JPS58139435A - ボンディング方法 - Google Patents

ボンディング方法

Info

Publication number
JPS58139435A
JPS58139435A JP57022503A JP2250382A JPS58139435A JP S58139435 A JPS58139435 A JP S58139435A JP 57022503 A JP57022503 A JP 57022503A JP 2250382 A JP2250382 A JP 2250382A JP S58139435 A JPS58139435 A JP S58139435A
Authority
JP
Japan
Prior art keywords
loop
tool
wire
lead frame
moved
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP57022503A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0147893B2 (cg-RX-API-DMAC10.html
Inventor
Masayoshi Yamaguchi
政義 山口
Toshiro Tsuruta
鶴田　寿郎
Nobushi Suzuki
鈴木　悦四
Sumio Nagashima
永島　純雄
Koichi Chiba
宏一 千葉
Koichiro Atsumi
幸一郎 渥美
Noriyasu Kashima
規安 加島
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP57022503A priority Critical patent/JPS58139435A/ja
Publication of JPS58139435A publication Critical patent/JPS58139435A/ja
Publication of JPH0147893B2 publication Critical patent/JPH0147893B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W72/0711—
    • H10W72/01551—
    • H10W72/07141—
    • H10W72/075—
    • H10W72/07502—
    • H10W72/07511—
    • H10W72/07521—
    • H10W72/536—
    • H10W72/5363—
    • H10W90/756—

Landscapes

  • Wire Bonding (AREA)
JP57022503A 1982-02-15 1982-02-15 ボンディング方法 Granted JPS58139435A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP57022503A JPS58139435A (ja) 1982-02-15 1982-02-15 ボンディング方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57022503A JPS58139435A (ja) 1982-02-15 1982-02-15 ボンディング方法

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2242466A Division JPH03114238A (ja) 1990-09-14 1990-09-14 ボンディング方法

Publications (2)

Publication Number Publication Date
JPS58139435A true JPS58139435A (ja) 1983-08-18
JPH0147893B2 JPH0147893B2 (cg-RX-API-DMAC10.html) 1989-10-17

Family

ID=12084543

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57022503A Granted JPS58139435A (ja) 1982-02-15 1982-02-15 ボンディング方法

Country Status (1)

Country Link
JP (1) JPS58139435A (cg-RX-API-DMAC10.html)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6342135A (ja) * 1986-08-08 1988-02-23 Shinkawa Ltd ワイヤボンデイング方法
JPH03114238A (ja) * 1990-09-14 1991-05-15 Toshiba Corp ボンディング方法

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS501648A (cg-RX-API-DMAC10.html) * 1973-05-07 1975-01-09
JPS5041818U (cg-RX-API-DMAC10.html) * 1973-08-13 1975-04-28
JPS5451476A (en) * 1977-09-30 1979-04-23 Shinkawa Seisakusho Kk Device for bonding wires
JPS5458352A (en) * 1977-10-19 1979-05-11 Shinkawa Seisakusho Kk Method of bonding wire
JPS5466769A (en) * 1977-11-08 1979-05-29 Shinkawa Seisakusho Kk Device for bonding wires

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS501648A (cg-RX-API-DMAC10.html) * 1973-05-07 1975-01-09
JPS5041818U (cg-RX-API-DMAC10.html) * 1973-08-13 1975-04-28
JPS5451476A (en) * 1977-09-30 1979-04-23 Shinkawa Seisakusho Kk Device for bonding wires
JPS5458352A (en) * 1977-10-19 1979-05-11 Shinkawa Seisakusho Kk Method of bonding wire
JPS5466769A (en) * 1977-11-08 1979-05-29 Shinkawa Seisakusho Kk Device for bonding wires

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6342135A (ja) * 1986-08-08 1988-02-23 Shinkawa Ltd ワイヤボンデイング方法
JPH03114238A (ja) * 1990-09-14 1991-05-15 Toshiba Corp ボンディング方法

Also Published As

Publication number Publication date
JPH0147893B2 (cg-RX-API-DMAC10.html) 1989-10-17

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