JPS58157804A - Casting resin composition - Google Patents

Casting resin composition

Info

Publication number
JPS58157804A
JPS58157804A JP4132082A JP4132082A JPS58157804A JP S58157804 A JPS58157804 A JP S58157804A JP 4132082 A JP4132082 A JP 4132082A JP 4132082 A JP4132082 A JP 4132082A JP S58157804 A JPS58157804 A JP S58157804A
Authority
JP
Japan
Prior art keywords
filler
resin composition
inorganic filler
casting resin
amount
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP4132082A
Other languages
Japanese (ja)
Inventor
Noriyuki Kawamura
河村 憲行
Yoshinobu Yamagiwa
山際 義信
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Chemical Products Co Ltd
Kyocera Chemical Corp
Original Assignee
Toshiba Chemical Products Co Ltd
Toshiba Chemical Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Chemical Products Co Ltd, Toshiba Chemical Corp filed Critical Toshiba Chemical Products Co Ltd
Priority to JP4132082A priority Critical patent/JPS58157804A/en
Publication of JPS58157804A publication Critical patent/JPS58157804A/en
Pending legal-status Critical Current

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  • Compositions Of Macromolecular Compounds (AREA)
  • Other Resins Obtained By Reactions Not Involving Carbon-To-Carbon Unsaturated Bonds (AREA)
  • Epoxy Resins (AREA)
  • Macromonomer-Based Addition Polymer (AREA)

Abstract

PURPOSE:To prepare the titled composition having excellent impregnation property into coil, etc., and high filler content, and giving a cured product having high strength, by compounding a casting resin with a large amount of spherical inorganic filler powder. CONSTITUTION:A casting resin (e.g. bisphenol-type liquid epoxy resin) is compounded with spherical inorganic filler powder (e.g. glass beads). The amount of the inorganic filler is >=50vol% of the whole fillers.

Description

【発明の詳細な説明】 本発明はコイル等への含浸性に優れた注型用樹脂組成物
に関する。
DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a casting resin composition that has excellent impregnation properties into coils and the like.

一般に(1)コストの低減、(り収縮率および熱膨張率
の改善、(3)硬化の際の発熱量の低下、および(4)
熱伝導率の向上等を目的として注型用樹脂、例えばエポ
キシ樹脂に無機質の充填剤を配合することが行なわれて
いる。
In general, (1) cost reduction, improvement in shrinkage and thermal expansion coefficients, (3) reduction in heat generation during curing, and (4)
BACKGROUND ART For the purpose of improving thermal conductivity, inorganic fillers are blended into casting resins, such as epoxy resins.

上記の効果は無機質充填剤の配合量が多くなるほど顕著
にあられれてくるが、充填剤を多量に配合した組成物に
おいては、近年法のような点が問題になつてきている。
The above-mentioned effects become more pronounced as the amount of inorganic filler added increases, but in recent years, compositions containing a large amount of filler have become problematic in recent years.

すなわち、近年、極細線コイルや層間紙を用いた点火コ
イルなどに上記高充填エポキシ樹脂組成物を含浸させ注
型することが行なわれているが、この場合充填剤の添加
により組成物全体の含浸性が低下してしまい、特性の良
好な注型品が得られないという欠点があった。
That is, in recent years, ultrafine wire coils and ignition coils using interlayer paper have been impregnated with the above-mentioned highly filled epoxy resin composition and cast. This had the drawback that the properties of the cast product deteriorated, making it impossible to obtain a cast product with good properties.

本発明者らはこのような問題を解決すべく鋭意研究を重
ねた結果、粒子形状が球状の粉末無機充填剤を多量に配
合することにより、含浸性に優れ硬化物の強度が高い注
型用樹脂組成物が得られる棒養〜の無機充填剤を配合し
た組成物におい【、粒子形状が球状の粉末充填剤を充填
剤全体の少なくとも50体積%配合して成ることを特徴
とする注型用樹脂組成物に関する。
The inventors of the present invention have conducted extensive research to solve these problems, and have found that by blending a large amount of powdered inorganic filler with spherical particle shapes, a castable material with excellent impregnation properties and high strength of the cured product has been developed. In a composition containing an inorganic filler from which a resin composition is obtained, a powder filler having a spherical particle shape is blended in an amount of at least 50% by volume of the total filler. The present invention relates to a resin composition.

本発明に用いる注型用樹脂としては、ビスフェノール型
その他Φ公知の液状エポキシ樹脂や不飽和ポリエステル
樹脂がある。これらの注型用樹脂には、アミン系或いは
酸無水物系あるいは過酸化物からなる硬化剤を配合して
用いるが、これらの硬化剤と共に硬化促進剤を併用する
こともできる。
The casting resin used in the present invention includes bisphenol type and other known liquid epoxy resins and unsaturated polyester resins. These casting resins are used in combination with a curing agent consisting of an amine type, an acid anhydride type, or a peroxide, but a curing accelerator can also be used together with these curing agents.

またこの場合充填剤をできるだけ多量に配合しかつ作業
性を低下させないためには、予め硬化剤系にも充填剤を
配合しておき、これを充填剤を配合した注型用樹脂組成
物に添加して混合するのが望ましい。
In this case, in order to blend as much filler as possible without reducing workability, filler should be blended in the curing agent system in advance, and this should be added to the casting resin composition containing filler. It is preferable to mix it.

本発明に用いる粒子形状が球状の粉末無機充填剤として
は、例えばガラスピーズがある。
Examples of the powdered inorganic filler having a spherical particle shape used in the present invention include glass peas.

而して第1表に示すように、ガラスピーズの粒径が大き
くなっても硬化物のクリープ破断強度は殆んど変化しな
いので、他の物性とのかねあいで例えば70〜500声
のような広範囲の粒径のものを用いることができる。
As shown in Table 1, even if the particle size of the glass beads increases, the creep rupture strength of the cured product hardly changes. A wide range of particle sizes can be used.

これに対し、粒子形状が球状でない破砕シリカ粉末の場
合には、粒子径が大きくなるとこれを充填した組成物か
ら得られる硬化物の強度が急激に低下してしまう。
On the other hand, in the case of crushed silica powder whose particle shape is not spherical, as the particle size increases, the strength of a cured product obtained from a composition filled with the crushed silica powder sharply decreases.

第  1  表 (表の充填剤を38体積%配合したエポキシ樹脂組成物
から得られる硬化物の引張りクリープ破断強度、65℃
、 500 Ky’cd )またガラスピーズのような
球状粉末の場合には、球状でない粉末充填剤に比べ−c
s加による増粘効果が小さく、従つて作業性等をあまり
低下させることなく多量に配合することができる。
Table 1 (Tensile creep rupture strength of cured product obtained from an epoxy resin composition containing 38% by volume of the filler shown in the table, 65°C)
, 500 Ky'cd) Also, in the case of spherical powders such as glass beads, -c
The thickening effect caused by adding s is small, and therefore a large amount can be blended without significantly reducing workability.

本発明においては、このような球状の粉末充填剤を充填
剤全体の少なくとも50体積%配合するが、配合量をこ
のように限定したのは次の理由による。
In the present invention, such a spherical powder filler is blended in an amount of at least 50% by volume of the total filler, but the blending amount is limited in this way for the following reason.

すなわち球状の充填剤の配合量が充填剤全体のSO体積
%未滴の場合には、従来のものに比べて含浸性の向上等
の効果がみられず、得られる組成物が本発明の目的に適
合しないためである。
In other words, when the amount of the spherical filler added is less than the SO volume % of the entire filler, no effect such as improvement in impregnating properties is observed compared to conventional ones, and the resulting composition is not the object of the present invention. This is because it does not match.

尚、本発明において、球状の粉末充填剤を配合した場合
には、組成物が含浸硬化する際の充填剤の沈降が大きく
特に粒子径が大になるほどこの傾向が大となるが、これ
を防止するために粒径の小さい充填剤を併用するか、或
いは疎水性微粉末シリカ(構造式(CH2−110s7
@ )m )を少量添加することが望ましい。
In addition, in the present invention, when a spherical powder filler is blended, the sedimentation of the filler when the composition is impregnated and hardened is large, and this tendency becomes greater as the particle size becomes larger, but this can be prevented. To achieve this, a filler with a small particle size is used, or hydrophobic fine powder silica (structural formula (CH2-110s7)
It is desirable to add a small amount of @)m).

以上の説明においては、エポキシ樹脂を主体とする組成
物における球状の粉末充填剤配合の効果について述べた
が、多量の充填剤を配合して用いる不飽和ポリエステル
樹脂等に対しても同様な効果が期待できるのは勿論であ
る。
In the above explanation, we have discussed the effect of blending spherical powder fillers in compositions mainly composed of epoxy resins, but the same effect can also be achieved with unsaturated polyester resins, etc., which are blended with large amounts of fillers. Of course, we can expect it.

次に本発明の実施例について記載する。Next, examples of the present invention will be described.

実施例1〜2 平均粒径30μのガラスピーズな25体積%および35
体積%C劃合で、エポキシ当量199のビスフェノール
型液状エポキシ樹脂(酸無水物系硬化剤入り)に配合し
てエポキシ樹脂組成物を調製した。
Examples 1-2 25% by volume and 35% glass beads with an average particle size of 30μ
An epoxy resin composition was prepared by blending the mixture into a bisphenol-type liquid epoxy resin (containing an acid anhydride curing agent) having an epoxy equivalent of 199 in volume %C.

また比較のために湿式法で得られた平均粒径7.6μの
破片状シリカを、第2表に示す割合で同様に配合しエポ
キシ樹脂組成物を調製した。
For comparison, epoxy resin compositions were prepared by blending fragmented silica having an average particle size of 7.6 μm obtained by a wet method in the same manner as shown in Table 2.

これらの樹脂組成物について含浸性試験を行なった結果
を第2表に示す。
Table 2 shows the results of an impregnation test conducted on these resin compositions.

含浸性試験は、予め試験管中に平均粒径65μのガラス
ピーズな入れておき、これに上記組成物をそれぞれ真空
注入して所定温度で硬化させ、樹脂組成物がガラスピー
ズ層中に浸透した含浸層の長さを測定することにより行
なった。
In the impregnation test, glass beads with an average particle size of 65 μm were placed in a test tube in advance, and each of the above compositions was vacuum injected into the tubes and cured at a predetermined temperature, so that the resin composition penetrated into the glass beads layer. This was done by measuring the length of the impregnated layer.

以下余白 第  2  表 実施例3〜5 エポキシ当量190のビスフェノール型妓状エボキV樹
脂にガラスピーズ、シリカおよび他の添加剤を第3表に
示す割合で配合してなる組成物につ、いて前述の方法で
含浸性を試験した。またこれらの組成物から得られる硬
化物の熱膨張係数を公知の方法で測定した。結果を第3
表に示す。
The following is a blank space in Table 2. Examples 3 to 5 The compositions prepared by blending glass beads, silica, and other additives in the proportions shown in Table 3 with bisphenol-type epoxy V resin having an epoxy equivalent of 190 are described above. The impregnability was tested using the method described below. Furthermore, the thermal expansion coefficients of cured products obtained from these compositions were measured by a known method. 3rd result
Shown in the table.

以下余白 第  3  表 (表中上欄の数値は体積%を示す。) 以上の実施例からも明らかなように、本発明の組成物は
多量の無機充填剤が配合されており、硬化物の熱膨張率
が低く機械的強度が高いという利点がある。また含浸性
にも優れてtするので、コイル等への含浸注型用組成物
として好適して%11る。
Table 3 with blank space below (The numbers in the upper column of the table indicate volume %.) As is clear from the above examples, the composition of the present invention contains a large amount of inorganic filler, and the cured product It has the advantages of a low coefficient of thermal expansion and high mechanical strength. It also has excellent impregnating properties, making it suitable as a composition for impregnating and casting coils and the like.

代理人弁理士 須 山 佐 −Representative Patent Attorney Su Yamasa -

Claims (1)

【特許請求の範囲】 注型用樹脂に多量の無機 充填剤を配合してなる高充填組成物において、粒子形状
が球状の粉末充填剤を充填剤全体の少なくとも50体積
%配合して成ることを特徴とする注型用樹脂組成物。
[Scope of Claims] In a highly filled composition formed by blending a large amount of inorganic filler with a casting resin, it is claimed that a powder filler having a spherical particle shape is blended in an amount of at least 50% by volume of the total filler. Characteristic resin composition for casting.
JP4132082A 1982-03-16 1982-03-16 Casting resin composition Pending JPS58157804A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4132082A JPS58157804A (en) 1982-03-16 1982-03-16 Casting resin composition

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4132082A JPS58157804A (en) 1982-03-16 1982-03-16 Casting resin composition

Publications (1)

Publication Number Publication Date
JPS58157804A true JPS58157804A (en) 1983-09-20

Family

ID=12605218

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4132082A Pending JPS58157804A (en) 1982-03-16 1982-03-16 Casting resin composition

Country Status (1)

Country Link
JP (1) JPS58157804A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60133035A (en) * 1983-11-24 1985-07-16 グラヴルベル Composition blended with glass bead and manufacture
JPS61296020A (en) * 1985-06-26 1986-12-26 Toshiba Corp Epoxy resin liquid composition for sealing electronic part
US5110857A (en) * 1984-12-18 1992-05-05 Aisin Seiki Kabushiki Kaisha Ultravioletsetting resin composition

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS49110734A (en) * 1973-02-24 1974-10-22
JPS56129253A (en) * 1980-02-21 1981-10-09 Ciba Geigy Ag Mixture containing filler suspended therein
JPS56136838A (en) * 1980-03-31 1981-10-26 Dainippon Ink & Chem Inc Thermoplastic polyester resin composition

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS49110734A (en) * 1973-02-24 1974-10-22
JPS56129253A (en) * 1980-02-21 1981-10-09 Ciba Geigy Ag Mixture containing filler suspended therein
JPS56136838A (en) * 1980-03-31 1981-10-26 Dainippon Ink & Chem Inc Thermoplastic polyester resin composition

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60133035A (en) * 1983-11-24 1985-07-16 グラヴルベル Composition blended with glass bead and manufacture
JPH0469655B2 (en) * 1983-11-24 1992-11-06 Glaverbel
US5110857A (en) * 1984-12-18 1992-05-05 Aisin Seiki Kabushiki Kaisha Ultravioletsetting resin composition
JPS61296020A (en) * 1985-06-26 1986-12-26 Toshiba Corp Epoxy resin liquid composition for sealing electronic part

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