JPS58140244A - Manufacture of metal base laminated board - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a metal base m-laminate plate used for various industrial purposes such as industrial equipment, cordless handsets, etc., and its purpose is to provide a metal base laminated plate with stable quality. 4. Conventional metal-based laminates bond the base metal and metal foil with a thin adhesive insulating layer, which tends to cause bonds, scratches, and pinholes, which reduces the withstand voltage of metal-based laminates. and caused a decrease in heat resistance.

The present invention solves the above-mentioned drawbacks, and since the adhesive border layer is formed by laminating a plurality of sheet-like resin materials, the thickness is more uniform than the conventional adhesive insulation M made from a single thin sheet-like resin material. It has excellent properties, and the probability of pinhole occurrence is lower than the pupil depth V, so the quality is stable and the withstand voltage and heat resistance can be improved. Batting method f details 1 ~ <Explanation> The metal plates used in the present invention are 00F1-4 aluminum plates, iron plates,
Stainless steel plates, Teitake plates, etc. alone or alloys or surface-treated plates. The adhesive insulating layer is a base material such as paper, glass woven fabric, synthetic fiber woven fabric, natural fiber woven fabric, etc., and Evogin resin, f+ is added to the base material such as polyester (1% [L phenol aHtit,
A resin-impregnated base material impregnated with resin or rubber such as polyimide, polyamide, polyurethane, or an adhesive insulating agent exclusively for resin or rubber is cast and applied onto a release film, and then dried and peeled off from -C. +'ft insulation sheet. The thickness of the contact r'61 insulating layer is not particularly limited, but it is preferably 10 to 200 microns in terms of overall IW, and it is necessary to layer it in multiple layers, and the larger the number of layers, the thicker it is. This is preferable because it becomes uniform and the probability of occurrence of bottle holes is low. As the metal foil, copper foil, aluminum foil, nickel foil, brass foil, etc. are used. Further, the adhesive insulating layer and the metal foil can be integrated on both sides of the base metal.

Next, the present invention will be explained using Example V.

Example A curing agent-containing epoxy resin was applied to a 1liI type film F: to a thickness of about microns, and after drying, it was peeled off to obtain an adhesive insulating sheet. Next, a copper foil with a thickness of 5 microns was placed and integrated on the surface of the aluminum plate with a thickness of 1H via two insulating sheets to obtain a metal base laminate.

Conventional example hardening agent-containing epoxy resin 't, Q type film + H 0
Process 1 in the same order as in Example except that micron was applied once.
- A metal base laminate was obtained. .

Comparing the metal base laminates of the example and the conventional example, the first
As is clear from the table, the quality of the metal base laminate of the present invention V
It was confirmed that the metal-based laminate of the present invention is excellent, with a t stability of 1 to 1 and good voltage resistance and heat resistance.

vK1 table patent applicant Matsushita Electric Works Co., Ltd. Representative Patent Attorney Toshimaru Takemoto (2 others)

Claims (1)

[Claims] (1) Surface contact of metal plate 7W#] In the metal base #i layer plate formed by disposing and integrating metal foil through the green layer, the adhesive insulating layer is formed by laminating multiple sheets of resin material. A method for manufacturing a metal-based reconnaissance board.