JPS58155164A - Lapping type cutting method employing reciprocal steel strap - Google Patents

Abstract

PURPOSE:To machine the work of even a large diameter at a high efficiency by by lapping out thereof tilting it oscillated on a shaft vertical to a steel strap. CONSTITUTION:A pluraity of steel straps 1 are arranged on a work 2 in the cuting direction thereof. A diamond powder suspension 5 is poured from the top of the steel straps 1 reciprocating them lengthwise. Here, an upward feed pressure is applied to the work 2 to match the grinding speed while the steel straps 1 are interlocked with a support base 3 through an oscillating rod 10 and a connecting rod 11 whereby the work 2 is oscillated on an oscillation shaft 6.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method for cutting high-hardness workpieces or workpieces by lapping using a reciprocating steel strip and loose 11i abrasive grains.

This type of cutting method is widely used to cut high-purity silicon, ceramics, etc. to produce semiconductors. Cutting and rounding is the only method available at the current state of the art. In addition to this cutting method, there is also a method of cutting sea urchin materials using an internally rotating grindstone, but it is difficult to cut large diameter materials, and the cut end is thick, which reduces the yield of the processed material. Because of the poor condition, it is not economically possible to perform nose sampling.

FIG. 1 is a perspective view schematically showing the conventional 97277 type cutting method using the reciprocating steel strip and free abrasive grains;
FIG. 2 is a front view of the same.

1 is a steel strip used for cutting. Usually the thickness is 0.2~0.
Several dozen stainless steel strips, each 3 m long and about 10 m wide, are strung in parallel and driven back and forth to be used as tool blades for lapping cutting. Reference numeral 2 denotes a workpiece, which is fixed on a support 3 with wax 4.

As mentioned above, a thin steel strip with a thickness of 0.2 to 0.3 is used as the tool blade l in order to make the cut thinner and improve the material yield, and stainless steel is used as the steel strip material. This is because, as will be described later, when water containing diamonds/do/fP is poured into stainless steel, there is no risk of rust, and diamonds and tada adhere well to stainless steel.

In the conventional wrapping cutting method, while driving the tool blade 1 back and forth in the directions of arrows A and B,
The diamond mother-of-pearl is suspended and the log 5 is poured over it, and at the same time, upward feeding pressure is applied to the support 3 as shown by arrow C.

Figure 2 shows the workpiece being cut in the diametrical direction, with the workpiece above the line FG at the lower edge of the tool blade 1 being cut, and the workpiece below the line FG remaining uncut. This is the part.

In the above-described manner, the tool blade 1 rubs against the workpiece 2 in the FG section, and a diamond bond is formed between the two. Since the stainless steel that forms the tool blade 1 is softer than the workpiece 2, a portion of the diamond core bites into the surface of the tool blade 10 and adheres to it, causing it to reciprocate together with the tool blade 1. The workpiece 2 is cut by grinding.

As shown in Fig. 1, the conventional method for cutting reciprocating strip steel using nine lapping methods uses a large number of tool blades 1.1.1 to cut several tens of strips at the same time. The cutting edge is thin and the cutting margin is expensive, costing several tens of thousands of yen per duram. It has many advantages such as being easy to cut.

However, as the cutting surface dimensions of workpieces have steadily increased in recent years due to advances in manufacturing technology for the material, high-purity single crystal silicon, the Kutsupinda method using the above-mentioned reciprocating strip steel has been developed. The problem with cutting methods is that processing efficiency is significantly reduced.

For example, when cutting high-purity silicon with a diameter of 100 wsO, it takes 8 to 10 hours at a tool-grade reciprocating cycle of 100 times/min and a reciprocating stroke of 150 m.

The reason why the cutting ability suddenly decreases when the size of the workpiece reaches its limit is as follows (see Figure 2): b) When the distance between the FGs increases, the distance between the tool blade 1 and the workpiece 2 increases. One reason is that the pressure per unit length of the vibrating section decreases. As mentioned above, since the tool blade 1 is thin, it is easily bent, and precise finished dimensions are required, so there is a natural limit to the value of the feed pressure in the direction of arrow C, and for this reason, the diameter of the workpiece is large. Then, a pressure per unit length is applied to the lapping portion (between FG) to perform effective grinding.

If the distance between the opening) and FG becomes long, the diamond/do/armpit will not be sufficiently fed into the topping part. For this reason, although the diamond/rudder is supplied in the vicinity of the illustrated points F' and G, the grinding effect of the diamond i4 is not sufficiently exerted in the vicinity of the centers of both points F and G.

The present invention has been made in view of the above circumstances, and an object of the present invention is to provide a method that can perform lapping cutting with high efficiency even when the workpiece has a large diameter.

FIG. 3 illustrates the principle of the invention. reciprocally driving the tool blade 1 in the directions of arrows A and B, applying feeding pressure in the direction of pressing the workpiece 2 against the tool blade 1 as shown by the arrow C via the support 3; The addition of water 5 in which the powder is suspended is similar to the method according to the prior art (FIG. 1).

In the method of the invention, an axis 6 perpendicular to the tool blade 1 is
The workpiece 2 is swung and tilted as shown by arrow E with the center at ◎ Fig. 4 shows a state in the middle of lapping cutting by the method of the present invention. The lower notched part of the workpiece 2 represents an uncut part, and the upper uncut part of the workpiece 2 represents a cut end.

Since the workpiece 2 is pivoted about an axis 6 perpendicular to the tool blade 1, the lapping line being cut forms an arc 7 about the axis 6. As the wrapping cutting progresses, the arc 7 gradually reduces in radius while drawing a concentric arc centered on the axis 6, such as an 8° arc 9.

Since the lapping line has an arc shape as described above, the workpiece 112 and tool grade 1 always vibrate locally close to point contact. Therefore, even if a particularly large feeding pressure is not applied to the workpiece 2, a sufficiently large sliding contact pressure is generated in the local area to be lapped, and even if the diameter of the workpiece 2 is large, effective lapping cutting can be performed. 〇Also, as can be easily understood from Fig. 4, the workpiece 2
and the tool blade L are vibrating locally close to point contact, so the diamond powder is easily fed and the tool blade is easily fed in the direction of the arrows A and B. Along with the reciprocating motion, the diamond powder required for lapping is sufficiently fed into the lapping section, and effective lapping cutting can be performed.

In the experiments conducted by the inventors, as shown in Figure 5,
The abutment 3 is rotatably supported by a shaft 6 perpendicular to the tool blade l, and feeding pressure is applied in the direction of arrow C, and the tool blade 1 and the abutment 3 are connected via a tilting rod 10 and a connecting rod 11. Interlockingly, while making the workpiece 2 perform an oscillating motion, a pure silicon column with a diameter of 150m is moved to a tool blade with a thickness of 0.2w and a tool blade with a length of 550B.

The reciprocating stroke of the tool blade is 300 degrees.

Tool blade reciprocating cycle 100 times/min 4 Number of tool blades, 7 da diamond powder with a particle size of 350 mesh, suspension liquid for diamonds and pure water.

Lapping cutting was carried out under the above conditions with a suspension concentration of 2 lb/30 of Daikimoto Tono Uda, and the cutting could be done in 4 hours. For comparison, the same equipment was used, and the connecting rod 11 was removed, and the workpiece was cut. 2, and the diameter 1 under the same conditions as above.
It took 13 hours to wrap and cut 20 high-purity silicon pillars.

Accordingly, it has been confirmed that when the method of the present invention is applied, the efficiency of lapping and cutting of large diameter workpieces is significantly improved9.

When the present invention is actually applied, the reciprocating direction of the tool blade and the direction of the head vibration of the workpiece 2 may be linked in opposite directions as shown in FIG. Also. 11 by a separate drive source (not shown) without interlocking.
It is also possible to perform rocking and tilting around 16.

As explained above, the present invention combines reciprocating strip steel and loose abrasive grains (
In the method of cutting a highly hard material by lapping using diamond powder (in the above embodiment), a large diameter workpiece is cut by swinging the workpiece around an axis perpendicular to the reciprocating steel strip. Workpieces can be wrapped and cut with high efficiency.

[Brief explanation of the drawing]

FIG. 1 is a perspective view schematically showing an example of a wrapping cutting method according to the prior art, FIG. 2 is a front view of the same, FIG. 3 is an explanatory diagram of the wrapping cutting method according to the present invention, and FIG. 4 is an illustration of the wrapping cutting method according to the present invention. FIG. 5 is a front view of a wrapping cutting experimental apparatus using the method of the present invention;
FIG. 6 is a front view showing an example of an i-position different from the above for carrying out the present invention. 1... Tool blade, 2... Workpiece, 3...
Abutment. 4...Wax, 5...Diamond powder suspension. 6... Axis perpendicular to the tool blade, 7.8.9...
・Arc-shaped wrapping surface, 10, 10'...Tilt rod, 11...Connecting ring 1am 211th

Claims (1)

[Claims] In a method of cutting hard materials by lapping using a reciprocating band steel and free abrasive grains, it is a method of lapping and tilting a workpiece around an axis perpendicular to the above-mentioned reciprocating band.
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