JPS58127652U - Cooling structure for semiconductor devices - Google Patents
Cooling structure for semiconductor devicesInfo
- Publication number
- JPS58127652U JPS58127652U JP2415582U JP2415582U JPS58127652U JP S58127652 U JPS58127652 U JP S58127652U JP 2415582 U JP2415582 U JP 2415582U JP 2415582 U JP2415582 U JP 2415582U JP S58127652 U JPS58127652 U JP S58127652U
- Authority
- JP
- Japan
- Prior art keywords
- cooling structure
- semiconductor devices
- cooling piece
- abstract
- tin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図は従来の実施例による半導体素子とアルミニウム
製冷却片の側面図、第２図は本考案の一実施例である半
導体素子とアルミニウム製冷却片の側面図である。
１・・・・・・半導体素子、２・・・・・・銅ポスト、
３・・・・・・ニッケルメッキ部、４・・・・・・アル
ミニウム製冷却片、５・・・・・・銅拡散、銅メッキ、
銀メツキ部、６・・・・・・錫゛メ゛シキ部。FIG. 1 is a side view of a semiconductor element and an aluminum cooling piece according to a conventional embodiment, and FIG. 2 is a side view of a semiconductor element and an aluminum cooling piece according to an embodiment of the present invention. 1... Semiconductor element, 2... Copper post,
3...Nickel plated part, 4...Aluminum cooling piece, 5...Copper diffusion, copper plating,
Silver plating part, 6...Tin plating part.
Claims (1)
ウム製冷痴片との接触面に錫または錫合金を固着したこ
とを特徴とする半導体素子の冷却構造。1. A cooling structure for a semiconductor device, which is used in contact with an aluminum cooling piece, and is characterized in that tin or a tin alloy is fixed to the contact surface with the aluminum cooling piece.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2415582U JPS58127652U (en) | 1982-02-24 | 1982-02-24 | Cooling structure for semiconductor devices |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2415582U JPS58127652U (en) | 1982-02-24 | 1982-02-24 | Cooling structure for semiconductor devices |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS58127652U true JPS58127652U (en) | 1983-08-30 |
Family
ID=30036160
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2415582U Pending JPS58127652U (en) | 1982-02-24 | 1982-02-24 | Cooling structure for semiconductor devices |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58127652U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2013254925A (en) * | 2012-05-10 | 2013-12-19 | Nippon Seiki Co Ltd | Electronic circuit device |
-
1982
- 1982-02-24 JP JP2415582U patent/JPS58127652U/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2013254925A (en) * | 2012-05-10 | 2013-12-19 | Nippon Seiki Co Ltd | Electronic circuit device |
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