JPS58116247U - light emitting diode display device - Google Patents
light emitting diode display deviceInfo
- Publication number
- JPS58116247U JPS58116247U JP1217682U JP1217682U JPS58116247U JP S58116247 U JPS58116247 U JP S58116247U JP 1217682 U JP1217682 U JP 1217682U JP 1217682 U JP1217682 U JP 1217682U JP S58116247 U JPS58116247 U JP S58116247U
- Authority
- JP
- Japan
- Prior art keywords
- emitting diode
- light emitting
- display device
- light
- diode display
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
Landscapes
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図は本考案の適用可能な、複数の半導体チップを一
緒に樹脂モールドしてなる発光ダイオードアレイの斜視
図、第２図は本考案の適用可能な、複数゛の半導体チッ
プを一緒に樹脂モールドしてなる数字表示用発光ダイオ
ード表示装置の斜視図、第３図は従来の発光ダイオード
表示装置の断面図、第４図は本考案に係る発光ダイオー
ド表示装置の一実施例の断面図、第５図は本考案に係る
発光ダイオード表示装置の他の実施例の断面図である。
”−２ａ、２ｂ・・・半導体チップ、３・・
・金属リードフレーム、４・・・リー下線、５・・・ケ
ース、６・・・半透明樹脂′、７・・・黒色樹脂、８・
・・黒色基板。Fig. 1 is a perspective view of a light emitting diode array formed by molding a plurality of semiconductor chips together in resin to which the present invention can be applied, and Fig. 2 is a perspective view of a light emitting diode array formed by molding a plurality of semiconductor chips together in resin to which the present invention can be applied. 3 is a sectional view of a conventional light emitting diode display device; FIG. 4 is a sectional view of an embodiment of a light emitting diode display device according to the present invention; FIG. FIG. 5 is a sectional view of another embodiment of the light emitting diode display device according to the present invention. ”-2a, 2b...semiconductor chip, 3...
・Metal lead frame, 4... Lee underline, 5... Case, 6... Translucent resin', 7... Black resin, 8...
・Black board.
Claims (1)
なる発光ダイオード表示装置において、発光ダイオード
チップをマウントした金属リードフレームと、 該金属リードフレームの上記チップマウント部の近傍に
、位置するリードフレーム間の間隙を、チップマウント
側と相対する側から遮光する光遮蔽体とを備えてなる発
光ダイオ−豆表示装置。 ２ 前記光遮蔽体は、チップマウント側と相対する金属
リードフレーム側をモールドする゛黒色顔料が添加され
た樹脂であることを特徴とする実用新案登録請求の範囲
第１項記載の発光ダイオード表示装置。 ３ 前記光遮蔽体は、少な（とも上記間隙を覆う黒色状
の板材であることを特徴とする実用新案登録請求の範囲
線゛１項記載の発光ダイオード表示装置。[Claims for Utility Model Registration] 1. In a light emitting diode display device formed by integrally molding a plurality of light emitting diodes with resin, a metal lead frame on which a light emitting diode chip is mounted, and the vicinity of the chip mounting portion of the metal lead frame. 1. A light emitting diode bean display device comprising: a light shielding member for shielding light from a side opposite to a chip mount side in a gap between positioned lead frames. 2. The light-emitting diode display device according to claim 1, wherein the light shielding body is a resin added with a black pigment that molds the metal lead frame side facing the chip mount side. . 3. The light emitting diode display device according to claim 1, wherein the light shielding member is a black plate material that covers the gap.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1217682U JPS58116247U (en) | 1982-01-29 | 1982-01-29 | light emitting diode display device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1217682U JPS58116247U (en) | 1982-01-29 | 1982-01-29 | light emitting diode display device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS58116247U true JPS58116247U (en) | 1983-08-08 |
Family
ID=30024764
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1217682U Pending JPS58116247U (en) | 1982-01-29 | 1982-01-29 | light emitting diode display device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58116247U (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5512244B2 (en) * | 1977-10-21 | 1980-03-31 |
-
1982
- 1982-01-29 JP JP1217682U patent/JPS58116247U/en active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5512244B2 (en) * | 1977-10-21 | 1980-03-31 |
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