JPS58125908A - Container of rectangular piezoelectric oscillator - Google Patents

Container of rectangular piezoelectric oscillator

Info

Publication number
JPS58125908A
JPS58125908A JP21392381A JP21392381A JPS58125908A JP S58125908 A JPS58125908 A JP S58125908A JP 21392381 A JP21392381 A JP 21392381A JP 21392381 A JP21392381 A JP 21392381A JP S58125908 A JPS58125908 A JP S58125908A
Authority
JP
Japan
Prior art keywords
container
insulating substrate
rectangular
recess
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP21392381A
Other languages
Japanese (ja)
Other versions
JPS644692B2 (en
Inventor
Masakazu Takeuchi
正和 竹内
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kyocera Crystal Device Corp
Original Assignee
Kyocera Crystal Device Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kyocera Crystal Device Corp filed Critical Kyocera Crystal Device Corp
Priority to JP21392381A priority Critical patent/JPS58125908A/en
Priority to DE8282101485T priority patent/DE3263495D1/en
Priority to EP19820101485 priority patent/EP0059447B1/en
Publication of JPS58125908A publication Critical patent/JPS58125908A/en
Publication of JPS644692B2 publication Critical patent/JPS644692B2/ja
Granted legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H03ELECTRONIC CIRCUITRY
    • H03HIMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/02Details
    • H03H9/05Holders; Supports
    • H03H9/10Mounting in enclosures
    • H03H9/1007Mounting in enclosures for bulk acoustic wave [BAW] devices
    • H03H9/1014Mounting in enclosures for bulk acoustic wave [BAW] devices the enclosure being defined by a frame built on a substrate and a cap, the frame having no mechanical contact with the BAW device

Landscapes

  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)

Abstract

PURPOSE:To realize an automated working process and at the same time to improve the airtightness of a container of a rectangular piezoelectric oscillator, by forming projected parts at both sides of a place where an insulated substrate contacts with a cover and then melting and adhering those projected parts to each other to facilitate the assembling work of the container and a piezoelectric oscillating plate while is stored to the container. CONSTITUTION:A depressed part 501 is formed on a main plane of one side of a rectangular insulated substrate 500 of thermoplastic resin, and lead terminals 200 and 300 are extended up to the cavity of the part 501 from both terminal faces in the lengthwise direction and fixed there. At the same time, exciting electrodes 102 and 103 and lead-out electrodes 104 and 105 are formed at both terminal faces and its both ends of a crystal oscillating plate 100 respectively. The plate 100 is set on the part 501 of the substrate 500, and the electrodes 104 and 105 are set on the terminals 200 and 300. In addition, a cover 600 is put over the opening part of the part 501. Then projected parts 603 and 508 are formed at both sides of a place where the substrate 500 contacts with the cover 600. These parts 603 and 508 are melted and adhered to each other. This facilitates the assembling work as well as to improve the airtightness of a container of a rectangular piezoelectric oscillator.

Description

【発明の詳細な説明】 本発明は、矩形状の圧電振動板を気密保持する容器の改
良に関する。
DETAILED DESCRIPTION OF THE INVENTION The present invention relates to an improvement in a container for airtightly holding a rectangular piezoelectric diaphragm.

この種の容器は、圧電振動子の安定な発振又は共振を維
持させるために、その容器内部にチッソガスを封入した
り、真空にして使用させることから、その特性としては
先ず気密性が厳しく要求される。この要求に対して、半
田付、抵抗溶接及び冷開圧接の気密容器が出現したこと
から、一応と追求するにも限界を来たしてbまた。
In order to maintain stable oscillation or resonance of the piezoelectric vibrator, this type of container is used by sealing nitrogen gas inside the container or by creating a vacuum, so airtightness is strictly required. Ru. In response to this demand, with the advent of soldering, resistance welding, and cold-open pressure welding airtight containers, we have reached a limit in our pursuit.

一方、比較的安価な気密容器として、共にシュ5コシ樹
脂で成形された、平面が小判形状のベースとそのベース
の外側面を内側面で嵌合挿入して被せるフタとから成る
気密容器があるが、これはベースの外側面とフタの内側
面との接する部分を高温加熱により接合しようとしてい
るものの、その接合が全周にわたって行なうことができ
ず、気密容器といえども、その気密性の点で問題が残さ
れてVまた、 本発明の第1の目的は、気密性の向上を図った矩形圧電
振動子の容器を提供することであり、第2の目的は、こ
の容器とそこに収容保持する圧電振動板との組立作業を
容易にし、その自動化を可能し、圧電振動子のコスト低
減を図った矩形圧電振動子の容器を提供することである
On the other hand, as a relatively inexpensive airtight container, there is an airtight container that consists of a base with an oval-shaped plane and a lid that fits and inserts the outside surface of the base with the inside surface to cover it, both of which are molded from Sh5Koshi resin. However, although this method attempts to bond the contact area between the outer surface of the base and the inner surface of the lid by high-temperature heating, the bond cannot be made all around the circumference, and even though it is an airtight container, the airtightness is compromised. The first object of the present invention is to provide a container for a rectangular piezoelectric vibrator with improved airtightness, and the second object is to provide a container for a rectangular piezoelectric vibrator with improved airtightness. It is an object of the present invention to provide a container for a rectangular piezoelectric vibrator, which facilitates assembly work with a piezoelectric vibrating plate to be held, enables automation thereof, and reduces the cost of the piezoelectric vibrator.

以下、本発明を圧電振動板として水晶振動板を取り挙げ
て、実施例図面を参照して詳細に説明するO 第1図は水晶振動板を示し、同図(イ)が正面図会1 及び同図(0)がΦ面図である。水晶振動板100は、
矩形形状したAT;ット水晶板101の両主面中央部1
分に互に対向させた厚みすべり振動すべき励振電極10
2 、 lo3と、その励振電極102 、 103か
ら互に逆向の長手方向に向って周辺とその端面を通して
対向する周辺まで引き出した引出電極104゜105と
を配置して肴り、これらの電極102〜105は金、銀
などの金属を真空蒸着することにより形成される。この
水晶板101の長手方向端面付遅番よ、その端面に進む
に従って厚み寸法が減tJsする、ν)わゆるベベル加
工を施して、励振電極102 、103の下のエネル千
−閉じ込め効果を高めている。引出型@101+ 、 
105の端部は、導電接着を確実にするために、その幅
寸法を水晶板101の輻いつばいに広くして0る。
Hereinafter, the present invention will be explained in detail by taking up a crystal diaphragm as a piezoelectric diaphragm with reference to embodiment drawings. The figure (0) is a Φ plane view. The crystal diaphragm 100 is
The center portion 1 of both main surfaces of the rectangular AT; cut crystal plate 101
Excitation electrodes 10 to be vibrated through thickness shear, facing each other
2, lo3 and extraction electrodes 104° and 105 drawn out from the excitation electrodes 102 and 103 in mutually opposite longitudinal directions through the periphery and the end face to the opposing periphery, and serve these electrodes 102 to 103. 105 is formed by vacuum deposition of metal such as gold or silver. The thickness of this crystal plate 101 with end faces in the longitudinal direction decreases tJs as it advances towards the end faces. ν) So-called bevel processing is applied to enhance the energy confinement effect under the excitation electrodes 102 and 103. There is. Drawer type @101+,
The width of the end portion 105 is made as wide as the convergence of the crystal plate 101 in order to ensure conductive adhesion.

第2図は、リ−「端子の正面図であり、このリード端子
200 、300は、共通保持部400により連結され
ていることから、プレス加工により所定数分を一体形成
している。このり−「端子200 、300の材質は、
後述する絶縁基板500の熱膨張係数と大略等しい熱膨
張係数を有する金属、本例では黄5 銅(熱膨張係数: 1,8〜2,3 X 10 /de
g )を使用している。そして、とのり−r端子200
 、300の形状は、前述した水晶振動板100の引出
電極104゜105と等型接続する接続端部201 、
301と、交互に切り込みを形成した弾性部202 、
302と、後述する絶縁基板500に埋設され、引張り
強度を確保するストッ+< 203 、303と、外部
側端子部204゜304とから成る。
FIG. 2 is a front view of the lead terminal. Since the lead terminals 200 and 300 are connected by a common holding part 400, a predetermined number of lead terminals are integrally formed by press working. - "The material of the terminals 200 and 300 is
A metal having a thermal expansion coefficient approximately equal to the thermal expansion coefficient of the insulating substrate 500 described later, in this example, yellow copper (thermal expansion coefficient: 1.8 to 2.3 x 10 /de)
g) is used. And Tonori-r terminal 200
, 300 are shaped like connection ends 201 that are equiformly connected to the extraction electrodes 104 and 105 of the crystal diaphragm 100 described above.
301, an elastic part 202 in which cuts are formed alternately,
302, a stock 303 which is embedded in an insulating substrate 500 to ensure tensile strength, and an external terminal portion 204 and 304.

絶縁基板500は、第3図(イ)の正面図及び同図(0
)のA−A断面図に示すように、4隅に8面加工してb
)るものの基本的には矩形形状板であり、その上方の主
平面からλ前記矩形形状板と相似形であって比較的小さ
し)矩形形状の開口部をもった凹所501を形成し、そ
の凹・所501にある底面にて前述LりIJ −Fi子
200 、 :300 ノ[[部201 、301と弾
性部202 、302を露出させ、絶縁基板500の長
手方向両端面から凹所501の内側面までり−r端子2
00 、300のス計ツへ203 、303を埋設して
貫通固定している。絶縁基板500の材質は、凝集力、
接着力、たわみ性及び他樹脂との相溶性などの特徴をも
った熱可塑性樹脂であり、本例ではポ5 リカーポネー計樹脂(熱膨張係数:2〜3×10/de
ε)を使用してψる。凹所501の内部には、後述する
フタロ00を載置する段差面502 、503 。
The insulating substrate 500 is shown in the front view of FIG.
), as shown in the A-A cross-sectional view of
) is basically a rectangular plate, and from its upper main plane is formed a recess 501 having a similar shape to the rectangular plate and having a relatively small) rectangular opening; At the bottom of the recess/location 501, the above-mentioned L-shaped IJ-Fi element 200 is exposed. -R terminal 2 to the inner surface of
203 and 303 are buried and fixed through the stems of 00 and 300. The material of the insulating substrate 500 has cohesive force,
It is a thermoplastic resin with characteristics such as adhesive strength, flexibility, and compatibility with other resins.
ψ) using ε). Inside the recess 501 are step surfaces 502 and 503 on which Phthalo 00, which will be described later, is placed.

504 、505がそれぞれ4隅に形成され、絶縁基板
500の凹所501の上方には、その凹所501の周縁
に沿って外周縁付近の内側に溝506を形成し、このr
P4506と凹所501の内側面との間に溝506の底
面から上方主平面507上り高く突き出した、先端に行
く程細くな−)た凸部508を形成してb)る。この凸
部508の変形例としては、一定の厚みで上方主平面5
07上に(溝506の形成は任意的なものであるが・あ
った方が後述する熱板による溶融固着の仕上りがよい。
504 and 505 are formed at each of the four corners, and above the recess 501 of the insulating substrate 500, a groove 506 is formed inside near the outer periphery along the periphery of the recess 501.
A convex portion 508 is formed between P4506 and the inner surface of the recess 501, projecting upward from the bottom of the groove 506 to the upper main plane 507, and becoming thinner toward the tip. As a modification of this convex portion 508, the upper main plane 5 has a constant thickness.
Although the formation of grooves 506 is optional, the finish of melting and fixing using a hot plate, which will be described later, will be better if grooves 506 are formed on the grooves 07.

)一定の厚みで突き出したものでもよいが、その厚みは
溶融の点で1〜2mm程度であることが好ましX/)。
) It may be a protruding piece with a certain thickness, but the thickness is preferably about 1 to 2 mm from the viewpoint of melting.X/).

フタロ00は、第4図(イ)の正面図及び同図(0)の
A−A断面図に示すように、前述した絶縁基板500の
凹所501の内側面と嵌合する矩形板であり、その材質
も絶縁基板500と同様、ポリカーボネート樹脂で成形
されてb)る。そして、フタロ00の周縁に沿って外周
縁付近にも絶縁基板500の溝506と対称的に溝60
1を形成し、このI 601とフタロ00の外側面との
間に、絶縁基板500の凸部508と同様、溝601の
底面からフタロ00の上面602より高く突き出した、
先端に行く程細くなった凸部603を形成している。こ
の凸部603の変形例も前述した凸部508のものと同
様である、 前述した水晶振動板100ば、第5図(イ)の正面図及
び同図(ロ)のA−A断面図で示されるように、リー「
端子200 、3007F)接続端部201 、301
 (7)上に、その引出電極104 、1.05の両端
部を位置合わせして載置され、導電性接着剤701 、
702 (本例:商品名「F−タイト」藻食化成)を両
者の接続個所に塗布して、結局、水晶振動板1.00は
り−r端子200 、300にて2点で電気的兼機械的
に接着される。
Phthalo 00 is a rectangular plate that fits into the inner surface of the recess 501 of the insulating substrate 500, as shown in the front view of FIG. 4(A) and the AA cross-sectional view of FIG. , its material is also molded from polycarbonate resin, similar to the insulating substrate 500 b). Grooves 60 are also formed along the periphery of Phthalo 00 near the outer periphery symmetrically with the grooves 506 of the insulating substrate 500.
1 is formed, and between this I 601 and the outer surface of Phthalo 00, similar to the convex portion 508 of the insulating substrate 500, a groove 601 protrudes higher than the top surface 602 of Phthalo 00 from the bottom surface of the groove 601.
A convex portion 603 is formed that becomes thinner toward the tip. The modified example of this convex portion 603 is also similar to that of the convex portion 508 described above. As shown, Lee “
Terminal 200, 3007F) Connection end 201, 301
(7) is placed on top of the lead electrode 104, 1.05 with both ends thereof aligned, and conductive adhesive 701,
702 (this example: product name "F-Tight" Moshoku Kasei) was applied to the connection points between the two, and eventually the crystal diaphragm 1.00 beam - r terminals 200 and 300 were used to connect electrically and mechanically at two points. It is glued to the surface.

前述したフ5600は、第6図(イ)の正面図及び同図
(0)のA−A断面図で示すように、絶縁基板500の
凹所501内の段差面502 、503 、504 、
505に載置され、絶縁基板500の凸部508の内側
面とフタロ00の凸部603の外側面とが接し、この互
に接する部分を上方から熱板800を当接して加熱し、
両者の凸部508 、603を溶融する。このときの加
熱温度は、絶縁基板500とフタロ00の融点より30
〜100 deg高い温度が好ましく、本例では300
 ’Cである。この加熱の作用については、凸部508
゜603の構造により、その先端部分の熱審量が比較的
少なく、容易に溶融させることができ、更に、一度溶融
が開始すると、その次の層(下層)の凸部603 、5
08の部分を次々に溶融させることになり、両者の接す
る部分の大半が溶融される。この溶融された部分は、熱
板80oから解放させて室温放置により固着される。な
お、溶融時における熱板800との貼り付きを防止する
ため、熱板800の当接部分にデフ0シコーテイング又
は両者の間にテフロンなどの耐熱性非粘着性のシートを
介在させることは有効である。
As shown in the front view of FIG. 6(A) and the A-A cross-sectional view of FIG.
505, the inner surface of the convex portion 508 of the insulating substrate 500 and the outer surface of the convex portion 603 of Phthalo 00 are in contact, and this mutually contacting portion is heated by contacting the hot plate 800 from above,
Both protrusions 508 and 603 are melted. The heating temperature at this time is 30° below the melting point of the insulating substrate 500 and Phthalo 00.
~100 deg higher temperature is preferred, in this example 300 deg higher temperature
'C. Regarding this heating effect, the convex portion 508
Due to the structure of ゜603, the amount of heat at the tip is relatively small and it can be easily melted.Furthermore, once melting starts, the convex portions 603, 5 of the next layer (lower layer)
The parts 08 are melted one after another, and most of the parts where the two touch each other are melted. This melted portion is released from the hot plate 80o and left to stand at room temperature to be fixed. In addition, in order to prevent sticking with the hot plate 800 during melting, it is effective to apply a differential coating to the abutting part of the hot plate 800 or to interpose a heat-resistant non-adhesive sheet such as Teflon between the two. It is.

溶融固着された容器は、第7図(イ)の正面図及び同図
のA−A断面図で示すように、水晶振動板100を収容
保持して気密容器を構成する。なお、リート端子200
 、300 ノ外部([lf!lo4.304は、組立
終了後に共通保持部400から分離される。
The fused and fixed container accommodates and holds the crystal diaphragm 100 to form an airtight container, as shown in the front view of FIG. In addition, the lead terminal 200
, 300 outside ([lf!lo4.304 is separated from the common holding part 400 after assembly is completed.

本発明は、以上のような構造をもつことから、絶縁基板
とフタとの溶融により気密性を確保することができ、こ
の気密性につblては1006Gまで熱した水中に入れ
てテストする、いわゆる煮沸試験に充分合格している。
Since the present invention has the above structure, airtightness can be ensured by melting the insulating substrate and the lid, and this airtightness is tested by immersing it in water heated to 1006G. It fully passed the so-called boiling test.

また、水晶振動板の絶縁基板内への組立作業は、凹所内
に載置することと、導電性接着剤を塗布することで完了
することから非常に容易であり、その自動化も可能であ
る。
Further, the assembly work of the crystal diaphragm into the insulating substrate is very easy because it can be completed by placing it in a recess and applying a conductive adhesive, and it can also be automated.

更に本発明では、水晶振動板を載置するり−r端子に弾
性部を形成し、この弾性部の位置を絶縁基板の貫通固声
個所と水晶振動板の接着個所との間に定めることから、
水晶振動板の熱膨張係数(5 0,7〜1,3 X 10 /deg )と興ナル熱膨
張係数ノ絶縁基板の材質(本例:ポリカーボネート樹脂
2〜5 3×10 ハeg )を使用しても、両者の熱膨張係数
の差による熱膨張収縮に基づく応力を前記弾性部にて逃
げさせることができる。その結果、水晶振動板をり−r
端子に強固に接着しても、支持系の温度特性の影響を解
消させ、水晶振動子本来の周波数温度特性を出現させる
と共に、導電性接着個所の剥離事故を防止することがで
きる。
Furthermore, in the present invention, an elastic part is formed on the -r terminal on which the crystal diaphragm is placed, and the position of this elastic part is determined between the penetration solidification part of the insulating substrate and the bonding part of the crystal diaphragm. ,
The thermal expansion coefficient of the crystal diaphragm (50.7~1.3 x 10/deg) and the material of the insulating substrate (this example: polycarbonate resin 2~53 x 10/deg) are used. However, stress due to thermal expansion and contraction due to the difference in thermal expansion coefficients between the two can be released through the elastic portion. As a result, the crystal diaphragm is
Even if it is firmly adhered to the terminal, it is possible to eliminate the influence of the temperature characteristics of the support system, to allow the original frequency temperature characteristics of the crystal resonator to appear, and to prevent the accidental peeling of the conductive adhesive portion.

以上の実施例に#いて、絶縁基板とフタの材質である熱
可塑性樹脂としてポリカーボネート樹脂を取り挙げたが
、この他の材質例としては、エチレシー!酸じニルコポ
リマー(EVA ) 、gリエチレシ了タクチツクボリ
プ0じレジ(APP)、エチレン−アクリル酸エチルコ
ポリマー(EEA)、ホリアミF、Xリエステル、ポリ
フエニレシサルファイF(PPS)、Xニフエニレンλ
キ寸イF(PPO)、ポリブチレジテレフタレート(P
BT)などが挙げられる。
In the above embodiments, polycarbonate resin was used as the thermoplastic resin material for the insulating substrate and the lid, but other examples of materials include Echireshi! Acidinyl copolymer (EVA), ethylene-ethyl acrylate copolymer (APP), ethylene-ethyl acrylate copolymer (EEA), polyester F, polyester, polyphenylene sulfide F (PPS),
Kisunii F (PPO), polybutylene terephthalate (P
BT), etc.

また、圧電振動板として水晶振動板の他に、夕、/タル
酸リチウム、ニオブ酸リチウム、圧電t5ミックなどが
挙げられ、弾性部の形状として交互にスリット状の切り
込みを挙げたが、この他に半円、三角形(V字状)、U
字状などの切り込みでありでもよい。更にまた、本発明
で05絶縁基板、フタ及び圧・電板の矩形状とは、幾何
学的に厳密な意味での矩形状に尿定されず、要は主平面
上の直交する2辺の寸法のうち、一方の辺の寸法が他方
の辺の寸法よりも長い形状のものであり、4隅の8面加
工及び両端面の半円加工(小判形状)など付加的形状を
施したものも当然包含される。
In addition to the crystal diaphragm, other piezoelectric diaphragms include lithium/talate, lithium niobate, and piezoelectric t5mic, and the shape of the elastic part is alternately slit-like cuts, but there are others. semicircle, triangle (V-shape), U
It may be a cut in the shape of a letter or the like. Furthermore, in the present invention, the rectangular shape of the 05 insulating substrate, the lid, and the piezoelectric plate is not defined as a rectangular shape in a strict geometric sense, but is essentially a rectangular shape of two orthogonal sides on the main plane. Among the dimensions, one side is longer than the other side, and additional shapes such as 8-sided machining on the four corners and semicircular machining (oval shape) on both end faces are also available. Naturally included.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本発明の圧電振動板として実施例である水晶振
動板を示し、同図(イ)が正面図及び同図([1)側面
図である。第2図は本発明のり−r端子の実施例を示す
正面図である。第3図は本発明の絶縁基板の実施例を示
し、同図(イ)が正面図及び同図(0)がA−A断面図
である。第4図は本発明のフタの実施例を示し、同図(
イ)が正面図及び同図(0)がA−A断面図である。第
5図は水晶振動板を絶縁基板内に載置した状態の実施例
を示し、同図(イ)が正面図及び同図(0)がA−A断
面図である。第6図は絶縁基板にフタを被せた状態の実
施例を示し、同図(イ)が正面図及び同図(0)がA−
A断面図である。第7図は絶縁基板とフグの両凸部を溶
融固着した後の矩形水晶振動子の容器の実施例を示し、
同図(イ)が正面図及び同図(ロ)がA−A断面図であ
る。 100・・・水晶振動板、101・0・水晶板、102
 。 103ψ・―励振電極、 104 、1.05 、・、
引出電極、200 、300・・・リート端子、 50
0φ・・絶縁基板、501−・・凹所、508・・・凸
部、600.。 ・フタ、603・・・凸部、 701 、702・・−
導電性接着剤
FIG. 1 shows a crystal diaphragm which is an embodiment of the piezoelectric diaphragm of the present invention, and FIG. 1(A) is a front view and FIG. 1(A) is a side view. FIG. 2 is a front view showing an embodiment of the glue-r terminal of the present invention. FIG. 3 shows an embodiment of the insulating substrate of the present invention, and FIG. 3(A) is a front view and FIG. 3(0) is a sectional view taken along line A-A. FIG. 4 shows an embodiment of the lid of the present invention.
A) is a front view, and (0) is a sectional view taken along line A-A. FIG. 5 shows an embodiment in which a crystal diaphragm is placed within an insulating substrate, and FIG. 5(a) is a front view and FIG. 5(0) is a sectional view taken along line A-A. Figure 6 shows an embodiment in which the insulating substrate is covered with a lid, where (a) is a front view and (0) is an A-
It is an A sectional view. FIG. 7 shows an example of a container for a rectangular crystal resonator after the insulating substrate and both convex portions of the pufferfish are melted and fixed,
The same figure (a) is a front view, and the same figure (b) is an AA sectional view. 100...Crystal diaphragm, 101.0.Crystal plate, 102
. 103ψ--excitation electrode, 104, 1.05,...
Extracting electrode, 200, 300...Lead terminal, 50
0φ...Insulating substrate, 501--Concavity, 508...Protrusion, 600. .・Lid, 603...Protrusion, 701, 702...-
conductive adhesive

Claims (1)

【特許請求の範囲】[Claims] (1)  熱可塑性樹脂から成る矩形状の絶縁基板の一
方の主平面から凹所を形成し、リート端子を前記絶縁基
板の長手方向の両端面から前記凹所の空所までそれぞれ
貫通固定すると共に、前記空所にて露出し、矩形状の圧
電板の両生面に励振電極と前記励振電極から長手方向周
辺まで引き出した引出電極とを配置して成る圧電振動板
を前配り−「端子の露出部分に載置すると共に、前配り
−r端子と前記引出電極とを導電接続し、かつ、前記絶
縁基板の凹所の内側面の上方で接する外側面を備えた熱
可塑性樹脂から成るフタを前記絶l:基板の凹所の開口
部から被せると共に、前記絶縁基板と前記フタの互に接
するij!1111にそれぞれ形成した凸部を溶融固着
していることを特徴とする矩形圧電振動子の容器。
(1) A recess is formed from one main plane of a rectangular insulating substrate made of thermoplastic resin, and a REET terminal is passed through and fixed from both end surfaces of the insulating substrate in the longitudinal direction to the empty space of the recess, respectively. , a piezoelectric diaphragm exposed in the void space and comprising an excitation electrode and an extraction electrode extended from the excitation electrode to the periphery in the longitudinal direction is disposed on both sides of a rectangular piezoelectric plate. A lid made of thermoplastic resin is placed on the portion, conductively connects the front-r terminal and the extraction electrode, and has an outer surface that contacts above the inner surface of the recess of the insulating substrate. Absolute: A container for a rectangular piezoelectric vibrator, characterized in that it is covered from the opening of the recess of the substrate, and the convex portions formed on the insulating substrate and the lid that are in contact with each other are melted and fixed. .
JP21392381A 1981-02-28 1981-12-29 Container of rectangular piezoelectric oscillator Granted JPS58125908A (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP21392381A JPS58125908A (en) 1981-12-29 1981-12-29 Container of rectangular piezoelectric oscillator
DE8282101485T DE3263495D1 (en) 1981-02-28 1982-02-26 Piezoelectric oscillator device
EP19820101485 EP0059447B1 (en) 1981-02-28 1982-02-26 Piezoelectric oscillator device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP21392381A JPS58125908A (en) 1981-12-29 1981-12-29 Container of rectangular piezoelectric oscillator

Publications (2)

Publication Number Publication Date
JPS58125908A true JPS58125908A (en) 1983-07-27
JPS644692B2 JPS644692B2 (en) 1989-01-26

Family

ID=16647277

Family Applications (1)

Application Number Title Priority Date Filing Date
JP21392381A Granted JPS58125908A (en) 1981-02-28 1981-12-29 Container of rectangular piezoelectric oscillator

Country Status (1)

Country Link
JP (1) JPS58125908A (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02130391U (en) * 1989-04-03 1990-10-26

Also Published As

Publication number Publication date
JPS644692B2 (en) 1989-01-26

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