JPS58137839A - Production of mask for semiconductor - Google Patents

Abstract

PURPOSE:To save the labor and time for operation by forming plural mask elements having slight differences in size successively beforehand with one sheet of reticle and selecting the mask elements suited for the electrical characteristics of required semiconductor elements among the mask elements. CONSTITUTION:The same mask elements, as the elements formed in one sheet of reticle, for example, three mask elements A1, B1, C1 are arranged and disposed by each line or row on a master mask M. Wafer processes are accomplished by using such mask and the respective semiconductor elements A1', B1', C1' by the masks A1, B1, C1 are obtained by one time of the wafer processes. Since the three mask elements are contained with one sheet of reticle as mentioned above, just one sheet of the reticle is required, while three sheets of the reticles are required in the prior art.

Description

[Detailed Description of the Invention] (Technical Field of the Invention) The present invention relates to a method of manufacturing a semiconductor mask, and in particular provides a manufacturing method for selecting the dimensions of a mask used in the manufacture of semiconductor elements. be.

[Technical background of the invention]

A large number of semiconductor devices are formed by diffusing impurities into a semiconductor substrate to form active regions, photo-etching electrical insulating films, and forming electrodes or wiring patterns, but masks are used in many of the steps including the above. It is used. As the recent trend in semiconductor devices has been toward higher density, the patterns of the masks used have also become more and more minute.
The electrical characteristics of manufactured semiconductor devices are greatly influenced by the dimensional accuracy. A mask actually used in manufacturing semiconductor devices is a master mask or a copy mask from the viewpoint of mask manufacturing, and these masks are formed by projecting a reticle whose pattern size is reduced, for example, by 10 times. As shown in Fig. 1, the conventional method is to create, for example, three types of reticles (not shown) with pattern sizes that have slight differences in their dimensions, and to form masks from these three types of reticles (not shown). 3).

(B), (Q are obtained. Then, using these masks, semiconductor elements (X), (white, (
d) was formed and evaluated, and a suitable mask pattern was selected.

[Problems with background technology]

According to the background art, there are problems in that the suitability of the mask pattern is often erroneously determined due to slight differences that constantly occur in the wafer process, and that the reticle is expensive because it requires, for example, three reticles.

[Purpose of the invention]

The present invention provides a method for manufacturing a semiconductor mask to improve the problems of the background art.

[Summary of the invention]

When manufacturing a glass mask used in the manufacture of semiconductor devices, a plurality of mask elements having slight differences in dimensions are sequentially formed on a single reticle in advance, and one of the mask elements is matched to the required electrical characteristics of the semiconductor device. The purpose of this is to select the items to be used.

[Embodiments of the invention]

Next, details will be explained with reference to the drawings of its example. The mask (master mask or copy mask) shown in FIG. 2 includes three mask elements (AI
), (Bt), and (C1) are arranged one by one in each row or column. Next, a wafer process is performed using this mask, and the mask (AI) is formed in one wafer process.
, (1, (Semiconductor element (AI') by C-.

〔Effect of the invention〕

According to this invention, first, three mask elements can be accommodated in one reticle, so one reticle is required instead of three in the past, which is an economical advantage, and three reticles can be created and each can be used as a mask. The effort required to form and carry out the wafer process, as well as the materials, labor, and time involved in all aspects of wafers and wafer processing, can be significantly reduced. Next, since the wafer process only needs to be carried out once, slight variations in process conditions are no longer a problem. This is extremely effective when selecting mask elements, which is often done in a timely manner.

[Brief explanation of drawings]

FIG. 1 is a process diagram for explaining a conventional method, and FIG. 2 is a process diagram for explaining a method of one embodiment. AH* J s CI Mask elements A, , B,
, C, semiconductor element M mask

Claims (1)

[Claims] In order to manufacture a glass mask used in the manufacture of semiconductor devices, a plurality of mask elements having minute differences in size are sequentially formed using one reticle in advance, and the required electrical characteristics of the semiconductor device are determined from among the mask elements. 1. A method for manufacturing a semiconductor mask, characterized by selecting a mask that is compatible with the characteristics ζ.