JPS58139432A - 電子部品の樹脂モ−ルド方法 - Google Patents

電子部品の樹脂モ−ルド方法

Info

Publication number
JPS58139432A
JPS58139432A JP57022269A JP2226982A JPS58139432A JP S58139432 A JPS58139432 A JP S58139432A JP 57022269 A JP57022269 A JP 57022269A JP 2226982 A JP2226982 A JP 2226982A JP S58139432 A JPS58139432 A JP S58139432A
Authority
JP
Japan
Prior art keywords
resin
resin material
runner
pot
tablets
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP57022269A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6240850B2 (enExample
Inventor
Masashi Tarui
垂井　正志
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Home Electronics Ltd
NEC Corp
Original Assignee
NEC Home Electronics Ltd
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Home Electronics Ltd, Nippon Electric Co Ltd filed Critical NEC Home Electronics Ltd
Priority to JP57022269A priority Critical patent/JPS58139432A/ja
Publication of JPS58139432A publication Critical patent/JPS58139432A/ja
Publication of JPS6240850B2 publication Critical patent/JPS6240850B2/ja
Granted legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/02—Transfer moulding, i.e. transferring the required volume of moulding material by a plunger from a "shot" cavity into a mould cavity

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
JP57022269A 1982-02-15 1982-02-15 電子部品の樹脂モ−ルド方法 Granted JPS58139432A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP57022269A JPS58139432A (ja) 1982-02-15 1982-02-15 電子部品の樹脂モ−ルド方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57022269A JPS58139432A (ja) 1982-02-15 1982-02-15 電子部品の樹脂モ−ルド方法

Publications (2)

Publication Number Publication Date
JPS58139432A true JPS58139432A (ja) 1983-08-18
JPS6240850B2 JPS6240850B2 (enExample) 1987-08-31

Family

ID=12078041

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57022269A Granted JPS58139432A (ja) 1982-02-15 1982-02-15 電子部品の樹脂モ−ルド方法

Country Status (1)

Country Link
JP (1) JPS58139432A (enExample)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5258758A (en) * 1975-11-05 1977-05-14 Massachusetts Inst Technology Method of accelerating cooling of polymer particles
JPS56107559A (en) * 1980-01-30 1981-08-26 Mitsubishi Electric Corp Manufacture of resin-sealed semiconductor device

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5258758A (en) * 1975-11-05 1977-05-14 Massachusetts Inst Technology Method of accelerating cooling of polymer particles
JPS56107559A (en) * 1980-01-30 1981-08-26 Mitsubishi Electric Corp Manufacture of resin-sealed semiconductor device

Also Published As

Publication number Publication date
JPS6240850B2 (enExample) 1987-08-31

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