JPS58100993A - 金一錫共晶型合金ろう材の製造方法 - Google Patents

金一錫共晶型合金ろう材の製造方法

Info

Publication number
JPS58100993A
JPS58100993A JP19906481A JP19906481A JPS58100993A JP S58100993 A JPS58100993 A JP S58100993A JP 19906481 A JP19906481 A JP 19906481A JP 19906481 A JP19906481 A JP 19906481A JP S58100993 A JPS58100993 A JP S58100993A
Authority
JP
Japan
Prior art keywords
raw material
phases
subjected
filler metal
brazing filler
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP19906481A
Other languages
English (en)
Japanese (ja)
Other versions
JPH024398B2 (enrdf_load_stackoverflow
Inventor
Hironobu Yamamoto
博信 山本
Norihiro Ide
井手 憲博
Shoichiro Matsui
松居 庄一郎
Takashi Nara
奈良 喬
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokuriki Honten Co Ltd
Original Assignee
Tokuriki Honten Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokuriki Honten Co Ltd filed Critical Tokuriki Honten Co Ltd
Priority to JP19906481A priority Critical patent/JPS58100993A/ja
Publication of JPS58100993A publication Critical patent/JPS58100993A/ja
Publication of JPH024398B2 publication Critical patent/JPH024398B2/ja
Granted legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24Selection of soldering or welding materials proper
    • B23K35/30Selection of soldering or welding materials proper with the principal constituent melting at less than 1550 degrees C
    • B23K35/3013Au as the principal constituent

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Pressure Welding/Diffusion-Bonding (AREA)
  • Laminated Bodies (AREA)
JP19906481A 1981-12-10 1981-12-10 金一錫共晶型合金ろう材の製造方法 Granted JPS58100993A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP19906481A JPS58100993A (ja) 1981-12-10 1981-12-10 金一錫共晶型合金ろう材の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP19906481A JPS58100993A (ja) 1981-12-10 1981-12-10 金一錫共晶型合金ろう材の製造方法

Publications (2)

Publication Number Publication Date
JPS58100993A true JPS58100993A (ja) 1983-06-15
JPH024398B2 JPH024398B2 (enrdf_load_stackoverflow) 1990-01-29

Family

ID=16401503

Family Applications (1)

Application Number Title Priority Date Filing Date
JP19906481A Granted JPS58100993A (ja) 1981-12-10 1981-12-10 金一錫共晶型合金ろう材の製造方法

Country Status (1)

Country Link
JP (1) JPS58100993A (enrdf_load_stackoverflow)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6186097A (ja) * 1984-10-01 1986-05-01 Tanaka Kikinzoku Kogyo Kk Ti入り複合ろう材の製造方法
US4754371A (en) * 1984-04-27 1988-06-28 Nec Corporation Large scale integrated circuit package
US6797409B2 (en) * 2001-12-20 2004-09-28 The Governors Of The University Of Alberta Electrodeposition process and a layered composite material produced thereby
CN101811236A (zh) * 2010-02-25 2010-08-25 东莞市万丰纳米材料有限公司 一种微焊条的制备方法
CN102912175A (zh) * 2012-08-23 2013-02-06 云南大学 一种金锡合金钎料箔材的制备方法
CN110711970A (zh) * 2019-10-24 2020-01-21 中电国基南方集团有限公司 一种抗氧化金锡焊料的制备方法

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103100825A (zh) * 2013-01-07 2013-05-15 广州先艺电子科技有限公司 一种预合金化金锡预成型焊片的制备方法

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4754371A (en) * 1984-04-27 1988-06-28 Nec Corporation Large scale integrated circuit package
JPS6186097A (ja) * 1984-10-01 1986-05-01 Tanaka Kikinzoku Kogyo Kk Ti入り複合ろう材の製造方法
US6797409B2 (en) * 2001-12-20 2004-09-28 The Governors Of The University Of Alberta Electrodeposition process and a layered composite material produced thereby
CN101811236A (zh) * 2010-02-25 2010-08-25 东莞市万丰纳米材料有限公司 一种微焊条的制备方法
CN102912175A (zh) * 2012-08-23 2013-02-06 云南大学 一种金锡合金钎料箔材的制备方法
CN102912175B (zh) * 2012-08-23 2014-07-02 云南大学 一种金锡合金钎料箔材的制备方法
CN110711970A (zh) * 2019-10-24 2020-01-21 中电国基南方集团有限公司 一种抗氧化金锡焊料的制备方法
CN110711970B (zh) * 2019-10-24 2021-09-17 中电国基南方集团有限公司 一种抗氧化金锡焊料的制备方法

Also Published As

Publication number Publication date
JPH024398B2 (enrdf_load_stackoverflow) 1990-01-29

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