JPS58155779A - Photo coupler and its manufacture - Google Patents
Photo coupler and its manufactureInfo
- Publication number
- JPS58155779A JPS58155779A JP57038945A JP3894582A JPS58155779A JP S58155779 A JPS58155779 A JP S58155779A JP 57038945 A JP57038945 A JP 57038945A JP 3894582 A JP3894582 A JP 3894582A JP S58155779 A JPS58155779 A JP S58155779A
- Authority
- JP
- Japan
- Prior art keywords
- light
- emitting element
- receiving element
- led4
- lead frame
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 8
- 229920003002 synthetic resin Polymers 0.000 claims abstract description 12
- 239000000057 synthetic resin Substances 0.000 claims abstract description 12
- 238000000034 method Methods 0.000 claims abstract description 3
- 239000002131 composite material Substances 0.000 claims 1
- 238000000465 moulding Methods 0.000 abstract description 4
- 238000007796 conventional method Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000002310 reflectometry Methods 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/12—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof structurally associated with, e.g. formed in or on a common substrate with, one or more electric light sources, e.g. electroluminescent light sources, and electrically or optically coupled thereto
- H01L31/16—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof structurally associated with, e.g. formed in or on a common substrate with, one or more electric light sources, e.g. electroluminescent light sources, and electrically or optically coupled thereto the semiconductor device sensitive to radiation being controlled by the light source or sources
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Electromagnetism (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Photo Coupler, Interrupter, Optical-To-Optical Conversion Devices (AREA)
Abstract
Description
【発明の詳細な説明】
この発明は、ホトカプラー及びその製造方法に関４るｂ
のである。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a photocoupler and a method for producing the same.
It is.
従来のホトカプラーは、例えば第１図に示すよ゛）ｋ、
リードル−ムａの先端部に発光素子わが取ＦｊＧＪられ
、他方のリードフレームＣには受光系ｆｄが取付けられ
、これら発光素子すと受光素ｒｄとが向き合せの状態で
透明の合成樹脂ｅ（−土−ルドされ、さらに外装用の合
成樹脂ｒ′Ｃ″Ｅ−ルドされた構造となっている。この
場合、ホトカプラーの製造工程において、リードル−ム
ａ、Ｃは別体であるため、透明の合成樹ｖ＃ｅ−（−ｔ
−ルドする際に、前記のように発光糸ｆｂと受光素子ｄ
とを向き合せて位置決めする作業が厄介であり、またこ
れらを対向させたときに通電用のワイヤ（図示せず）が
短絡したｔ）、ｃｊｌいは切れたりする等の不都合が発
生する。Conventional photocouplers include, for example, as shown in FIG.
A light emitting element FjGJ is attached to the tip of the lead frame a, and a light receiving system fd is attached to the other lead frame C. With these light emitting elements and the light receiving element rd facing each other, a transparent synthetic resin e ( It has a structure in which the lead lumes a and C are separated from each other in the photocoupler manufacturing process, so the lead lumes a and C are transparent. The synthetic tree v#e-(-t
- When holding the light-emitting thread fb and the light-receiving element d as described above,
It is troublesome to position them so that they face each other, and when these are placed facing each other, problems such as short-circuiting of current-carrying wires (not shown), breakage, etc. occur.
本発明は、−１−記のような従来の不都合を解消する目
的でなされたものであり、発光素子側のリードフレーム
と受光素子側のリードフレームは枠状に一体成形されて
おり、画素子は同一平面内に位置するようになし、かつ
これらをモールドする合成樹脂にプリズム状の反射面を
形成し、発光素子の光線を全反射させて発光素子に導光
するようにしたホトカプラー及びその製造方法を要旨と
するものである。The present invention has been made to solve the conventional disadvantages as described in -1-, and the lead frame on the light emitting element side and the lead frame on the light receiving element side are integrally molded into a frame shape, and the pixel element A photocoupler in which the light beams of the light emitting element are completely reflected and guided to the light emitting element by forming a prism-shaped reflective surface on the synthetic resin molded with the two so that they are located in the same plane, and the production thereof. The gist is the method.
以下、本発明の一実施例を示す図面に基づいて説明する
と、１は枠状に形成されたリードフレームであり、その
対向辺１ａ、１ｂに一対の張出ハ２ａ、２ｂ、３ａ１３
ｂがそれぞれ中央に向けて連設されている。４は発光素
子であり、前記張出片２ａの先端部に＠看すると共に、
ワイヤ５で他方の張出片２ｂの先端部に結線しである。Hereinafter, an embodiment of the present invention will be described based on the drawings. Reference numeral 1 denotes a lead frame formed in a frame shape, and a pair of overhangs 2a, 2b, 3a13 are formed on opposite sides 1a, 1b.
b are arranged in series toward the center. 4 is a light emitting element, which is located at the tip of the overhang piece 2a, and
A wire 5 is connected to the tip of the other overhanging piece 2b.
６は受光素子であって、発光素子４に対応させて張出片
３ａの先端部に装着し、張出片３ｂの先端部とワイヤ７
で接続しである。８は発光素子４及び受光素子６をモー
ルドした透光性の合成樹脂体であり、反射面８ａ、８ｂ
を有しＣおし〕、図に示すように発光素子４からの光Ｉ
４ｄを全投射して受光索子６に導けるようにしである。Reference numeral 6 denotes a light receiving element, which is attached to the tip of the overhanging piece 3a in correspondence with the light emitting element 4, and is connected to the tip of the overhanging piece 3b and the wire 7.
It is connected with. 8 is a transparent synthetic resin body in which a light emitting element 4 and a light receiving element 6 are molded, and reflective surfaces 8a and 8b are formed.
As shown in the figure, the light I from the light emitting element 4 is
4d can be fully projected and guided to the light receiving cable 6.
、（の合成樹脂体８は、リードフレーム１０灼向辺１ａ
、１ｂ及びこれら対向辺を連結し゛（いる側辺１Ｃ１１
ｄにいずれも跨らないよう５１〕’（あり、このモール
ド成形後に各辺の中央部Ａ、１３、Ｃ１］）を破線で示
すようにそれぞれ切り離してホトカプラーを形成するこ
とができる１、９は外装用の合成樹脂であり、従来と同
様に合成樹脂体８の全体を被覆４るようにして所定形状
にＬ−ルドされている。なお、発光素子と１ノ（赤外発
光ダイオードが用いられた場合には、前記合成樹脂体は
可視光カットの樹脂でモールドすることができる。また
、前記合成樹脂体の−ｌリズム状反射面の表面（外面）
に高反射率の材１１を二１−ティングするか又はモール
ドするよ・）にしても食い。, (synthetic resin body 8 of lead frame 10 has opposite side 1a
, 1b and these opposing sides are connected (side 1C11
The photocouplers 1 and 9 can be formed by separating the 51]' (present, central portions A, 13, C1 of each side after this molding) as shown by broken lines so as not to straddle any of the parts d. It is a synthetic resin for exterior use, and is rolled into a predetermined shape so that the entire synthetic resin body 8 is coated 4 as in the conventional case. Note that when an infrared light emitting diode is used as a light emitting element, the synthetic resin body can be molded with a resin that cuts visible light. surface (outer surface)
Even if the material 11 with high reflectivity is coated or molded, it will not work.
以１説明したように、本発明によれば予めり一ドル−ム
が一体化構造であるから、従来のように合成樹脂のモー
ルド時に発光素子と受光素子との位置決めをするや要が
なく、製造作業がきわめてしやすく、かつ位置ずれが生
じないので歩留りが向上すると共に品質の向上を図るこ
とができる。また、発光素子と受光素子とが同一平面内
に位置する構造であるから、モールド時にワイヤ同志が
短絡することがなく、ワイヤの断線も未然に防止するこ
とができる。さらに、本発明の場合には、枠状を９する
リードフレームを一定間隔をあけて多数並設すれば、発
光ｊＫｆ及び受光索子の装着作業並びにワイヤボンディ
ング作業等を連続的に能率良く行なうことができ生産能
率を向上させる効果もある。As explained above, according to the present invention, since the dome has an integrated structure in advance, there is no need to position the light emitting element and the light receiving element during molding of synthetic resin as in the conventional method. Manufacturing work is extremely easy, and since positional deviations do not occur, yield and quality can be improved. Further, since the light emitting element and the light receiving element are located in the same plane, the wires will not be short-circuited during molding, and wire breakage can be prevented. Furthermore, in the case of the present invention, by arranging a large number of frame-shaped lead frames in parallel at regular intervals, the mounting work of the light emitting jKf and light receiving cables, the wire bonding work, etc. can be carried out continuously and efficiently. This also has the effect of improving production efficiency.
第１図は従来のホトカプラーの要部の断面図第２図は本
発明の一実施例であって、リードフレームに素子を装着
した状態の平面図、第３図はホトカプラーの要部の断面
図である。
１・・・・・・リードフレーム、
１ａ、１ｂ・・・・・・対向辺、
２ａ 、 ２ｂ 、 ３ａ 、 ３ｂ −−・−・張出
片、４・・・・・・発光素子、
；）・・・・・・リイ１７．
６・・・・・・受光素子、
７・・・・・・ワイ１７．
８・・・・・・合成樹脂体、
８ａ、８ｂ・・・・・・反射面、
９・・・・・・外装用合成樹脂。
特１１出願人
スタンレ〜電気株式会利
第１図
第２図
第３図Figure 1 is a sectional view of the main parts of a conventional photocoupler. Figure 2 is an embodiment of the present invention, and is a plan view of the element mounted on the lead frame. Figure 3 is a sectional view of the main parts of the photocoupler. It is. 1... Lead frame, 1a, 1b... Opposing sides, 2a, 2b, 3a, 3b --- Overhang piece, 4... Light emitting element, ;)・・・・・・Lii 17. 6... Light receiving element, 7... Y17. 8...Synthetic resin body, 8a, 8b...Reflective surface, 9...Synthetic resin for exterior. Special 11 Applicant Stanley ~ Electric Co., Ltd. Figure 1 Figure 2 Figure 3
Claims (2)
端に発光素子と受光素子とがそれぞれ取付けられ、これ
らをモールドした合成機能体が前記発光素子からの光線
を受光素子に導く反射面を備えたことを特徴とするホト
カプラー。(1) A light-emitting element and a light-receiving element are each attached to the tip of a lead frame that is arranged facing each other in the same plane, and a composite functional body in which these are molded has a reflective surface that guides the light rays from the light-emitting element to the light-receiving element. A photocoupler characterized by:
れ中央に向けて連設された平面状のリードフレームにお
ける前記一方の張出片の先端部には発光素子を装着する
と共にワイヤボンディングし、他方の張出片の先端部に
は発光素子と対応させて受光素子を装着すると共にワイ
ヤボンディングし、これら発光素子及び受光素子を包含
し、かつ発光素子からの光線が受光素子に導かれる反射
面を備えたプリズム状の合成樹脂モールドを形成し、こ
の後前記枠状リードフレーへの各辺の中火部をそれぞれ
切り離すことを特徴とりるホトカプラーの製造方法。(2) A light-emitting element is attached to the tip of one of the planar lead frames in which a frame shape is cut and a pair of overhang pieces are arranged in series toward the center on opposite sides thereof. A light-receiving element is attached to the tip of the other overhang piece in correspondence with the light-emitting element, and is wire-bonded to the tip of the other overhang, so that the light-emitting element and the light-receiving element are included, and the light beam from the light-emitting element is connected to the light-receiving element. 1. A method for manufacturing a photocoupler, which comprises forming a prismatic synthetic resin mold having a reflective surface that is guided by the lead frame, and then cutting off medium heat portions on each side of the frame-shaped lead frame.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57038945A JPS58155779A (en) | 1982-03-12 | 1982-03-12 | Photo coupler and its manufacture |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57038945A JPS58155779A (en) | 1982-03-12 | 1982-03-12 | Photo coupler and its manufacture |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS58155779A true JPS58155779A (en) | 1983-09-16 |
Family
ID=12539347
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP57038945A Pending JPS58155779A (en) | 1982-03-12 | 1982-03-12 | Photo coupler and its manufacture |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58155779A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102006042806A1 (en) * | 2006-09-08 | 2008-03-27 | Endress + Hauser Flowtec Ag | Opto-electronic device |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5320874B1 (en) * | 1968-07-15 | 1978-06-29 |
-
1982
- 1982-03-12 JP JP57038945A patent/JPS58155779A/en active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5320874B1 (en) * | 1968-07-15 | 1978-06-29 |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102006042806A1 (en) * | 2006-09-08 | 2008-03-27 | Endress + Hauser Flowtec Ag | Opto-electronic device |
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