JPS58115880A - Glass woven fabric base material - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a glass fabric base material that provides a through-hole printed wiring board with excellent dimensional stability.
Thread designation defined in H48418 (r)! :OG75
- Using a single yarn of 110 J or a single yarn corresponding to the Mukuro designation, the number of threads per 25 threads of the warp and weft is the following formula (11, (21% formula % (1) (21)). A glass woven fabric base material for through-hole printed wiring boards characterized by being made of an alkali-free glass woven fabric, using a nine-gauss woven fabric base material woven with specified threads in a specific shape layer. That's true.

The conventional manufacturing method for through-hole printed wiring board 11IIi is to use a copper-clad laminate with a thickness of about L2 to 24 cm, to make holes at predetermined locations, and to use a through-hole plating method or the like.

It is made by a known manufacturing method that makes the circuit shown above conductive.

However, through-hole printed wiring boards undergo dimensional changes due to drying of solder resist, heat from fusing, etc., and when the dimensional changes are large, recent automatic insertion methods such as I(, i, etc.) In addition, the types of glass cloths used as reinforcing base materials for through-hole printed wiring board materials are E) among the various glass cloths specified in JI8R8414. '16A, RP16B.

k) '17A, EP18, etc., and the specifications of each glass cloth are as follows.

Among these glass cloths, a specific type of glass cloth has conventionally been used due to the design. For example, due to design, the thickness of copper-clad laminates is usually Q2 increments, so the glass cloth thickness is α18
~α21 The intestine is alive and being used.

However, in recent years, there has been an increase in the number of mounting methods that automatically insert lO, etc. into through-hole printed wiring boards, and this automatic insertion is exposed to harsh conditions such as drying of solder resist and heating during fusing. It is done.

However, due to these manufacturing steps, the dimensions of the through-hole printed wiring board change, and if the dimensional change is large, automatic insertion is no longer possible.

In addition, it is said that automatic insertion is impossible with a large cover plate of 41Kl&lt degree as a practical matter, and therefore the dimensional stability of the material for through-hole printed wiring boards is unsatisfactory at the current level, and the 116K size is better. There is a need for a stable material for through-hole printed wiring boards.

In view of this situation, Fubenban et al. conducted extensive research and discovered a through-hole printed wiring board with significantly improved dimensional stability by using a special glass cloth as a base material.

As mentioned above, the present invention is a glass fabric base material woven in a specific form using specific threads, and the characteristics of this material are: (i) it is an alkali-free glass fabric, and (ii) both the warp and weft are single yarns. ■The name of thread rga specified in JI8 R8418.

75-110J or equivalent to the name; (1) The number of warp and weft threads per 26WTo is expressed by the formula +1), (21).

22 x x 40 (11 06G?x+16(y(α667x+1?888
(2) ■It is woven with plain weave, etc.]!
In a preferred embodiment, the weight of the glass woven fabric is 145~
2261~.

As a result, the thickness of each glass cloth base material of the present invention is 0160 to α195 m.

The reason why the dimensional stability is improved by using this Gance Liao base material is not clear, as various factors are presumed. It is understood that by changing the relationship so that Ru.

The resin for impregnating the base material used to prepare the material for through-hole printed wiring boards using the glass cloth base material of the present invention may be any resin that is commonly used as a resin for laminated boards. For example, epoxy resin or a resin composition containing it as a main component, polyide resin or a resin composition containing it as a main component, cyanate ester resin or a resin composition containing it as a main component, dimethoxymethyl Resin obtained by polycondensation using benzene as the main raw material (
The product name [Zyrotsu Resin J) can be used as a main ingredient and there are 9 resin compositions, etc., and these are 2a*
si or more may be used together.

The absolute value of the dimensional stability of the through-hole printed wiring board material obtained using the glass cloth base material of the present invention will of course vary depending on the type of thermosetting resin used, but the degree of deviation is smaller than that of the conventional one. The tendency is relatively the same as when glass cloth is used as the base material, and the characteristics achieved by the present invention are not impaired depending on the type of resin used.

When impregnating the glass cloth base material of the present invention with the resin, treatment with a surface treatment agent such as a silane coupling agent is a common practice, and is not limited thereto. Using the glass cloth base material of the present invention,
In preparing the material for through-hole print arrangement II, a known general method may be employed.

υ Below, a different explanation will be given with examples.

In addition, using the glass cloth base material of the present invention, nine sulfo"
The dimensional stability of the 8Avyhetia~8□i-e, 2-1-runrind wiring boards was evaluated by measuring the dimensional stability using the method described below.

First, a copper-clad laminate was manufactured by K. Co., Ltd. by layering copper foil with a thickness of 85μ on both sides of eight sheets of prepreg with a thickness of about α2m.

Next, one-dimensional stability was measured based on MIL-P-13949PK. In other words, use a 15m x 805mm square copper-clad laminate, and drill holes (total of 4 holes) of LO■φ at 254mm intervals at symmetrical positions from the center on the perpendicular bisector of the sides. Measure the distance between the holes (If constant is 1), cover the hole with 10W x 1011II tape, remove the copper foil by etching except for the cover, remove the tape, heat at 80℃ for 1 hour, and at 170℃ for 80 minutes. After heating, let it cool, then measure the distance between the holes in the same way as above (measurement 2), and calculate ((measurement 1) - (measurement February / (measurement 1) x 100
This is done by defining the amount of dimensional change as the amount of dimensional change.

Example L The following single fiber glass cloth was used for yellowtail and pre-j.

*+ *yt, s, Warp thread hLjGT 6-110 Number of threads 82
X/251a1 weft EcG75-110 #
22/25m Weight 14817d Thickness
The formulation of the thermosetting resin composition impregnated into the 016m base material is as usual.

Dicyandiamide: 8 parts by weight 2-methylimidazole α: 1 part by weight The characteristics and lamination conditions of the prepreg are as follows.

Characteristics of Gripreg Gel time 80 seconds (170”C
) Resin impregnation amount 45% Lamination condition pressure 40 Temperature f 170° C. Time 2 g

Comparative Example L A copper-clad laminate was manufactured in the same manner as in Example except that the following single yarn woven glass cloth was used as the glass cloth used for the prepreg, and the dimensional change rate was measured.

The results are shown in 1111.

Single yarn Made of glass warp EOG75-110 Number of threads 82/26 weft ECG75-110 2
5 pieces/26 weight 15ON/thickness
Example 2 A copper-clad laminate was manufactured in the same manner as in Example except that the following single yarn woven glass cloth was used as the glass cloth for the prepreg, and the dimensional change rate was measured.

The results are shown in *tin1m.

Single yarn woven glass warp hOG75-110 Number of threads 88/1m Weft hOG75-110 B
1/25■ Weight 5s21/d Thickness
017■ Comparative Example 2 A copper-clad laminate was manufactured in the same manner as in Example except that the following single yarn woven glass cloth was used as the glass cloth used for the prepreg, and the dimensional change rate was measured.

The results are shown in Table 1.

Single yarn woven glass cloth warp kcG75-110 Number of threads 81 726m Weft E (3G?5-110 #81/26m Weight 154Ii/thickness
Q16 ■ Actual Journey Example a A copper-clad laminate was manufactured in the same manner as in Example except that the following single yarn woven glass cloth was used as the glass cloth used for the prepreg, and the dimensional change rate was measured.

The results are shown @11NK.

Single yarn glass cloth warp yarn EOG75-110 Number of threads 40/
25m weft gOG75-110 #8
6/26■Weight 2oo1/n? thickness
018m Comparative Example a A copper-clad laminate was manufactured in the same manner as in Example except that the following single yarn woven glass cloth was used as the glass cloth used for the prepreg, and the dimensional change rate was measured.

The result is first! ! Shown below.

Single thread woven glass cloth warp gcG75-110 Number of threads 40/2
5101 Weft EOG75-110 #88 pieces/
26■ Weight 1s2iittl Thickness
α17 Example Table A copper-clad laminate was manufactured in the same manner as in Example except that the following single thread woven glass cloth was used as the glass cloth used for the prepreg, and the dimensional change rate was measured.

The results are shown in Table 1.

Ichijiku IJLL13 - Warp EC (j76-110 Number of threads 42
Book/21 weft kOG76-110 18a book/
26 parrot weight 21017m1 thickness
619m Comparative Example Table A copper-clad laminate was manufactured in the same manner as in the example except that the following single thread woven glass cloth was used as the glass cloth used for the prepreg, and the 1 dimensional change rate was determined.

The results are shown in Table 1.

Single yarn woven glass warp j! :CG75-110 Number of drives 4
2/26w5 weft hUG76-110 #
112/26■ Weight 1eal/lel Rhinoceros
α185m Example & Using a polyindo resin composition varnish with the following formulation as the resin used, the prepreg and copper clad laminate were manufactured as follows. The dimensional change rate was measured using the same method as in Example 8. Good.

(1) Varnish blended h-methylpyrrolidone 60 parts by weight (2)
Characteristics of copper-clad laminate prepreg Gelation time: 40 seconds (170°C) Resin impregnation amount: 42% Lamination conditions: Pressure: 40X The results are shown in Table 1.

Comparative Example a A copper-clad laminate was manufactured in the same manner as in Example &, except that the single fiber woven glass cloth used in Comparative Example 8 was used as the glass cloth used for the prepreg, and the dimensional change rate was measured.

Dimension change rate #j fixed fixing top 11! It is shown in 111.

Example 6 Using a triazine resin (cyanite iron ester fallen fat) varnish with the following formulation, prepreg and steel clad laminates were manufactured as shown below.The dimensional change rate was measured using the same method as in the attached table. did.

+11 Parts by weight of imidazole α06 mixed with varnish (2) Characteristics of copper-clad laminate prepreg Gelation time 40 seconds (170°C) Resin impregnation amount 41% Lamination conditions pressure 40wM Temperature [170°C] Time 2 hours Results are first! Show IK.

Comparative Example 6 A copper-clad laminate was manufactured in the same manner as in Example 6, except that the single fiber glass cloth used in Comparative p14 was used as the glass cloth used for the prepreg, and the dimensional change rate was determined by -j.

The measurement result of the dimensional change rate is the 18th! Shown below.

Claims (1)

[Claims] 1) Thread name specified in Jul 8418 r E
Using a single yarn of UGT 6-110 J or a single yarn corresponding to the company cough name, the number of threads per 2b of the warp and weft yarns is calculated using the following formula (1), (21% formula% (11 (21) A glass woven fabric base material for through-hole printed wiring boards, which is made of a certain plain-woven alkali-free glass woven fabric, which is defined as 4I mold. 2) 1 child of the alkali-free glass fabric is 145
225II, the glass woven fabric base material for through-hole printed wiring boards according to the first product of claims.