JPS58164241U - Flat package type IC positioning device - Google Patents
Flat package type IC positioning deviceInfo
- Publication number
- JPS58164241U JPS58164241U JP5969982U JP5969982U JPS58164241U JP S58164241 U JPS58164241 U JP S58164241U JP 5969982 U JP5969982 U JP 5969982U JP 5969982 U JP5969982 U JP 5969982U JP S58164241 U JPS58164241 U JP S58164241U
- Authority
- JP
- Japan
- Prior art keywords
- flat package
- positioning device
- package type
- protrusion
- hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第1図は従来のプリント基板の断面図、第2図は、本考
案の一実施例のフラットパッケージ型ICの平面図と右
側面図と正面図、第3図はプリント基板取付時の正面図
、第4図は第3図のプリント基板の平面図、第5図は他
実施例のフラットパッケージ型ICの平面図と右側面図
と正面図、第6図は他実施例のプリント基板の平面図、
第7図は取付時の正面図である。
3・・・プリント基板、4・・・突起、5・・・フラッ
トパッケージ型IC0Figure 1 is a sectional view of a conventional printed circuit board, Figure 2 is a plan view, right side view, and front view of a flat package IC according to an embodiment of the present invention, and Figure 3 is a front view when the printed circuit board is installed. , FIG. 4 is a plan view of the printed circuit board of FIG. 3, FIG. 5 is a plan view, right side view, and front view of a flat package type IC of another embodiment, and FIG. 6 is a plan view of a printed circuit board of another embodiment. figure,
FIG. 7 is a front view when installed. 3... Printed circuit board, 4... Protrusion, 5... Flat package type IC0
Claims (1)
けると共にプリント基板に該突起が入る孔を設けたこと
を特徴とするフラットパッケージ型IC位置決め装置。 2 前記突起と該孔はそれぞれ1つからなり、前記突起
と前記孔の一致する点を軸として、該I’Cが回転可能
な実用新案登録請求の一範囲第1項記載のフラットパッ
ケージ型IC位置決め装置。 3 前記突起と前記孔はそれぞれ2つからなり、前記突
起と前記孔とを一致させる実用新案登録請求の範囲第1
項記載のフラットパッケージ型IC位置決め装置。[Claims for Utility Model Registration] 1. A flat package type IC positioning device, characterized in that a flat package type IC package is provided with a protrusion, and a printed circuit board is provided with a hole for receiving the protrusion. 2. The flat package IC according to claim 1, wherein the protrusion and the hole each consist of one, and the I'C is rotatable about a point where the protrusion and the hole coincide as an axis. Positioning device. 3 The protrusion and the hole each consist of two, and the utility model registration claim 1 in which the protrusion and the hole are aligned
The flat package type IC positioning device described in .
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5969982U JPS58164241U (en) | 1982-04-26 | 1982-04-26 | Flat package type IC positioning device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5969982U JPS58164241U (en) | 1982-04-26 | 1982-04-26 | Flat package type IC positioning device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS58164241U true JPS58164241U (en) | 1983-11-01 |
Family
ID=30069993
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP5969982U Pending JPS58164241U (en) | 1982-04-26 | 1982-04-26 | Flat package type IC positioning device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS58164241U (en) |
-
1982
- 1982-04-26 JP JP5969982U patent/JPS58164241U/en active Pending
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