JPS58134441A - Treating device for wafer - Google Patents

Abstract

PURPOSE:To load a wafer onto a clean pallet at all times by providing the transfer path of the pallet transferring the wafer with a liquid washing and treating section and periodically washing the pallet. CONSTITUTION:Small holes 2 for cutting a washing liquid are formed to the bottom or side surfaces of a wafer encasing box 1 made of teflon, and a driving wheel 5 is driven 4 by a command from a central controller. The driving section 4 has hermetically sealed structure and an antenna 6 for washing resistance. Treatment 22-25, such as diffusion, evaporation, development, etc. is executed, the reading of rod number and the handling, etc. 26 of the wafer from the pallet are executed, and the pallet is transferred along a path 27, and made wait in a path 28. These operation is all controlled by the command from the central controller. According to such constitution, the pallet and a carrier can be washed without being removed from a line, and the degree of purity of the wafer can also be maintained sufficiently when the degrees of purity of the pallet and the carrier are controlled. The structure of the transfer path can be simplified, and the device also having excellent cost and spatial efficiency is obtained.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to improvements in automation technology for LSI manufacturing processes.

1 Ojili industry entered the era of ultra-LSI with the start of mass production of 64Kbit RAM. In addition, 256Kl)it RAM, which is currently in the prototype research stage, is expected to be commercialized in a few years. For 256Kbit RAM, the pattern size is 1-LJSμat, and K is a highly lean manufacturing environment and precision manufacturing process because it is integrated into a chip and produces 60 nine elements. It is necessary to convert it to imm・7'042
Process automation involves automating all the dozens of types of manufacturing equipment that make up the L8I manufacturing line, and using wafer transfer equipment to manufacture i! There is a need for an L8 automated manufacturing system that can automatically transfer wafers from one location to another and centrally control these devices using a computer system. It is said that manufacturing such an LSI requires 100,150 steps such as cleaning, heat treatment, impurity introduction steps, etc., and the miniaturization and high integration of LSIs requires a highly clean manufacturing environment.

At the L8 manufacturing station, gas flow rate, gas composition, ff1 degree,
By controlling the degree of vacuum... things that are progressing above! Since physical and chemical changes are indirectly controlled, if conditions such as thermal uniformity that depend on the device shape are satisfied, 1
There is no distinction between sheet processing and batch processing sections in terms of controllability and reproducibility.In fact, batch processing is superior in terms of mass production, and automation of batch processing is also being considered.

Therefore, wafer handling is performed by transferring urchins between a Teflon carrier and a quartz carrier, and a cassette-to-cassette method is used.

Possible wafer transfer methods include a single wafer transfer method using an air truck and a batch transfer method in which wafers are stored in a cassette such as a Teflon carrier and transferred.

The methods currently used for transporting single wafers include air bearing methods, rubber belt methods, and mechanical methods. All of these methods have a self-driving mechanism for the transfer path, and have drawbacks such as ■maintenance of cleanliness, ■dealing with changes in equipment layout, and ■changes in the transfer path.

First, in the wafer bulk transfer method, empty wafer carriers are moved to a position where they can be loaded onto the UNINO unloader, and the empty wafer carriers are loaded onto the wafer unloader using a hand. A wafer to be processed is loaded into a wafer loader and an empty wafer carrier is loaded into a wafer unloader, and then wafer processing can be started. When the processing is completed, the nine wafer carriers containing the wafers are manually loaded from the wafer unloader and transferred to the processing section where the next processing will be performed.

By the way, in the wafer bulk transfer method, the pallet that transfers the wafer carriers is used continuously for a long time, so it is possible that dust due to peeling of the vapor deposited film or dust from the air may accumulate and cause problems. .

The present invention is based on the above-mentioned 0-point review
A pallet for transferring wafers, a transfer path for the pallet,
at least one connected to said pallet transfer path; 11.・、
, 1. ,.

In a processing device that has a wafer processing section and a control device that transfers the pallet to a predetermined wafer processing section and processes the wafers on the pallet in the processing section, a pallet liquid cleaning processing section is provided on the pallet transfer path. and the pants) K
The present invention provides a wafer processing apparatus characterized by having nine cleaning liquid drains.

The present invention is a Unino transport system that has a cleaning process in order to eliminate contamination during wafer transport, and transports the wafer storage section where wafers are stored and a 9 carrier or Uni/1 unit is placed, and the UniNo/Storage section. By periodically (automatically) cleaning the pallet with the drive part, the 2 Always Clean Uninow is characterized by being mounted on a noklet.O Below, embodiments of the present invention will be described in detail. Describe.

FIG. 1 is a perspective view of the pallet of the present invention, and numeral 1 is a storage box for storing a single sea urchin or a carrier on which a sea urchin is placed. On the bottom or side of the UniNo storage box 1, there is a hole to make it easier to drain the liquid when cleaning the Noclet.
A small hole 2 is provided as a cleaning liquid cutter to facilitate drying. 3 is a freewheel installed in the Uni-No storage box. The drive section has one communication control section and a drive mechanism, and is driven by commands from the central control processing unit. 6 is a drive shaft.

The wafer storage box 1 can be made of resin such as Teflon or PVC. The drive part number is sealed with resin etc. and has a nine structure.
In addition, it is also possible to provide a cleaning-resistant antenna like 6, which can be used for cleaning with a cleaning liquid.

Figure II2 is a schematic diagram of the unino processing device of the present invention.
21 is a pallet cleaning processing section, 22 to 25 are diffusion, ODD
, evaporation, and the current processing unit 1lt-; 26 is a wafer carrier node link robot that performs lot collection and handling of wafers from pallets; o2;
1 is a pallet transfer path, and 28 is a pallet waiting path. 0 Pallet transfer, pallet O-washing S, handling robot 26 (16 productions, processes such as diffusion, ODD, vapor deposition, etc. are carried out by commands from a central controller (not shown). controlled.

The present invention has the following functions: In order to maintain the cleanliness of the pallets, Tsukuret cleaning devices are installed at nine locations branching off from the transfer path to periodically clean the pallets. Nine carriers can also be washed in one go.

■ The wafer is housed in a carrier and is loaded onto a pallet and transported.

■ The pallet has a self-propelling function and moves according to commands from the central control panel.

■ Unused pallets are kept on standby in the pallet waiting aisle.

It has a round transfer path that connects each C wafer process ((connection and assembly can be done freely).

The C pallet is slightly larger than the carrier and can be made more compact.

■ There is a wafer carrier □handling robot at the IN and OUT sections of each process, and it has the function of picking up the rotor and handling carriers from pallets.

The present invention has the following features and effects.

■ Palette and gear? A can be cleaned without removing it from the line.

■ Regarding cleanliness [K], if you manage the cleanliness of the rounding pallet and the carrier that are transported without wafers coming in direct contact with them, the cleanliness of UNINO-O can be satisfied. It is space efficient and transfer route can be changed easily.

[Brief explanation of the drawing]

Iris 1511 is a perspective view of the pallet of the present invention, and figure IN2 is a schematic diagram of the wafer processing device of the present invention. 1: Wafer storage box, number: drive section, 21: wafer cleaning processing section, 21: pallet transfer path.

Claims (1)

[Claims] (1) A pallet for transferring wafers, a transfer path for the pallet, and at least one ohm connected to the pallet transfer path
It has an evaporation processing section and a control device for transferring the pallet to a predetermined wafer processing section and processing the wafers in the pallet in the evaporation processing section, and the pallet liquid is connected to the transfer path of the pallet. Weno treatment equipment that has a cleaning treatment section that removes 9 t% mold. The weno 1 processing apparatus according to claim 1, wherein the pallet includes a weno storage box and a drive section.