JPS58122743A - ワイヤ・ボンデイング方法 - Google Patents
ワイヤ・ボンデイング方法Info
- Publication number
- JPS58122743A JPS58122743A JP57004705A JP470582A JPS58122743A JP S58122743 A JPS58122743 A JP S58122743A JP 57004705 A JP57004705 A JP 57004705A JP 470582 A JP470582 A JP 470582A JP S58122743 A JPS58122743 A JP S58122743A
- Authority
- JP
- Japan
- Prior art keywords
- wire
- ball
- capillary
- resistor
- current
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000034 method Methods 0.000 title claims description 12
- 239000000758 substrate Substances 0.000 claims abstract description 10
- 239000004065 semiconductor Substances 0.000 claims description 6
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 abstract description 12
- 238000001514 detection method Methods 0.000 abstract description 11
- 238000007796 conventional method Methods 0.000 abstract 1
- 238000000926 separation method Methods 0.000 abstract 1
- 238000010586 diagram Methods 0.000 description 5
- 230000003071 parasitic effect Effects 0.000 description 4
- 239000008188 pellet Substances 0.000 description 4
- 238000005452 bending Methods 0.000 description 2
- 230000005856 abnormality Effects 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000007274 generation of a signal involved in cell-cell signaling Effects 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
Classifications
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Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Wire Bonding (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP57004705A JPS58122743A (ja) | 1982-01-14 | 1982-01-14 | ワイヤ・ボンデイング方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP57004705A JPS58122743A (ja) | 1982-01-14 | 1982-01-14 | ワイヤ・ボンデイング方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS58122743A true JPS58122743A (ja) | 1983-07-21 |
JPH0237098B2 JPH0237098B2 (enrdf_load_stackoverflow) | 1990-08-22 |
Family
ID=11591289
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP57004705A Granted JPS58122743A (ja) | 1982-01-14 | 1982-01-14 | ワイヤ・ボンデイング方法 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS58122743A (enrdf_load_stackoverflow) |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
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JPS5068271A (enrdf_load_stackoverflow) * | 1973-10-18 | 1975-06-07 | ||
JPS5115379A (en) * | 1974-07-29 | 1976-02-06 | Nippon Electric Co | Handotaitoriidono setsuzokushikensochi |
JPS55117843U (enrdf_load_stackoverflow) * | 1979-02-13 | 1980-08-20 |
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1982
- 1982-01-14 JP JP57004705A patent/JPS58122743A/ja active Granted
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5068271A (enrdf_load_stackoverflow) * | 1973-10-18 | 1975-06-07 | ||
JPS5115379A (en) * | 1974-07-29 | 1976-02-06 | Nippon Electric Co | Handotaitoriidono setsuzokushikensochi |
JPS55117843U (enrdf_load_stackoverflow) * | 1979-02-13 | 1980-08-20 |
Also Published As
Publication number | Publication date |
---|---|
JPH0237098B2 (enrdf_load_stackoverflow) | 1990-08-22 |
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