JPS58101317A - ポジシヨナ−の回転位置決め装置 - Google Patents

ポジシヨナ−の回転位置決め装置

Info

Publication number
JPS58101317A
JPS58101317A JP20005381A JP20005381A JPS58101317A JP S58101317 A JPS58101317 A JP S58101317A JP 20005381 A JP20005381 A JP 20005381A JP 20005381 A JP20005381 A JP 20005381A JP S58101317 A JPS58101317 A JP S58101317A
Authority
JP
Japan
Prior art keywords
main shaft
sprocket
tension
chain
locator
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP20005381A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6220574B2 (en, 2012
Inventor
Mikio Watanabe
幹雄 渡辺
Shoichi Kobayashi
正一 小林
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Koike Sanso Kogyo Co Ltd
Original Assignee
Koike Sanso Kogyo Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Koike Sanso Kogyo Co Ltd filed Critical Koike Sanso Kogyo Co Ltd
Priority to JP20005381A priority Critical patent/JPS58101317A/ja
Publication of JPS58101317A publication Critical patent/JPS58101317A/ja
Publication of JPS6220574B2 publication Critical patent/JPS6220574B2/ja
Granted legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
    • B23Q16/00—Equipment for precise positioning of tool or work into particular locations not otherwise provided for
    • B23Q16/02—Indexing equipment
    • B23Q16/04—Indexing equipment having intermediate members, e.g. pawls, for locking the relatively movable parts in the indexed position
    • B23Q16/06—Rotary indexing
    • B23Q16/065—Rotary indexing with a continuous drive
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16H—GEARING
    • F16H7/00—Gearings for conveying rotary motion by endless flexible members
    • F16H7/08—Means for varying tension of belts, ropes or chains 
    • F16H2007/0863—Finally actuated members, e.g. constructional details thereof
    • F16H2007/0874—Two or more finally actuated members

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Devices For Conveying Motion By Means Of Endless Flexible Members (AREA)
  • Machine Tool Positioning Apparatuses (AREA)
JP20005381A 1981-12-14 1981-12-14 ポジシヨナ−の回転位置決め装置 Granted JPS58101317A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP20005381A JPS58101317A (ja) 1981-12-14 1981-12-14 ポジシヨナ−の回転位置決め装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP20005381A JPS58101317A (ja) 1981-12-14 1981-12-14 ポジシヨナ−の回転位置決め装置

Publications (2)

Publication Number Publication Date
JPS58101317A true JPS58101317A (ja) 1983-06-16
JPS6220574B2 JPS6220574B2 (en, 2012) 1987-05-07

Family

ID=16418040

Family Applications (1)

Application Number Title Priority Date Filing Date
JP20005381A Granted JPS58101317A (ja) 1981-12-14 1981-12-14 ポジシヨナ−の回転位置決め装置

Country Status (1)

Country Link
JP (1) JPS58101317A (en, 2012)

Cited By (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6281568B1 (en) 1998-10-21 2001-08-28 Amkor Technology, Inc. Plastic integrated circuit device package and leadframe having partially undercut leads and die pad
US6469369B1 (en) 1999-06-30 2002-10-22 Amkor Technology, Inc. Leadframe having a mold inflow groove and method for making
US6475827B1 (en) 1999-10-15 2002-11-05 Amkor Technology, Inc. Method for making a semiconductor package having improved defect testing and increased production yield
US6501161B1 (en) 1999-10-15 2002-12-31 Amkor Technology, Inc. Semiconductor package having increased solder joint strength
US6525406B1 (en) 1999-10-15 2003-02-25 Amkor Technology, Inc. Semiconductor device having increased moisture path and increased solder joint strength
US6555899B1 (en) 1999-10-15 2003-04-29 Amkor Technology, Inc. Semiconductor package leadframe assembly and method of manufacture
US6605866B1 (en) 1999-12-16 2003-08-12 Amkor Technology, Inc. Stackable semiconductor package and method for manufacturing same
US6616436B1 (en) 1999-10-15 2003-09-09 Amkor Technology, Inc. Apparatus for manufacturing semiconductor packages
US6627976B1 (en) 1999-10-15 2003-09-30 Amkor Technology, Inc. Leadframe for semiconductor package and mold for molding the same
US6646339B1 (en) 1999-10-15 2003-11-11 Amkor Technology, Inc. Thin and heat radiant semiconductor package and method for manufacturing
US6677662B1 (en) 1999-10-15 2004-01-13 Amkor Technology, Inc. Clamp and heat block assembly for wire bonding a semiconductor package assembly
US6677663B1 (en) 1999-12-30 2004-01-13 Amkor Technology, Inc. End grid array semiconductor package
US6696747B1 (en) 1999-10-15 2004-02-24 Amkor Technology, Inc. Semiconductor package having reduced thickness
US6730544B1 (en) 1999-12-20 2004-05-04 Amkor Technology, Inc. Stackable semiconductor package and method for manufacturing same
US6753597B1 (en) 1999-12-16 2004-06-22 Amkor Technology, Inc. Encapsulated semiconductor package including chip paddle and leads
US6853059B1 (en) 1999-10-15 2005-02-08 Amkor Technology, Inc. Semiconductor package having improved adhesiveness and ground bonding

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0459771U (en, 2012) * 1990-10-01 1992-05-22

Cited By (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6281568B1 (en) 1998-10-21 2001-08-28 Amkor Technology, Inc. Plastic integrated circuit device package and leadframe having partially undercut leads and die pad
US6469369B1 (en) 1999-06-30 2002-10-22 Amkor Technology, Inc. Leadframe having a mold inflow groove and method for making
US6627976B1 (en) 1999-10-15 2003-09-30 Amkor Technology, Inc. Leadframe for semiconductor package and mold for molding the same
US6696747B1 (en) 1999-10-15 2004-02-24 Amkor Technology, Inc. Semiconductor package having reduced thickness
US6525406B1 (en) 1999-10-15 2003-02-25 Amkor Technology, Inc. Semiconductor device having increased moisture path and increased solder joint strength
US6555899B1 (en) 1999-10-15 2003-04-29 Amkor Technology, Inc. Semiconductor package leadframe assembly and method of manufacture
US6853059B1 (en) 1999-10-15 2005-02-08 Amkor Technology, Inc. Semiconductor package having improved adhesiveness and ground bonding
US6616436B1 (en) 1999-10-15 2003-09-09 Amkor Technology, Inc. Apparatus for manufacturing semiconductor packages
US6475827B1 (en) 1999-10-15 2002-11-05 Amkor Technology, Inc. Method for making a semiconductor package having improved defect testing and increased production yield
US6646339B1 (en) 1999-10-15 2003-11-11 Amkor Technology, Inc. Thin and heat radiant semiconductor package and method for manufacturing
US6677662B1 (en) 1999-10-15 2004-01-13 Amkor Technology, Inc. Clamp and heat block assembly for wire bonding a semiconductor package assembly
US6501161B1 (en) 1999-10-15 2002-12-31 Amkor Technology, Inc. Semiconductor package having increased solder joint strength
US6753597B1 (en) 1999-12-16 2004-06-22 Amkor Technology, Inc. Encapsulated semiconductor package including chip paddle and leads
US6605866B1 (en) 1999-12-16 2003-08-12 Amkor Technology, Inc. Stackable semiconductor package and method for manufacturing same
US6730544B1 (en) 1999-12-20 2004-05-04 Amkor Technology, Inc. Stackable semiconductor package and method for manufacturing same
US6677663B1 (en) 1999-12-30 2004-01-13 Amkor Technology, Inc. End grid array semiconductor package

Also Published As

Publication number Publication date
JPS6220574B2 (en, 2012) 1987-05-07

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