JPS58147109A - Method of producing laminated ceramic condenser - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION (a) Technical Field of the Invention The present invention relates to an improvement in a method for manufacturing a product Iv (ramic capacitor).

(b) Multilayer ceramic capacitors, which have excellent cumulative high-frequency characteristics, small size, large capacity, and reliability, are generally manufactured by printing multiple internal electrodes on a thin ceramic green sheet (green sheet). A laminated ceramic raw sheet is created using a lamination method in which green sheets are stacked together with the facing sheets, or internal electrodes and sieve casing layers (using the same ceramic powder as the green sheet) are alternately placed on a thick green sheet. A raw laminated ceramic sheet is created using a printing method, which is cut into chips, burnt out and fired, and then terminal electrodes are formed to complete the process. There are 4 types of exterior type that form an exterior where one end of the lead terminal is connected and the other end is led out.
b.

(c) Conventional technology and problems Conventionally, as mentioned above, the terminal m pole of a multilayer ceramic capacitor is cut into chips, subjected to burnout and sintering, and then a conductive paste is applied to the two opposing terminal electrode formation surfaces. In order to form the chip in a specific manner, it not only takes a lot of man-hours to align a large number of chips in a predetermined direction, but there are also disadvantages such as making the chip shape for the purpose of detecting the surface on which the terminal electrode is formed.
Improvements have been desired.In particular, in the case of shell-type ceramic condensers that are attached or connected to circuits through lead wires, the terminal electrodes are protected by the exterior and one end of the lead terminal is Regardless of the Km connected to the electrode, a terminal electrode equivalent to that of a chip type was formed and the circuit was connected by soldering, which was a waste.

(Purpose of the Invention) An object of the present invention is to eliminate the above-mentioned drawbacks and provide a user with an inexpensive multilayer ceramic capacitor. The ceramic green sheet has a slit of at least 4M1L along the corner surface where the terminal electrode is formed, and a second slit of appropriate depth along the side where the terminal electrode is not formed. a step of applying a conductive paste that can be fired simultaneously with the firing of the raw ceramic sheet to the inner wall of the first slit, a first burnout step, and a step of forming a conductive paste on the inner wall of the first slit. This is achieved by a method for manufacturing a multilayer ceramic capacitor characterized by including a step of cutting and separating into chips and a second burnout step.

(f) Examples of the Invention Below, Figure 1 is a side view showing a general structural example of a multilayer ceramic capacitor produced using a conventional method, and Figure 2 is a side view showing the main steps involved in the method of the present invention. FIG. 3 shows a side view of a laminated ceramic raw sheet with laminated internal electrodes formed thereon by the method, and a plane view showing first and second slits formed in the ceramic raw sheet according to an embodiment of the method of the present invention. Figure 4 shows the cross-sectional shape of the first slit, and Figure 6 shows the cross-section of the first slit coated with conductive paste according to the seventh embodiment of the method of the present invention.
The figure and the paste inserted into the first and wL2 slits,
That is, for example, the paste should be the same as that used for forming the internal electrodes 13 and 14, and the screen printing method or spraying using a mask will prevent harmful paste from forming on the inner walls of the slits 12 and the upper surface of the raw sheet 10. The conductive paste used was Surin) 1.
The viscosity is O for the internal electrode in order to allow -Km of 1 to penetrate.
It is suitable to have #i of 10.00 to 2,000 poise, and it is preferable to mix a small amount of frit glass to increase the adhesion to the terminal electrode forming surface.

Next, in the fourth step shown in FIG. 2, the Mylar sheet 9! llke〈Release raw sheet 1oFi, 1st 0/'
- incomplete burnout, e.g. 100°C
- Gentle KJ for about 8 hours up to 150℃! Koshikishi 15
After being semi-cured by maintaining it at 0° C. for about 2 hours, it is cut through slits 11 and 12 in a fifth step to obtain green chips 16 shown in FIG. 7.

Further, as shown in steps 11E6 and 7 in FIG. The laminated ceramic blowfish capacitor 16 in FIG.
4 is formed inside the chip 17, and terminal poles 15' and 15 are formed on predetermined opposing end surfaces of the chip 17, thereby completing a chip-type multilayer ceramic capacitor 16.

Note that the thickness of the terminal electrodes 15' and 15'' formed by the method of the present invention is greater than that of the terminal electrodes (3 and 4 in Fig. 1) formed by the conventional method, depending on the paste used and the amount of glass frit ( Because it is formed extremely thin due to the difference in viscosity (low) and viscosity (low), it is desirable to plate it with nickel (Ni) to improve solderability, or to connect the circuit with a conductive adhesive.

In FIG. 8, nickel layers 18 and 19 are applied to the terminal electrodes 15 and 15 of the chip-type capacitor 16' shown in FIG. It is a side cross-sectional view showing an exterior type multilayer ceramic capacitor 24 with a resin outer core 23 formed thereon. The circuit will be connected due to various reasons.

(b) As described in detail, when using the method of the present invention to form a terminal into a multilayer ceramic electric capacitor, a conductive paste is applied before cutting into each chip, and the baking process is carried out. Since the process is carried out at the same time as the firing of the chip (ceramic), not only is it possible to significantly shorten the production time by eliminating the need to form the terminal electrodes on each individual piece as in the conventional process, but also it is possible to form the terminal electrodes during automation, unlike in the conventional process. A stone that has the effect of increasing the degree of freedom in design because there is no membership fee to create a shape that distinguishes the 2Iiii11 face that forms the 2Iiii11 face and the end face that does not form.

[Brief explanation of the drawing]

$111- is a side view showing a general structure example of an X/L multilayer ceramic capacitor according to the conventional method, FIG.
The figure is a side view of a nine-layer ceramic green sheet produced by a conventional printing process, and FIG. 4 is a plan view of a ceramic green sheet with first and second slits formed according to an embodiment of the method of the present invention. @ Figure 5 is an enlarged cross-sectional view showing the shape of the first slit, and Figures V and 6 are enlarged cross-sectional views showing the state in which the conductive paste is applied to the first slit according to an embodiment of the method of the present invention. , FIG. 7 is an enlarged side view showing a chip (chip-type multilayer ceramic capacitor) cut through the first and aR2 slits, and FIG. 8 is an exterior-type multilayer ceramic structure in which the chip is fired and lead terminals are connected. This is an enlarged side cross-sectional view showing a capacitor. In the figure, 1.16 is a chip-type flt-layer ceramic capacitor, 2.17 is a capacitor chip, and 3 is a chip-type flt-layer ceramic capacitor.
．． 4.15, 15 are terminal electrodes, 6.7.13゜1
41i internal 'WIL pole, lO is laminated ceramic raw sheet, 11Fi'f! A1's pick y), 12 is the second pick 1]
15 is a conductive paste adhesion layer, 16 is an unfired sensor chip, and a 24Fi round-shaped multilayer ceramic capacitor is shown.

Claims (1)

[Claims] In a multilayer ceramic capacitor, a laminated raw ceramic sheet having a plurality of laminated electrodes formed therein is cut into chips, and terminal electrodes are formed on predetermined opposing end faces of the chips, wherein the raw ceramic sheet is the terminal electrode. at least the first depth of cutting the laminated electrode along the plane forming the
forming a second slit of an appropriate depth along the surface where the slit and the terminal electrode are not formed; coating the inner wall of the first slit with a conductive paste that can be fired simultaneously with the raw ceramic sheet IAA; A manufacturing method for a multilayer ceramic capacitor 0 that does not mention the following steps: a step of attaching the capacitor, a first burnout step, a step of cutting through the first and second slits to separate the chips, and a second burnout step.