JPS58121655A - 気化冷却式または液冷式電力用半導体素子 - Google Patents
気化冷却式または液冷式電力用半導体素子Info
- Publication number
- JPS58121655A JPS58121655A JP57162082A JP16208282A JPS58121655A JP S58121655 A JPS58121655 A JP S58121655A JP 57162082 A JP57162082 A JP 57162082A JP 16208282 A JP16208282 A JP 16208282A JP S58121655 A JPS58121655 A JP S58121655A
- Authority
- JP
- Japan
- Prior art keywords
- power semiconductor
- semiconductor device
- circuit module
- ceramic substrate
- cooling
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
- H01L25/16—Assemblies consisting of a plurality of semiconductor or other solid state devices the devices being of types provided for in two or more different subclasses of H10B, H10D, H10F, H10H, H10K or H10N, e.g. forming hybrid circuits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE3137408.5 | 1981-09-19 | ||
| DE19813137408 DE3137408A1 (de) | 1981-09-19 | 1981-09-19 | Leistungshalbleiterbauelement fuer siedekuehlung oder fluessigkeitskuehlung |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS58121655A true JPS58121655A (ja) | 1983-07-20 |
| JPS633457B2 JPS633457B2 (enExample) | 1988-01-23 |
Family
ID=6142181
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP57162082A Granted JPS58121655A (ja) | 1981-09-19 | 1982-09-17 | 気化冷却式または液冷式電力用半導体素子 |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US4520384A (enExample) |
| EP (1) | EP0075154B1 (enExample) |
| JP (1) | JPS58121655A (enExample) |
| DE (2) | DE3137408A1 (enExample) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5983997A (en) * | 1996-10-17 | 1999-11-16 | Brazonics, Inc. | Cold plate having uniform pressure drop and uniform flow rate |
| JP3124513B2 (ja) * | 1997-06-18 | 2001-01-15 | 三菱電機株式会社 | 電力半導体スイッチ装置 |
| DE102004060898B3 (de) * | 2004-12-17 | 2006-06-01 | Tyco Electronics Amp Gmbh | Selbstjustierender berührungsloser Positionsaufnehmer |
| DE202018003992U1 (de) | 2018-08-26 | 2018-09-13 | Hochschule Mittweida (Fh) | Siedekühlbares Substrat mit wenigstens einem mikroelektronischen Bauelement und/oder als Träger mikroelektronischer Einheiten |
| DE102018006806B4 (de) | 2018-08-26 | 2023-01-19 | Hochschule Mittweida (Fh) | Verwendung wenigstens eines Lasers zur Strukturierung mindestens eines Bereichs einer Oberfläche eines Substrats mit wenigstens einem mikroelektronischen Bauelement und/oder als Träger mikroelektronischer Einheiten |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| NL216859A (enExample) * | 1957-05-01 | |||
| CH442502A (de) * | 1965-04-23 | 1967-08-31 | Siemens Ag | Gleichrichteranlage |
| DE2160302C3 (de) * | 1971-12-04 | 1975-07-17 | Siemens Ag | Kühldose zum Einbau in Scheibenzellenstapel |
| DE2705476A1 (de) * | 1977-02-10 | 1978-08-17 | Bbc Brown Boveri & Cie | Fluessigkeitsgekuehltes leistungs-halbleiterbauelement in scheibenzellenbauweise |
| JPS54155774A (en) * | 1978-05-30 | 1979-12-08 | Toshiba Corp | Gas insulating thyristor bulb on water cooling system |
| US4327370A (en) * | 1979-06-28 | 1982-04-27 | Rca Corporation | Resilient contact ring for providing a low impedance connection to the base region of a semiconductor device |
| JPS5949709B2 (ja) * | 1979-10-13 | 1984-12-04 | 三菱電機株式会社 | 光点弧サイリスタ装置 |
-
1981
- 1981-09-19 DE DE19813137408 patent/DE3137408A1/de not_active Withdrawn
-
1982
- 1982-09-02 DE DE8282108080T patent/DE3276980D1/de not_active Expired
- 1982-09-02 EP EP82108080A patent/EP0075154B1/de not_active Expired
- 1982-09-17 JP JP57162082A patent/JPS58121655A/ja active Granted
- 1982-09-17 US US06/419,398 patent/US4520384A/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| EP0075154B1 (de) | 1987-08-12 |
| EP0075154A2 (de) | 1983-03-30 |
| JPS633457B2 (enExample) | 1988-01-23 |
| EP0075154A3 (en) | 1985-04-03 |
| DE3137408A1 (de) | 1983-04-07 |
| DE3276980D1 (en) | 1987-09-17 |
| US4520384A (en) | 1985-05-28 |
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