JPS58155172U - solid-state imaging device - Google Patents

solid-state imaging device

Info

Publication number
JPS58155172U
JPS58155172U JP5062282U JP5062282U JPS58155172U JP S58155172 U JPS58155172 U JP S58155172U JP 5062282 U JP5062282 U JP 5062282U JP 5062282 U JP5062282 U JP 5062282U JP S58155172 U JPS58155172 U JP S58155172U
Authority
JP
Japan
Prior art keywords
solid
imaging device
state imaging
image sensor
state
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP5062282U
Other languages
Japanese (ja)
Inventor
名雲　文男
秋山　克彦
Original Assignee
ソニー株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ソニー株式会社 filed Critical ソニー株式会社
Priority to JP5062282U priority Critical patent/JPS58155172U/en
Publication of JPS58155172U publication Critical patent/JPS58155172U/en
Pending legal-status Critical Current

Links

Landscapes

  • Transforming Light Signals Into Electric Signals (AREA)
  • Solid State Image Pick-Up Elements (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は従来の固体撮像装置における固体イメージセン
サの実装状態を説明するための模式的な構成図である。 第２図は本考案に係る固体撮像装置の一実施例を示す模
式的な構成図である。第３図は本考案に係る固体撮像装
置の他の実施例を示す要部断面図である。 ３０．３（１’・・・・・・固体イメージセンサ、３１
゜３１′・・・・・・センサチップ、３２．　３２’・
・・・・・パッケージ、４１．４１’・・・・・・チッ
プ部品化した回路素子、４５・・・・・・メモリ、５０
．５０’・・・・・・取付基板、５１・・・・・・同期
信号発生器、５２・・・・・・タイミングジェネレータ
、５３・・・・・・駆動回路。FIG. 1 is a schematic configuration diagram for explaining the mounting state of a solid-state image sensor in a conventional solid-state imaging device. FIG. 2 is a schematic configuration diagram showing an embodiment of the solid-state imaging device according to the present invention. FIG. 3 is a sectional view of main parts showing another embodiment of the solid-state imaging device according to the present invention. 30.3 (1'...solid image sensor, 31
゜31'...Sensor chip, 32. 32'・
...Package, 41.41'...Circuit element made into chip component, 45...Memory, 50
．． 50'... Mounting board, 51... Synchronous signal generator, 52... Timing generator, 53... Drive circuit.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 固体イメージセンサデツプを設けたパッケージの裏面に
、センサ周辺回路を成すチップ部品化した回路素子をマ
ウントしたことを特徴とする固体撮像装置。A solid-state imaging device characterized in that a circuit element made into a chip component forming a sensor peripheral circuit is mounted on the back side of a package provided with a solid-state image sensor depth.
JP5062282U 1982-04-09 1982-04-09 solid-state imaging device Pending JPS58155172U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5062282U JPS58155172U (en) 1982-04-09 1982-04-09 solid-state imaging device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5062282U JPS58155172U (en) 1982-04-09 1982-04-09 solid-state imaging device

Publications (1)

Publication Number Publication Date
JPS58155172U true JPS58155172U (en) 1983-10-17

Family

ID=30061407

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5062282U Pending JPS58155172U (en) 1982-04-09 1982-04-09 solid-state imaging device

Country Status (1)

Country Link
JP (1) JPS58155172U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60208726A (en) * 1984-04-02 1985-10-21 ウエルチ・アリン・インコ−ポレ−テツド Image sensor assembly

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60208726A (en) * 1984-04-02 1985-10-21 ウエルチ・アリン・インコ−ポレ−テツド Image sensor assembly

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