方法な示す平面図、第６図は同じ（一部の平面
図、第７図は第６ｔＩ！Ｊの■−■１［Ｋ沿う断面図、
第８ｖ７！Ｊは同じくゲートブレイク後の状馨を示す一
部の断ｌｆｔ１１１１である。
１・・・リードフレーム、２・・・タブ、４・・・リー
ド。
６・・・レジンパッケージ、７・・・ゲー）、８−・・
ダム、９・・・支持板、１０・・・クラック、１２・・
・ゲートランナ、１３・・・鋏片片０．．。
第 １ＴＩ！Ｊ
第 ２ 図
第 ４ 図
第 ６ 図
第 ７ 図
／ｌ
第 ８ 図FIG. 1 is a cross-sectional view showing a method for manufacturing a living body device, and FIG. 2 is a cross-sectional view showing a conventional method for manufacturing a living body device.
v! J, Figure 3 is the same (partial cross-sectional view, Figure 4 1ml ~
ICI is a cross-sectional view showing the defective break state S at the time of gate break, FIG. 5 is a plan view showing a method for manufacturing a biological body device according to an embodiment of the present invention, and FIG. , Fig. 7 is a cross-sectional view along ■-■1[K of 6th tI!J,
8th v7! Similarly, J is a partial fragment lft1111 showing the state after the gate break. 1...Lead frame, 2...Tab, 4...Lead. 6...Resin package, 7...Game), 8-...
Dam, 9... Support plate, 10... Crack, 12...
・Gate runner, 13... scissors piece 0. ．． . 1st TI! J Figure 2 Figure 4 Figure 6 Figure 7/l Figure 8
Claims (1)
トな介してレジンを流すことＫよってレジンモールドを
行なうことを特徴とする生部体装置の製造方法において
、あらかじめリードフレームのリード支持部分はゲート
と重ならないように途中で二股に別かれてゲートの両側
に沿って離れて延在するように形成しておき、その後、
レジンモールドを行なうことを特徴とする生部体装置の
製造方法。 ２、モールド抛のゲートに対面するリード支持部を有す
るリードフレームは、ゲートにリード支持部が富ならな
いように途中で二股に別かど、てゲートの両側に離れて
延在するように形成されていることを特徴とするリード
フレ・−ム。[Scope of Claims] 1. In a method for manufacturing a living body device, which is characterized in that resin molding is performed by flowing resin through a gate corresponding to a lead support portion # of a lead frame, The lead support portion is formed so as to be split into two parts midway so as not to overlap with the gate and extend apart along both sides of the gate, and then,
A method for manufacturing a living body device, characterized by performing resin molding. 2. The lead frame having the lead support portion facing the gate of the molding rod is formed so as to be bifurcated in the middle and extend apart on both sides of the gate so that the lead support portion does not become too thick at the gate. A lead frame characterized by:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4738382A JPS58165358A (en) | 1982-03-26 | 1982-03-26 | Manufacture of semiconductor device and lead frame used therefor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4738382A JPS58165358A (en) | 1982-03-26 | 1982-03-26 | Manufacture of semiconductor device and lead frame used therefor |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS58165358A true JPS58165358A (en) | 1983-09-30 |
| JPH0554264B2 JPH0554264B2 (en) | 1993-08-12 |
Family
ID=12773573
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4738382A Granted JPS58165358A (en) | 1982-03-26 | 1982-03-26 | Manufacture of semiconductor device and lead frame used therefor |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58165358A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100572393B1 (en) * | 1998-12-30 | 2006-08-30 | 삼성전자주식회사 | Printed Circuit Board for Ball Grid Array Package |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5521128A (en) * | 1978-08-02 | 1980-02-15 | Hitachi Ltd | Lead frame used for semiconductor device and its assembling |
| JPS57128148U (en) * | 1981-02-04 | 1982-08-10 |
-
1982
- 1982-03-26 JP JP4738382A patent/JPS58165358A/en active Granted
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5521128A (en) * | 1978-08-02 | 1980-02-15 | Hitachi Ltd | Lead frame used for semiconductor device and its assembling |
| JPS57128148U (en) * | 1981-02-04 | 1982-08-10 |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100572393B1 (en) * | 1998-12-30 | 2006-08-30 | 삼성전자주식회사 | Printed Circuit Board for Ball Grid Array Package |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0554264B2 (en) | 1993-08-12 |
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