JPS58144493A - Formation of metal plating layer onto metal electrode - Google Patents

Abstract

PURPOSE:To efficiently form a metal plating layer on a metal electrode, by a method wherein a metal thin film is laminated to the entire surface of an insulating substrate while an insulator film having a window at a part to be provided with a metal plating layer is provided thereon to apply metal plating to said window part and, after the insulator film is removed, the metal thin film is etched into a predetermined shape. CONSTITUTION:A NiCr film and an Au film are laminated to the entire surface of a substrate 1 such as a glass substrate to form a metal thin layer 2 and a photoresist film 3 is applied thereon. In the next step, a window is provided to a predetermined part where an Au film is desirably formed and a plating lead wire 5 is connected thereto. To the part of the window 4, a metal plating layer 6 comprising Au is provided by electroplating. Subsequently, the photoresist film 3 and the plating lead wire 5 are removed and a photoresist layer 7 is coated to cover the plating layer 6 therewith. In this state, etching treatment is applied to remove the metal thin film 2 at an unnecessary part and, after metal electrodes 2a are formed in a mutually parted pattern, the photoresist layer 7 is removed to form a metal plating layer.

Description

DETAILED DESCRIPTION OF THE INVENTION [Background of the Invention] The present invention relates to a method for forming metal plating on the surface of a metal thin film provided on a substrate, and more particularly, it relates to a method for forming metal plating on the surface of a metal thin film provided on a substrate, and more particularly, it relates to a method for forming metal plating on the surface of a metal thin film provided on a substrate, and more particularly, it relates to a method for forming metal plating on the surface of a metal thin film provided on a substrate, and more particularly, it relates to a method for forming metal plating on the surface of a metal thin film provided on a substrate, and more particularly, it relates to a method for forming metal plating on the surface of a metal thin film provided on a substrate. -Relates to an electrolytic plating method for forming metal electrodes used in image reading devices or image recording devices.

In the electrolytic plating method using a mask for defining a pattern, improvements are being required to further reduce costs and improve quality. For this reason 1
Although various methods have been developed, conventional methods have the common drawback of being complex and requiring multiple steps.

FIG. 1 shows a part of an optical sensor used in an image reading device, etc., and this part of the optical sensor is mounted on a substrate/top.
Membrane-like electrode cores a made of NiCr-Au are provided in individual shapes spaced apart from each other, and internal and external wiring A metal plating layer l for bonding is provided. In order to form a metal plating layer t on a thin film electrode film by a conventionally known method, first, a thin film electrode is laminated over a required area of the substrate l by vacuum evaporation or the like. 1. Next, etching is performed using photoresist or the like to form mutually spaced thin film electrodes 2a, and then these mutually spaced thin film electrodes 2a are connected at arbitrary locations and wired to a power source for metal fittings. do. Then, after forming a plating layer by covering the parts other than the parts to be plated with an insulator, the insulator and the connection part are removed. In such a conventional method, after the electrodes spaced apart from each other are connected, the steps of forming an insulating coating, plating, and removing the insulating part and the connecting part are performed.

The overall plating process was complicated, and it had the drawbacks of low power and work efficiency.

[Summary of the invention]

The present invention aims to solve these drawbacks by omitting the steps of connecting electrodes that are spaced apart from each other and removing the connected portions after plating when manufacturing an image reading device or image recording device. It is an object of the present invention to provide a method for forming a metal plating layer for bonding internal and external wiring on a portion of a thin film electrode using a simplified process.

The method of forming a metal plating layer on a metal electrode according to the present invention involves laminating a thin metal film over a required range of an insulating substrate such as glass or ceramics, and forming a portion of the surface corresponding to the location where the metal plating layer is to be provided. An insulator film with a window is provided on the metal thin film.

The present invention is characterized in that after connecting a plating lead wire to the metal thin film and forming a metal plating layer on the window portion, the insulating film is removed, and then the metal thin film is etched into a predetermined shape.

[Detailed description of the invention]

Although the metal forming the metal thin film is not limited to a specific one, it may be a laminate of a NiCr film and an Au film or a Ni film.
Will it be a laminate of Cr film-Ni film and Au film?

Alternatively, it is preferable to use a NiCr film or a Ni film. The same applies to plated metals, but A depending on the purpose.
It is preferable to select u+Ni-solder or Sn.

The insulator coating can be applied by applying photoresist on top of the metal thin film layer or by photolithographic techniques.
This is carried out by opening a predetermined window in this insulating film.

The window portion of this insulating film corresponds to a location where a metal plating layer will be formed in the future.

The method of forming a metal plating layer on a metal electrode according to the present invention will be illustrated below with reference to the drawings, but the present invention is not limited to these examples.

FIG. 2 shows an outline of the steps of a method for forming a metal plating layer on a metal electrode according to the present invention.

As shown in FIG. 2(a), a metal thin film λ is formed by laminating a NiCr film and then an Au film on a substrate l made of glass, ceramics, or the like by vacuum evaporation, sputtering, CVD, or the like. The Ni Cr film and the Au film are attached almost entirely over the entire surface of the substrate 1.

on a metal thin film made of NiCr-Au7)a.

A photoresist film 3 such as AZ-/3jOJ is applied.

Next, as shown in FIG. 2(b), a window is provided at a predetermined portion where an Au plating layer is to be formed using photolithography, and at the same time, a window for connecting a lead wire for plating is also provided.

Next, after connecting the plating lead wire j to the metal thin film λ,
A metal plating layer t of + Au or the like is provided on the window portion by electrolytic plating. Thereafter, as shown in FIG. 2(c), when the photoresist film 3 and the plated lead wires j are removed, metal plating layers 6 are formed in a shape spaced apart from each other on the metal thin film λ made of Ni Cr - Au film. The state is as follows.

Next, as shown in FIG. 2(d), the photoresist layer 7 is applied again and patterned to form a portion of the metal plating layer and a portion of the metal electrode spaced apart from each other using the photoresist layer. Cover with 7.

Next, as shown in FIG. 2(,), unnecessary portions of the metal thin film λ are removed by etching to form metal electrodes Xa spaced apart from each other, and the photoresist layer 7 is removed. As a result, a metal plating layer according to the present invention is formed.

According to the present invention, the extremely complicated process of connecting and removing metal electrodes separated from each other, which was necessary in the conventional method, can be omitted, so that a metal plating layer can be efficiently formed on the metal electrodes. .

[Brief explanation of drawings]

FIG. 1 is a schematic diagram of a part of an optical sensor used in an image reading device, etc., and FIG. 2 (,) to (,) are diagrams showing the process of forming a metal plating layer on a metal electrode according to the present invention. It is. /...Insulating substrate, λ...Metal thin film 1.2a...
Metal electrode-3...Photoresist film, t...Metal plating layered agent Kiyoshi Inomata (7) Tsutomu 1 Zukatsu 2 Farm (G) Mo 2 People (C) Flood 2 Kuchi (e) Tsutomu 2 Figure (b) 2 Figure (d)

Claims (1)

[Claims] A thin metal film is laminated over the entire surface in a required range of an insulating substrate, an insulating film having a window on the surface of the insulating substrate corresponding to the location where the metal plating layer is to be provided is provided on the metal thin film, and a plating lead is attached to the metal thin film. The method is characterized in that the wires are connected, a metal plating layer is formed on the window portion, the insulating film is removed first, and then the metal thin film is etched into a predetermined shape. A method for forming a metal plating layer on a metal electrode.