JPS58164285A - Stem for semiconductor laser - Google Patents

Abstract

PURPOSE:To obtain a stem which has preferable heat dissipation by forming a lead wirings passing hole and a block engaging hole at a stem body and engaging the element holding block with the hole. CONSTITUTION:A lead wirings passing hole 21 and a block engaging hole 22 are opened at a stem body 20 made of glass sealing Fe alloy or Fe. The hole 22 is a semicircular through hole, engages a block 23 of preferable thermoconductive material such as Cu or the like, and is formed so that the body 20 and the lower surface are aligned in the same plane. Lead wirings are passed via a glass sealing material 25 through the hole 21, and secured simultaneously upon soldering of the block 23. According to this structure, even if it is treated at a high temperature, the thermal expansion difference between the seal 25 and the body 20 is small. Accordingly, the lead wirings can be effectively secured, and since the end face of the block 23 is contacted directly with a heat radiator, the heat dissipation can be largely improved.

Description

[Detailed description of the invention] The present invention relates to a stem for a semiconductor radar.

Conventionally, a stem for a semiconductor laser equipped with a semiconductor laser element is required to have excellent heat dissipation properties in order to improve the reliability of the element.

FIG. 1 shows an example of a conventional stem for semiconductor radar. 1 in the figure is a stem body made of iron-based alloy. For holding an element made of copper, etc. on the main body 1 of the main body 1! Lock 2 is attached. A 1st eyelid 1L through hole 3 is bored in the main body 2 of the main body 2, and the IJ
- The lead wire 5 is inserted into the through hole 1 of the lead wire 1 with the seal member 4 open. In the semiconductor radar stem unit constructed in this way, the flock 2 for holding the element is attached to the main body of the stem made of an alloy of iron and cotton thread, so the thermal conductivity is low and the heat dissipation properties are sufficient. There were weaknesses that could not be improved upon.

In addition, Figure 2 shows other f of the conventional semiconductor radar stem.
Reference numeral 10 in FIG. 6 indicates a stud made of copper or the like, which is provided at the bottom of the substantially cylindrical heat dissipation portion 10af. A lead 11 is inserted through the heat radiation @JOa, and the lead 11 is fixed to the stud 13 by a sealing member 12. An element holding device 14 consisting of a pot or the like is mounted on the IJ. Note that Job is an alloy plate to which a window-equipped cage is attached. The semiconductor laser stem Li configured in this way has excellent heat dissipation properties because the stud 10 is made of a material with high thermal conductivity such as steel, but when exposed to high temperatures, the heat dissipation WN
Since 10 & expands in the radial direction, there is a drawback that the lead 11 can separate from the stud 10.

If the thickness of the heat dissipating section 10m is increased, it is possible to prevent the lead wire 11 from coming off, but the lead wire 11 becomes larger and there is a gap. In addition, it requires 12 tons of alloy plate made of iron alloy for welding the cap with the glass window, which increases the price.

The present invention has been made in consideration of these points, and provides a stem for a solid semiconductor radar, which has excellent heat dissipation characteristics and has lead wires firmly attached to it.

Embodiments of the present invention will be described below with reference to the drawings.

Figure @3 is a perspective view of an embodiment of the present invention.

FIG. 4 is a front view of the same embodiment. In FIG. 1, 20 is a stem body made of iron or an iron alloy for glass sealing.
A lead wire through hole 21 and a plotter insertion hole 12 are bored in the stem body 2#. The professional fitting hole 22 is
It has a roughly semicircular shape and passes through the stem body JO1. A heat conductor such as a heat conductor for a pot, etc. is inserted into the fitting hole 22. Here, the shape of the block insertion hole 22 is as follows:
It is desirable to apply semicircular pressure in the # direction so that the exposed area of the element holding protrusion 21 to be inserted becomes large. The element holding block 23 is inserted into the heat dissipation unit 11 which is attached downward to the main body 2o of the main body 2o! (not shown) - The lower surface of the main body 2o and the element holding block 2J
It is desirable to lay the layer so that the end face of the lead 14 is flush with the end face of the lead 14, which will be described later. It is best to perform both steps at the same time.

A sealing member 25 made of glass or the like and a lead WM 24 are inserted into the lead through hole 21 and fixed thereto.

Therefore, the semiconductor Lede River stem L configured like this
In No. 1, the stem body 2o made of a glass-attached iron alloy is attached with the Lee-I'mJ4 through the seal member Elf, so that the seal member 24 and the stem body 20 remain intact even when subjected to heat treatment at ^-temperature. Lead heel 1 with small difference due to thermal expansion
4f can be reliably held in a solid state.

Furthermore, since the element holding block 2J can be brought into direct contact with a 70 mmt heat radiator, it has extremely high heat dissipation characteristics.

As a result, it is possible to increase the output and improve the reliability of the element mounted on the element holding block 23.

As explained above, the stem for a semiconductor radar according to the present invention has excellent heat dissipation characteristics and has the advantage of being firmly attached to the lead wire.

[Brief explanation of the drawing]

Figure 1 of the plane is a front view of a conventional semiconductor radar stem with a block attached to the fitting surface of the goo, Figure 2 of the kite is a cross-sectional view of a stud-type conventional stem for semiconductor radar, and Figure 3 of the kite is: A perspective view of an embodiment of the present invention, Figure I@4, is a view facing you of the embodiment. 20... Stem body, 11... Lead-through hole, 2
2...! Port, fitting hole, 2s...Element holding block, 24...Lead wire, 25...Sealing member, SO
...Stem for semiconductor radar. Applicant's agent FF31 Takehiko Suzue Figure 1 Figure 2j'lQ Prisoner Figure 3

Claims (1)

[Claims] Reed koji through hole, block insertion hole and force: The stem body is drilled and the stem for the buzzer for holding the L7t3E child is inserted into the block insertion hole so that the pain side tm is exposed.