JPS58164232U - ワイヤボンデイング装置 - Google Patents

ワイヤボンデイング装置

Info

Publication number
JPS58164232U
JPS58164232U JP1982060654U JP6065482U JPS58164232U JP S58164232 U JPS58164232 U JP S58164232U JP 1982060654 U JP1982060654 U JP 1982060654U JP 6065482 U JP6065482 U JP 6065482U JP S58164232 U JPS58164232 U JP S58164232U
Authority
JP
Japan
Prior art keywords
wire
wire bonding
bonding
bonding equipment
elastic body
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1982060654U
Other languages
English (en)
Japanese (ja)
Other versions
JPH019156Y2 (enExample
Inventor
山口　耕二
柳原　臣吾
白山　正海
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP1982060654U priority Critical patent/JPS58164232U/ja
Publication of JPS58164232U publication Critical patent/JPS58164232U/ja
Application granted granted Critical
Publication of JPH019156Y2 publication Critical patent/JPH019156Y2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W72/07141—
    • H10W72/07502—
    • H10W72/07521—
    • H10W72/536—
    • H10W72/5363—

Landscapes

  • Wire Bonding (AREA)
JP1982060654U 1982-04-26 1982-04-26 ワイヤボンデイング装置 Granted JPS58164232U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1982060654U JPS58164232U (ja) 1982-04-26 1982-04-26 ワイヤボンデイング装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1982060654U JPS58164232U (ja) 1982-04-26 1982-04-26 ワイヤボンデイング装置

Publications (2)

Publication Number Publication Date
JPS58164232U true JPS58164232U (ja) 1983-11-01
JPH019156Y2 JPH019156Y2 (enExample) 1989-03-13

Family

ID=30070889

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1982060654U Granted JPS58164232U (ja) 1982-04-26 1982-04-26 ワイヤボンデイング装置

Country Status (1)

Country Link
JP (1) JPS58164232U (enExample)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5326667A (en) * 1976-08-25 1978-03-11 Hitachi Ltd Clamp chip of wire bonder
JPS567443A (en) * 1979-06-29 1981-01-26 Hitachi Ltd Wire bonder
JPS58130541A (ja) * 1982-01-29 1983-08-04 Toshiba Corp ワイヤボンデイング装置

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5326667A (en) * 1976-08-25 1978-03-11 Hitachi Ltd Clamp chip of wire bonder
JPS567443A (en) * 1979-06-29 1981-01-26 Hitachi Ltd Wire bonder
JPS58130541A (ja) * 1982-01-29 1983-08-04 Toshiba Corp ワイヤボンデイング装置

Also Published As

Publication number Publication date
JPH019156Y2 (enExample) 1989-03-13

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