JPS58110687A - 無水マレイン酸重合体のキレ−トを使用する金めつき浴及び金めつき方法 - Google Patents

無水マレイン酸重合体のキレ−トを使用する金めつき浴及び金めつき方法

Info

Publication number
JPS58110687A
JPS58110687A JP57218241A JP21824182A JPS58110687A JP S58110687 A JPS58110687 A JP S58110687A JP 57218241 A JP57218241 A JP 57218241A JP 21824182 A JP21824182 A JP 21824182A JP S58110687 A JPS58110687 A JP S58110687A
Authority
JP
Japan
Prior art keywords
bath
gold
acid
plated
per
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP57218241A
Other languages
English (en)
Japanese (ja)
Other versions
JPS614919B2 (en, 2012
Inventor
オ−ガスタス・フレツチヤ−
ウイリアム・エル・モリア−テイ
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
American Chem & Refining Co
AMERIKAN CHEM ANDO RIFUAININGU CO Inc
Original Assignee
American Chem & Refining Co
AMERIKAN CHEM ANDO RIFUAININGU CO Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by American Chem & Refining Co, AMERIKAN CHEM ANDO RIFUAININGU CO Inc filed Critical American Chem & Refining Co
Publication of JPS58110687A publication Critical patent/JPS58110687A/ja
Publication of JPS614919B2 publication Critical patent/JPS614919B2/ja
Granted legal-status Critical Current

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00Electroplating: Baths therefor
    • C25D3/02Electroplating: Baths therefor from solutions
    • C25D3/48Electroplating: Baths therefor from solutions of gold
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00Electroplating: Baths therefor
    • C25D3/02Electroplating: Baths therefor from solutions
    • C25D3/56Electroplating: Baths therefor from solutions of alloys
    • C25D3/62Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of gold

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
JP57218241A 1981-12-14 1982-12-13 無水マレイン酸重合体のキレ−トを使用する金めつき浴及び金めつき方法 Granted JPS58110687A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US06/330,706 US4396471A (en) 1981-12-14 1981-12-14 Gold plating bath and method using maleic anhydride polymer chelate
US330706 1994-10-28

Publications (2)

Publication Number Publication Date
JPS58110687A true JPS58110687A (ja) 1983-07-01
JPS614919B2 JPS614919B2 (en, 2012) 1986-02-14

Family

ID=23290963

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57218241A Granted JPS58110687A (ja) 1981-12-14 1982-12-13 無水マレイン酸重合体のキレ−トを使用する金めつき浴及び金めつき方法

Country Status (7)

Country Link
US (1) US4396471A (en, 2012)
JP (1) JPS58110687A (en, 2012)
CA (1) CA1211410A (en, 2012)
CH (1) CH652150A5 (en, 2012)
DE (1) DE3244092A1 (en, 2012)
FR (1) FR2519031B1 (en, 2012)
GB (1) GB2112397B (en, 2012)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH038337A (ja) * 1989-06-06 1991-01-16 Fujitsu Ltd 半導体装置の製造方法
WO2017175428A1 (ja) * 2016-04-07 2017-10-12 小島化学薬品株式会社 硬質金めっき溶液

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
HU191879B (en) * 1983-09-09 1987-04-28 Videoton Elekt Vallalat Processor fot the galvanic speretaion of hard gold plating for electronic purposes
US4670107A (en) * 1986-03-05 1987-06-02 Vanguard Research Associates, Inc. Electrolyte solution and process for high speed gold plating
US4758630A (en) * 1986-10-27 1988-07-19 Richardson-Vicks Inc. Denture stabilizing zinc and strontium salts of ave/ma copolymer
US4857159A (en) * 1987-03-25 1989-08-15 The Standard Oil Company Electrodeposition recovery method for metals in polymer chelates
DE10340197B3 (de) * 2003-08-27 2004-09-23 Siemens Ag Verfahren zum elektrochemischen Abscheiden von Metallen aus einem Elektrolyt
JP4945193B2 (ja) * 2006-08-21 2012-06-06 ローム・アンド・ハース・エレクトロニック・マテリアルズ,エル.エル.シー. 硬質金合金めっき液
EP2123799B1 (en) * 2008-04-22 2015-04-22 Rohm and Haas Electronic Materials LLC Method of replenishing indium ions in indium electroplating compositions
DE102013109400A1 (de) * 2013-08-29 2015-03-05 Harting Kgaa Kontaktelement mit Goldbeschichtung
US20240271306A1 (en) 2021-09-16 2024-08-15 P & S, Galvasols High-speed pure gold electroforming/electroplating bath

Family Cites Families (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USRE23514E (en) * 1930-06-26 1952-06-24 Artificial resins and process of
DE801312C (de) * 1949-05-05 1950-11-23 Pforzheimer Elektrizitäts - Gesellschaft m. b. H., Pforzheim Verfahren zur elektrolvtischen Abscheidung von Gold und Goldlegierungen
US2752281A (en) * 1953-06-01 1956-06-26 Rohm & Haas Iodine dissolved in aqueous solutions of maleic anhydride-vinyl ether copolymers
US3087853A (en) * 1956-07-02 1963-04-30 Gen Aniline & Film Corp Water soluble compositions consisting essentially of iodine and a water soluble oxygen containing polymer
BE570261A (en, 2012) * 1957-08-13
US3149057A (en) * 1959-04-27 1964-09-15 Technic Acid gold plating
US3149058A (en) * 1959-12-31 1964-09-15 Technic Bright gold plating process
GB1052380A (en, 2012) * 1964-09-08
FR1478334A (fr) * 1965-05-06 1967-04-28 Inst Francais Du Petrole Catalyseur à base de métaux bivalents, sa préparation et ses applications, en particulier pour la polymérisation d'éthers cycliques
US3407126A (en) * 1965-12-23 1968-10-22 Ibm Electrodeposition of magnetic thin films
US3424597A (en) * 1966-04-08 1969-01-28 Shipley Co Electroless nickel plating
US3672969A (en) * 1970-10-26 1972-06-27 Lea Ronal Inc Electrodeposition of gold and gold alloys
US3856638A (en) * 1971-08-20 1974-12-24 Auric Corp Bright gold electroplating bath and method of electroplating bright gold
US3716463A (en) * 1971-08-30 1973-02-13 Auric Corp Bright gold alloy electroplating bath and process
BE791401A (fr) * 1971-11-15 1973-05-14 Monsanto Co Compositions et procedes electrochimiques
US3787463A (en) * 1972-02-24 1974-01-22 Oxy Metal Finishing Corp Amine gold complex useful for the electrodeposition of gold and its alloys
US3770596A (en) * 1972-07-21 1973-11-06 Auric Corp Gold plating bath for barrel plating operations
CH555894A (fr) * 1972-08-10 1974-11-15 Oxy Metal Industries Corp Utilisation de derives organophosphores dans les bains sulfitiques pour l'electrodeposition de l'or et des alliages d'or.
US3864222A (en) * 1973-03-26 1975-02-04 Technic Baths for Electrodeposition of Gold and Gold Alloys and Method Therefore
US3902977A (en) * 1973-12-13 1975-09-02 Engelhard Min & Chem Gold plating solutions and method
US4076598A (en) * 1976-11-17 1978-02-28 Amp Incorporated Method, electrolyte and additive for electroplating a cobalt brightened gold alloy
US4186064A (en) * 1977-07-20 1980-01-29 Technic, Inc. Method and electrolyte for electrodeposition of bright gold and gold alloys
US4197172A (en) * 1979-04-05 1980-04-08 American Chemical & Refining Company Incorporated Gold plating composition and method
US4253920A (en) * 1980-03-20 1981-03-03 American Chemical & Refining Company, Incorporated Composition and method for gold plating

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH038337A (ja) * 1989-06-06 1991-01-16 Fujitsu Ltd 半導体装置の製造方法
WO2017175428A1 (ja) * 2016-04-07 2017-10-12 小島化学薬品株式会社 硬質金めっき溶液
JP2017186627A (ja) * 2016-04-07 2017-10-12 小島化学薬品株式会社 硬質金めっき溶液

Also Published As

Publication number Publication date
FR2519031B1 (fr) 1986-05-23
FR2519031A1 (fr) 1983-07-01
CH652150A5 (de) 1985-10-31
US4396471A (en) 1983-08-02
JPS614919B2 (en, 2012) 1986-02-14
DE3244092C2 (en, 2012) 1989-03-02
GB2112397A (en) 1983-07-20
DE3244092A1 (de) 1983-06-23
GB2112397B (en) 1985-09-18
CA1211410A (en) 1986-09-16

Similar Documents

Publication Publication Date Title
JP2859316B2 (ja) 白金または白金合金の電気めっき浴および電気めっき方法
US3940319A (en) Electrodeposition of bright tin-nickel alloy
JPS6056084A (ja) 亜鉛及び亜鉛合金電着浴及びその方法
JPS58110687A (ja) 無水マレイン酸重合体のキレ−トを使用する金めつき浴及び金めつき方法
JPH0338351B2 (en, 2012)
KR910004972B1 (ko) 주석-코발트, 주석-니켈, 주석-납 2원합금 전기도금조의 제조방법 및 이 방법에 의해 제조된 전기도금조
US4478692A (en) Electrodeposition of palladium-silver alloys
CH617966A5 (en, 2012)
US4673471A (en) Method of electrodepositing a chromium alloy deposit
EP0546654B1 (en) Electroplating composition and process
US3681211A (en) Electroplating a black nickel-zinc alloy deposit
US4465563A (en) Electrodeposition of palladium-silver alloys
CA1176204A (en) Bath for the electrolytic deposition of a palladium- nickel alloy
US3729396A (en) Rhodium plating composition and method for plating rhodium
US4634505A (en) Process and bath for the electrolytic deposition of gold-tin alloy coatings
US6576114B1 (en) Electroplating composition bath
US4744871A (en) Electrolyte solution and process for gold electroplating
US3898137A (en) Method of electroplating gold and gold plating baths containing an amido-polyphosphate
US3528895A (en) Plating low stress bright rhodium
US3562120A (en) Plating of smooth,semibright gold deposits
US3437571A (en) Production of electrolytic nickel
US4565611A (en) Aqueous electrolytes and method for electrodepositing nickel-cobalt alloys
EP0229665B1 (en) Specular product of golden tone and method for manufacturing same
US4755264A (en) Electrolyte solution and process for gold electroplating
CA1045577A (en) Electrodeposition of bright tin-nickel alloy