JPS62127206A - Cutting system - Google Patents

Cutting system

Info

Publication number
JPS62127206A
JPS62127206A JP26815885A JP26815885A JPS62127206A JP S62127206 A JPS62127206 A JP S62127206A JP 26815885 A JP26815885 A JP 26815885A JP 26815885 A JP26815885 A JP 26815885A JP S62127206 A JPS62127206 A JP S62127206A
Authority
JP
Japan
Prior art keywords
cut
cutting
blade
contact
rotation
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP26815885A
Other languages
Japanese (ja)
Other versions
JPS6357203B2 (en
Inventor
小山 喜昭
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Asahi Diamond Industrial Co Ltd
Original Assignee
Asahi Diamond Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asahi Diamond Industrial Co Ltd filed Critical Asahi Diamond Industrial Co Ltd
Priority to JP26815885A priority Critical patent/JPS62127206A/en
Publication of JPS62127206A publication Critical patent/JPS62127206A/en
Publication of JPS6357203B2 publication Critical patent/JPS6357203B2/ja
Granted legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B28WORKING CEMENT, CLAY, OR STONE
    • B28DWORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/02Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills
    • B28D5/022Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels
    • B28D5/028Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels with a ring blade having an inside cutting edge

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【発明の詳細な説明】 〔産業上の利用分野〕 本発明はIDブレードによる切断方式、とくに硬脆性材
料の薄切り方法に関するものである。
DETAILED DESCRIPTION OF THE INVENTION [Industrial Application Field] The present invention relates to a cutting method using an ID blade, and particularly to a method for slicing hard and brittle materials.

〔従来の技術〕[Conventional technology]

IDブレードによる切断は周知である。第3図は円環状
のIDブレード1の中心関口部2の周辺を示すもので、
金属薄板の基体1はその外周部で保持し外方に張力を印
加して緊張状態で平坦を保つ、内周縁3にはダイヤモン
ド砥石部4が付設されている。これを矢印5のように高
速回転し、開口部2に被切断材6を挿入して矢印7の方
向に送ることにより切断が行われる。
Cutting with ID blades is well known. FIG. 3 shows the area around the center entrance part 2 of the annular ID blade 1.
A base 1 made of a thin metal plate is held at its outer periphery and kept flat in a tensioned state by applying tension outward, and a diamond grindstone portion 4 is attached to the inner periphery 3. Cutting is performed by rotating this at high speed as indicated by arrow 5, inserting the material to be cut 6 into opening 2, and feeding it in the direction of arrow 7.

また被切断材6を静止し、回転するIDブレードを矢印
8の方向に送ってもよい、要は両者の相対関係にあるの
で、以下便宜上送りは矢印8として説明する。
Alternatively, the material to be cut 6 may be kept stationary and the rotating ID blade may be sent in the direction of the arrow 8. Since the important point is the relative relationship between the two, the feeding will be explained below using the arrow 8 for convenience.

被切断材はSiなどの半導体あるいはガラスなどに切断
需要が多く、第3図のように断面6の円柱状の素材を輪
切りにして薄板とする例が多い0寸法例としては、Si
単結晶の直径150朧の円柱を輪切りにして厚さ1閤以
下の薄板とする。
The materials to be cut are often in demand for cutting semiconductors such as Si or glass, and as shown in Figure 3, a cylindrical material with a cross section of 6 is often sliced into thin plates.
A cylinder of single crystal with a diameter of 150mm is sliced into thin plates with a thickness of 1 piece or less.

9は黒鉛製などの支持片で1円柱状の被切断材6の全長
にわたり円柱の母線に沿って接着して置く。
Reference numeral 9 denotes a support piece made of graphite or the like, which is glued along the generatrix of the cylinder over the entire length of the cylindrical material to be cut 6.

第4図はIDブレード内周縁の位l1110より、送り
8にしたがって切断が進行する状態である。
FIG. 4 shows a state in which cutting progresses according to feed 8 from position l1110 on the inner peripheral edge of the ID blade.

内周縁の位置11では曲NlAl1の上方は既切断、下
方はは未切断°である。以下送りにしたがって逐次11
,12,13.・・・・・・と進行し、15に至って切
断が完了する。
At position 11 on the inner peripheral edge, the upper part of the curve NlAl1 is already cut, and the lower part is uncut. 11 sequentially according to the following feed
, 12, 13. The process progresses as follows, and the cutting is completed when it reaches 15.

切断完了時15では支持片9も若干切り込まれるが、切
断された薄板は、16.17間において支持片9の全幅
にわたり接着が保たれている。切断を繰返して分離され
た多数の薄板は櫛歯状に支持片9上に残って、以後の取
扱いに資する。
At the time of completion of cutting, the support piece 9 is also slightly cut, but the cut thin plate remains bonded over the entire width of the support piece 9 between 16 and 17. A large number of thin plates separated by repeated cutting remain on the support piece 9 in a comb-like shape and are useful for subsequent handling.

以上は一般に行われているIDブレードによる切断法で
ある。IDブレードは一種のダイヤモンドホイールであ
り、内周の砥石部4が被切断材を研削除去し、その厚さ
に相当する幅の溝を掘りながら、その溝に進入して行く
のが切断過程である。研削作用を働く刃先は砥石部4の
内周面でありこの作用面と被切断材6とは第4図11.
12・・・の円弧に沿って接触する。接触の長さは切断
の初期と終期とを除いて一般に長く、最大は被切断材6
の直径よりも長い。
The above is a commonly used cutting method using an ID blade. The ID blade is a type of diamond wheel, and during the cutting process, the grinding wheel 4 on the inner circumference grinds away the material to be cut and digs a groove with a width corresponding to the thickness of the material. be. The cutting edge that performs the grinding action is the inner circumferential surface of the grindstone portion 4, and the relationship between this working surface and the workpiece 6 is shown in FIG. 4, 11.
Contact is made along the arc of 12.... The length of contact is generally long except at the beginning and end of cutting, and the maximum length is 6
longer than the diameter of

すなわちこの切断方式においては、接触長に比例する切
断抵抗が高いことが難点である。その上に、長い接触長
は以下の弊害を伴う。
In other words, this cutting method has a drawback in that the cutting resistance, which is proportional to the contact length, is high. Moreover, long contact lengths have the following disadvantages.

IDブレード刃先と被切断材との接触面は幅のせまい深
い溝の底であり、溝にはブレードが嵌入しているので冷
却水が接触面にまで届きにくいものであり、ブレード刃
先と被切断材とが強く圧接している接触面に冷却水が行
きわたることは、接触長に比例して困難を増す。このた
めに切屑の排除が不円滑となりブレード刃先は目詰り状
態となり、また接触部の温度が上昇してIDブレードの
研削性能が劣化する。
The contact surface between the ID blade edge and the material to be cut is the bottom of a narrow and deep groove, and since the blade is fitted into the groove, it is difficult for cooling water to reach the contact surface. It becomes more difficult to distribute cooling water to the contact surface that is in strong pressure contact with the material in proportion to the contact length. As a result, chips are not smoothly removed, the blade edge becomes clogged, and the temperature of the contact portion increases, degrading the grinding performance of the ID blade.

これ等の現象がもともと高い切断抵抗をさらに増大して
、緊張により平面を保つIDブレードを弯曲させ、切断
面の平坦度を損ねる。薄板切断においては、得られた薄
板の品質として平面度、平行度が重要で、上述の過程に
よりこれ等が許容値を越えるに至ってIDブレードの寿
命となる。すなわちこの切断方式においては、切断製品
の薄板の品質が劣化し勝であり、またIDブレードの寿
命も短い。
These phenomena further increase the already high cutting resistance, causing the ID blade, which remains flat due to tension, to curve, thereby impairing the flatness of the cut surface. When cutting a thin plate, flatness and parallelism are important for the quality of the obtained thin plate, and the above-mentioned process causes these to exceed allowable values, which ends the life of the ID blade. That is, in this cutting method, the quality of the thin plate of the cut product deteriorates, and the life of the ID blade is also short.

以上の難点を克服するために送り8と同時に被切断材6
をその円筒軸芯のまわりに回転する切断方式が提案され
ている。第4図において切断開始時にはブレード内周円
10と被切断材6との接触長はきわめて短いが、この接
触状態が6を回転することにより切断終了まで続くと考
えてよいであろう。第5図は被切断材6の中心近くまで
送りが進んだ状態で、ブレード内周円は20の位置にあ
る。6を回転しない場合には接触長は接触長は21,2
2.23の曲線となり前述のように甚だ長いが、回転を
併用すれば未切断部はすでに小径の24となっているの
で接触長は依然として極めて短い。
In order to overcome the above-mentioned difficulties, the material to be cut 6 is
A cutting method has been proposed in which the cylinder rotates around its cylindrical axis. In FIG. 4, at the start of cutting, the length of contact between the inner circumference of the blade 10 and the material to be cut 6 is extremely short, but it can be considered that this contact state continues until the end of cutting as the blade 6 rotates. FIG. 5 shows a state in which the feed has progressed to near the center of the material 6 to be cut, and the inner circumferential circle of the blade is at position 20. If 6 is not rotated, the contact length is 21,2
The curve becomes 2.23, which is extremely long as described above, but if rotation is also used, the uncut portion already has a small diameter of 24, so the contact length is still extremely short.

回転切断方式では上述の理由により切断抵抗は低く、得
られる薄板の平面度、平行度などの切断品質は良好、ま
た送りの速度を上げて作業能率を高めることができ、し
かもIDブレードの寿命も長いことが実証されている。
Due to the above-mentioned reasons, the rotary cutting method has low cutting resistance, and the cutting quality of the obtained thin plate, such as flatness and parallelism, is good, and the feed speed can be increased to improve work efficiency, and the life of the ID blade is also shortened. It has been proven that it lasts a long time.

〔発明が解決しようとする問題点〕[Problem that the invention seeks to solve]

以上の利点にも拘らず、回転切断方式にも決定的な難点
があるために実用は限られ、依然として被切断材を回転
しない第3図、第4図の切断方式がもっばら用いられて
いる。
Despite the above-mentioned advantages, the rotary cutting method also has certain drawbacks, so its practical use is limited, and the cutting methods shown in Figures 3 and 4, which do not rotate the material to be cut, are still most commonly used. .

難点は支持片9が用を為さないことにある。The problem is that the support piece 9 does not serve any purpose.

支持片9を用いても回転のため切断されて薄板とともに
分離するからである。切断が終了すると薄板は支持を失
って落下し、高速回転するよりブレードまたはブレード
保持緊張機構に触れて破損するおそれがある。これを防
ぐため切断済の薄板を安全に回収する措置を講じてもな
お以下の問題が残る。
This is because even if the support piece 9 is used, it will be cut and separated together with the thin plate due to rotation. When the cutting is completed, the thin plate loses its support and falls, and as it rotates at high speed, there is a risk that it will come into contact with the blade or the blade retention tension mechanism and be damaged. Even if measures are taken to safely recover the cut thin plates to prevent this, the following problems still remain.

第5図の状態では被切断材6の中心部24以外の部はす
でに切断されて薄板状となっており、これが24の部で
母材に支持されている。切断完了に近づくと未切断部2
4は極めて小径となり、切断抵抗に耐えられず、破断し
て薄板を分離する。すなわち薄板の中心部に破断痕の突
起が残り、全面均質を要求される薄板製品に決定的な欠
陥となる。
In the state shown in FIG. 5, the part of the workpiece 6 other than the central part 24 has already been cut into a thin plate, which is supported by the base material at the part 24. When the cutting is nearing completion, the uncut part 2
4 has an extremely small diameter, cannot withstand the cutting resistance, and breaks to separate the thin plates. In other words, a protrusion as a break mark remains in the center of the thin plate, which is a decisive defect in thin plate products that require uniformity over the entire surface.

〔問題点を解決するための手段〕[Means for solving problems]

本発明の目的は被切断材回転方式における接触長の短い
特長を保有し、しかも切断済薄板の保持を確保して薄板
中心部に破断痕を作ることのない切断方式を提供するこ
とにある。
An object of the present invention is to provide a cutting method which has the advantage of short contact length in the method of rotating the material to be cut, and which also ensures the retention of the cut thin plate and does not create breakage marks in the center of the thin plate.

本発明の切断方式においても被切断材を回転するが、従
来方式の連続回転に替えて、定められた角度範囲内を往
復回転する。すなわち第1図のように被切断材6には支
持片9を接着し、これがIDブレードの内周円4に触れ
ない範囲9.9′間を角度θにわったで往復回転する。
In the cutting method of the present invention, the material to be cut is also rotated, but instead of continuous rotation in the conventional method, it is rotated back and forth within a predetermined angular range. That is, as shown in FIG. 1, a support piece 9 is bonded to the material 6 to be cut, and the support piece 9 rotates reciprocatingly at an angle θ within a range 9.9' that does not touch the inner circumferential circle 4 of the ID blade.

〔作   用〕[For production]

送りと回転とを併用すると、被切断材は肩線に沿って切
断されて行く。第6図は連続回転の場合の肩線の例であ
る。被切断材6の1回転あたりの送り量をFとすれば、
ブレード内周円の位置30でA点で接触して切断を開始
し1回転後には内周円の位置は31となり孤A、B、?
被切断材6に接触する。内周円31上、A、B1の左方
および右方はすでに切断された空位であるから接触はな
い。さらに1回転後は内周円32上の接触部はA2B2
となる。すなわち接触線はFを距でる肩線の間を斜めに
横切る。1回転あたりの送り量Fを小さくすれば接触長
A1Bユ等は短くなる。
When both feeding and rotation are used, the material to be cut is cut along the shoulder line. FIG. 6 is an example of shoulder lines in the case of continuous rotation. If the feed amount per rotation of the material to be cut 6 is F, then
At position 30 on the inner circumference of the blade, the blade makes contact at point A and starts cutting, and after one rotation, the inner circumference becomes position 31 and the arcs A, B, ?
It comes into contact with the material to be cut 6. Since the left and right sides of A and B1 on the inner circumferential circle 31 are already cut and empty, there is no contact. After one more rotation, the contact area on the inner circumferential circle 32 is A2B2
becomes. That is, the line of contact crosses diagonally between the shoulder lines extending from F. If the feed amount F per revolution is reduced, the contact length A1B, etc. will be shortened.

本発明の方法において第7図の角度θの間を往復回転し
、1往復あたりの送り量をGとすれば、ジグザグの曲線
ABCDEに沿って切断が進行する0曲線AB、BC等
は第6図と同様の肩線で、往の行程を石巻の渦とすれば
復は左右となる。隣の曲線との間隔は0(ゼロ)からG
の間を変化するので、これを斜めに横切るブレード内周
円との接触長はO(ゼロ)と最大との間を変化して平均
値は小さく、前述の目的に適う。
In the method of the present invention, if the reciprocating rotation is performed between the angle θ shown in FIG. Using the same shoulder line as in the diagram, if the forward stroke is the Ishinomaki vortex, the return stroke will be left and right. The distance between adjacent curves is from 0 (zero) to G
Therefore, the contact length with the inner circumferential circle of the blade that diagonally crosses this varies between O (zero) and the maximum, and the average value is small, which satisfies the above-mentioned purpose.

被切断材6を静止して見れば、IDブレード(内周円)
の中心は角度θの間を往復回転しながら、1往復につき
Gの割合で被切断材6の中心から離間して行くことにな
る。第8図HJKLを内周円中心の軌跡の一部とする。
If you look at the material to be cut 6 stationary, the ID blade (inner circumference circle)
While rotating reciprocally through an angle θ, the center moves away from the center of the material to be cut 6 at a rate of G per reciprocation. Let HJKL in FIG. 8 be a part of the locus centered on the inner circumferential circle.

折返し点Jにおけるブレード内周円の位置は41で、こ
の時被切断材6の未切断部は曲線PQR3を境界として
下方にある。内周円41はPQにわたって被切断材と接
触しているが、これは折返し点であるから、次に反転に
移れば矢印Wのように内周円は42の方に移動し、接触
は離れる。
The position of the inner circumferential circle of the blade at the turning point J is 41, and at this time, the uncut portion of the material to be cut 6 is below the curve PQR3 as a boundary. The inner circumferential circle 41 is in contact with the material to be cut over PQ, but since this is the turning point, the inner circumferential circle moves toward 42 as shown by the arrow W when the next turn is made, and the contact is removed. .

第8図42はブレード中心がKにある時の内周円で、こ
の時の接触長は短く、Dlである。
FIG. 842 shows the inner circumferential circle when the blade center is at K, and the contact length at this time is short, Dl.

以後回転と送りとにしたがって接触はDより2D3・・
・・と変化し、この過程で切断された形状はQ RiS
 xとなる。説明を省略した前出の曲線PQR3も同様
の過程により11→Jで終わる前行程で形成されたもの
であり、第7図のジグザグ模様の一部がRQRえに見ら
れる。
After that, the contact becomes 2D3 from D according to the rotation and feed.
...and the shape cut in this process is Q RiS
It becomes x. The aforementioned curve PQR3, whose explanation is omitted, was also formed in the previous step ending at 11→J by a similar process, and a part of the zigzag pattern in FIG. 7 can be seen in RQR.

接触長はり、D、D、・・・・・・と次第に長くなるが
、RIS、において最大となると同時に接触は離れて新
たに極めて短い接触部を作る。最大の場合の接触長はや
や大きいが、非回転切断における第4図の最大接触長に
くらべて約1/2であり、また極めて短い場合もあるの
で平均値ははるかに小さい、第4図において長大な接触
長をもってブレード内周円が被切断材に圧接を持続する
のにくらべれば条件は非常に有利である。ことに接触長
が最大になると同時に接触が離れるので冷却水がよくま
わり、切屑の排除が有効に行われて目詰りも防止される
The contact length gradually becomes longer as D, D, . The maximum contact length is somewhat large, but it is about 1/2 of the maximum contact length in Figure 4 for non-rotating cutting, and it is also extremely short in some cases, so the average value is much smaller, as shown in Figure 4. The conditions are very advantageous compared to the case where the inner circumferential circle of the blade maintains pressure contact with the material to be cut due to a long contact length. In particular, since the contact is separated at the same time as the contact length reaches its maximum, cooling water can circulate well, chips can be removed effectively, and clogging can be prevented.

〔実 施 例〕〔Example〕

本発明の切断方式は被切断材を回転する利点を活用する
ものであるから、往復回転の角度範囲は大きいほど有利
である。この角度範囲を制限するのは支持片9が切断さ
れないという条件である。切断の初期には第2図0□の
ように、角度範囲は180@  以上も可能であるが、
切断の進行とともに制限角度は縮小することが、第1図
に明らかである。切断の終了時には往復回転の範囲は0
ないし極めて小さい角度となることが、第4図15から
もわかる。
Since the cutting method of the present invention utilizes the advantage of rotating the material to be cut, the larger the angular range of reciprocating rotation, the more advantageous it is. This angular range is limited by the condition that the support piece 9 is not cut. At the initial stage of cutting, the angle range can exceed 180@ as shown in Figure 2 0□, but
It is evident in FIG. 1 that the limiting angle decreases as the cutting progresses. At the end of cutting, the range of reciprocating rotation is 0
It can also be seen from FIG. 4, 15 that the angle is at least extremely small.

第9図は1往復の回転について送りを被切断材6の直径
の1710として10往復で切断完了するものとし、回
転角は200° より初めて1往復ごとに20°減少し
て終了時にOとした場合の切断線図である。送りを定速
とすれば往復回転の周期は一定、回転速度は往復角度範
囲に逆比例して遅くなる。1往復についての切断面積は
回を追って小さくなるので、回転速度について上述の相
対関係を保って、送り速度を次第に上昇すれば能率的と
なる。
In Figure 9, cutting is completed in 10 reciprocations with the feed being 1710 mm, which is the diameter of the material to be cut 6, for one reciprocating rotation, and the rotation angle starts from 200° and decreases by 20° for each reciprocating operation, and becomes O at the end. FIG. If the feed rate is constant, the period of reciprocating rotation will be constant, and the rotation speed will slow down in inverse proportion to the reciprocating angle range. Since the cutting area for one reciprocation becomes smaller with each reciprocation, it will be more efficient to maintain the above-mentioned relative relationship regarding the rotation speed and gradually increase the feed speed.

第10図は同じく往復回転角200@  をもって開始
し、1往復ごとに20°減少するが、1行程の送り量は
回転角度範囲に比例して減少させる場合の切断線図であ
る。送り速度、回転速度ともに一定とするか、または一
定の比率を保ったまま増減することができる。この例で
は4.5往復9行程の後は回転を停止し送りのみで切断
を続行している。この時の接触長は図に見られるように
、十分に短い。
FIG. 10 is a cutting diagram in the case where the reciprocating rotation angle starts at 200@ and decreases by 20 degrees for each reciprocation, but the feed amount per stroke decreases in proportion to the rotation angle range. Both the feed speed and rotation speed can be kept constant, or they can be increased or decreased while maintaining a constant ratio. In this example, after nine 4.5 reciprocating strokes, the rotation is stopped and cutting is continued by only feeding. The contact length at this time is sufficiently short as seen in the figure.

本発明の切断方式を実施するには被切断材を回転可能と
する軸受機構を要し、その軸芯はIDブレードの板面に
対し正確に垂直であることが、切断精度のために肝要で
ある。これは従来の連続回転方式の切断機ですでに実現
されている。送りの直線度も同じ理由から要求されるが
、これも従来のIDブレード切断機に備っている。
In order to carry out the cutting method of the present invention, a bearing mechanism that allows the material to be cut to rotate is required, and it is essential for cutting accuracy that the axis of the bearing mechanism be exactly perpendicular to the plate surface of the ID blade. be. This has already been achieved with conventional continuous rotary cutting machines. Feed straightness is also required for the same reason, and is also provided in conventional ID blade cutting machines.

往復のための回転方向の逆転、その位置ないし時点、回
転速度などを、送りとも関連して制御することは機械的
、電気的、あるいは電子的に行うことができる。
Controlling the reversal of the direction of rotation for reciprocating, its position or time, rotational speed, etc., in connection with the feed, can be performed mechanically, electrically or electronically.

〔発明の効果〕 本発明の切断方式は切断抵抗が低いために切断能率が高
く、切断面の平面度などの切断度が高く、IDブレード
の寿命も長い被切断材回転方式の利点を保有し、しかも
切断面中心に破断痕の突起を生じることがない、これに
より半導体、ガラスなどの薄切りにおいて高品質の薄板
を経済的に製造することができる。また近年切断需要の
増大している難削セラミクスなども十分な採算性をもっ
て精密切断加工を施すことができ、関係業界に貢献する
所が大きい。
[Effects of the Invention] The cutting method of the present invention has the advantages of the cutting material rotation method, which has high cutting efficiency due to low cutting resistance, high cutting degree such as flatness of the cut surface, and long life of the ID blade. In addition, no protrusion of breakage marks is produced at the center of the cut surface, and as a result, high-quality thin plates of semiconductors, glass, etc. can be manufactured economically. Furthermore, it is possible to precisely cut ceramics, which are difficult to cut, for which demand for cutting has been increasing in recent years, with sufficient profitability, making a great contribution to related industries.

【図面の簡単な説明】[Brief explanation of drawings]

第1図及び第2図は本発明に係る切断方式の説明図、第
3図は従来から用いられている円環状IDブレードの中
心部断面図、第4図は切断状態を示す図、第5図は切断
完了直前の断面図。 第6図は連続回転の場合の肩線の例を示す断面図、第7
図は角度Oの間を往復回転させる場合の断面図、第8図
及び第9図は切削軌跡を示す図である。 同      江    藤         剛−−
fs1図       第2図 第4図 第1図 第7図 第5図 第q図 昭和61年3月27日
1 and 2 are explanatory diagrams of the cutting method according to the present invention, FIG. 3 is a sectional view of the center of a conventionally used annular ID blade, FIG. 4 is a diagram showing the cutting state, and FIG. The figure is a cross-sectional view just before cutting is completed. Figure 6 is a sectional view showing an example of the shoulder line in the case of continuous rotation, Figure 7
The figure is a cross-sectional view when reciprocating rotation between angles O, and FIGS. 8 and 9 are views showing cutting loci. Tsuyoshi Eto
fs1 diagram Figure 2 Figure 4 Figure 1 Figure 7 Figure 5 Figure q March 27, 1986

Claims (1)

【特許請求の範囲】 1、被切断材をIDブレードの内周円に向って送り込む
と同時に、IDブレードの面と垂直の軸芯のまわりに被
切断材を限られた角度範囲内で往復回転させることを特
徴とする切断方式。 2、被切断材の側面に、切断面と垂直方向の全長にわた
る支持片を接着し、これがIDブレードによって切断さ
れない角度範囲内で該被切断材を往復回転させることを
特徴とする特許請求の範囲第1項記載の切断方式。
[Claims] 1. While feeding the material to be cut toward the inner circumferential circle of the ID blade, the material to be cut is simultaneously rotated reciprocally within a limited angular range around an axis perpendicular to the surface of the ID blade. A cutting method characterized by 2. A support piece is attached to the side surface of the material to be cut over the entire length in a direction perpendicular to the cutting surface, and the material to be cut is rotated back and forth within an angular range that is not cut by the ID blade. The cutting method described in Section 1.
JP26815885A 1985-11-28 1985-11-28 Cutting system Granted JPS62127206A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP26815885A JPS62127206A (en) 1985-11-28 1985-11-28 Cutting system

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP26815885A JPS62127206A (en) 1985-11-28 1985-11-28 Cutting system

Publications (2)

Publication Number Publication Date
JPS62127206A true JPS62127206A (en) 1987-06-09
JPS6357203B2 JPS6357203B2 (en) 1988-11-10

Family

ID=17454707

Family Applications (1)

Application Number Title Priority Date Filing Date
JP26815885A Granted JPS62127206A (en) 1985-11-28 1985-11-28 Cutting system

Country Status (1)

Country Link
JP (1) JPS62127206A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0579227A1 (en) * 1992-07-16 1994-01-19 Tokyo Seimitsu Co.,Ltd. Method and apparatus for slicing semiconductor wafer
KR100337060B1 (en) * 1999-07-24 2002-05-16 이덕수 Hair clip

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0579227A1 (en) * 1992-07-16 1994-01-19 Tokyo Seimitsu Co.,Ltd. Method and apparatus for slicing semiconductor wafer
US5524604A (en) * 1992-07-16 1996-06-11 Tokyo Seimitsu Co., Ltd. Method and apparatus for slicing semiconductor wafers
KR100337060B1 (en) * 1999-07-24 2002-05-16 이덕수 Hair clip

Also Published As

Publication number Publication date
JPS6357203B2 (en) 1988-11-10

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