JPS58164232U - ワイヤボンデイング装置 - Google Patents

ワイヤボンデイング装置

Info

Publication number
JPS58164232U
JPS58164232U JP6065482U JP6065482U JPS58164232U JP S58164232 U JPS58164232 U JP S58164232U JP 6065482 U JP6065482 U JP 6065482U JP 6065482 U JP6065482 U JP 6065482U JP S58164232 U JPS58164232 U JP S58164232U
Authority
JP
Japan
Prior art keywords
wire
wire bonding
bonding
bonding equipment
elastic body
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP6065482U
Other languages
English (en)
Japanese (ja)
Other versions
JPH019156Y2 (enrdf_load_stackoverflow
Inventor
山口　耕二
柳原　臣吾
白山　正海
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP6065482U priority Critical patent/JPS58164232U/ja
Publication of JPS58164232U publication Critical patent/JPS58164232U/ja
Application granted granted Critical
Publication of JPH019156Y2 publication Critical patent/JPH019156Y2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78301—Capillary
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/851—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector the connector being supplied to the parts to be connected in the bonding apparatus
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/8512—Aligning
    • H01L2224/85148—Aligning involving movement of a part of the bonding apparatus
    • H01L2224/85169—Aligning involving movement of a part of the bonding apparatus being the upper part of the bonding apparatus, i.e. bonding head, e.g. capillary or wedge
    • H01L2224/8518—Translational movements
    • H01L2224/85181—Translational movements connecting first on the semiconductor or solid-state body, i.e. on-chip, regular stitch

Landscapes

  • Wire Bonding (AREA)
JP6065482U 1982-04-26 1982-04-26 ワイヤボンデイング装置 Granted JPS58164232U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6065482U JPS58164232U (ja) 1982-04-26 1982-04-26 ワイヤボンデイング装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6065482U JPS58164232U (ja) 1982-04-26 1982-04-26 ワイヤボンデイング装置

Publications (2)

Publication Number Publication Date
JPS58164232U true JPS58164232U (ja) 1983-11-01
JPH019156Y2 JPH019156Y2 (enrdf_load_stackoverflow) 1989-03-13

Family

ID=30070889

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6065482U Granted JPS58164232U (ja) 1982-04-26 1982-04-26 ワイヤボンデイング装置

Country Status (1)

Country Link
JP (1) JPS58164232U (enrdf_load_stackoverflow)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5326667A (en) * 1976-08-25 1978-03-11 Hitachi Ltd Clamp chip of wire bonder
JPS567443A (en) * 1979-06-29 1981-01-26 Hitachi Ltd Wire bonder
JPS58130541A (ja) * 1982-01-29 1983-08-04 Toshiba Corp ワイヤボンデイング装置

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5326667A (en) * 1976-08-25 1978-03-11 Hitachi Ltd Clamp chip of wire bonder
JPS567443A (en) * 1979-06-29 1981-01-26 Hitachi Ltd Wire bonder
JPS58130541A (ja) * 1982-01-29 1983-08-04 Toshiba Corp ワイヤボンデイング装置

Also Published As

Publication number Publication date
JPH019156Y2 (enrdf_load_stackoverflow) 1989-03-13

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