JPS58100993A - 金一錫共晶型合金ろう材の製造方法 - Google Patents
金一錫共晶型合金ろう材の製造方法Info
- Publication number
- JPS58100993A JPS58100993A JP19906481A JP19906481A JPS58100993A JP S58100993 A JPS58100993 A JP S58100993A JP 19906481 A JP19906481 A JP 19906481A JP 19906481 A JP19906481 A JP 19906481A JP S58100993 A JPS58100993 A JP S58100993A
- Authority
- JP
- Japan
- Prior art keywords
- raw material
- phases
- subjected
- filler metal
- brazing filler
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000005219 brazing Methods 0.000 title claims abstract description 19
- 239000000945 filler Substances 0.000 title claims abstract description 13
- 239000002184 metal Substances 0.000 title claims abstract description 13
- 229910052751 metal Inorganic materials 0.000 title claims abstract description 13
- 238000004519 manufacturing process Methods 0.000 title claims description 6
- JVPLOXQKFGYFMN-UHFFFAOYSA-N gold tin Chemical compound [Sn].[Au] JVPLOXQKFGYFMN-UHFFFAOYSA-N 0.000 title claims description 4
- 239000000956 alloy Substances 0.000 title description 5
- 229910045601 alloy Inorganic materials 0.000 title description 5
- 230000005496 eutectics Effects 0.000 title 1
- 239000002994 raw material Substances 0.000 claims abstract description 67
- 238000005097 cold rolling Methods 0.000 claims abstract description 16
- 239000002131 composite material Substances 0.000 claims abstract description 15
- 238000010438 heat treatment Methods 0.000 claims abstract description 15
- 239000006023 eutectic alloy Substances 0.000 claims abstract description 11
- 229910052737 gold Inorganic materials 0.000 claims abstract description 5
- 229910052718 tin Inorganic materials 0.000 claims abstract description 5
- 238000000034 method Methods 0.000 claims description 15
- 238000005520 cutting process Methods 0.000 claims description 3
- 238000009792 diffusion process Methods 0.000 claims description 2
- 238000004080 punching Methods 0.000 claims description 2
- 239000000463 material Substances 0.000 abstract description 11
- 229910015363 Au—Sn Inorganic materials 0.000 abstract description 3
- 238000011282 treatment Methods 0.000 abstract description 3
- 230000007547 defect Effects 0.000 abstract description 2
- 238000003475 lamination Methods 0.000 abstract 1
- 238000000137 annealing Methods 0.000 description 4
- 238000007796 conventional method Methods 0.000 description 3
- 239000000047 product Substances 0.000 description 3
- 239000003795 chemical substances by application Substances 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 238000005096 rolling process Methods 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- 241000277269 Oncorhynchus masou Species 0.000 description 1
- 239000012467 final product Substances 0.000 description 1
- 238000005098 hot rolling Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000004445 quantitative analysis Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/30—Selection of soldering or welding materials proper with the principal constituent melting at less than 1550 degrees C
- B23K35/3013—Au as the principal constituent
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Pressure Welding/Diffusion-Bonding (AREA)
- Laminated Bodies (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP19906481A JPS58100993A (ja) | 1981-12-10 | 1981-12-10 | 金一錫共晶型合金ろう材の製造方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP19906481A JPS58100993A (ja) | 1981-12-10 | 1981-12-10 | 金一錫共晶型合金ろう材の製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS58100993A true JPS58100993A (ja) | 1983-06-15 |
JPH024398B2 JPH024398B2 (enrdf_load_stackoverflow) | 1990-01-29 |
Family
ID=16401503
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP19906481A Granted JPS58100993A (ja) | 1981-12-10 | 1981-12-10 | 金一錫共晶型合金ろう材の製造方法 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS58100993A (enrdf_load_stackoverflow) |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6186097A (ja) * | 1984-10-01 | 1986-05-01 | Tanaka Kikinzoku Kogyo Kk | Ti入り複合ろう材の製造方法 |
US4754371A (en) * | 1984-04-27 | 1988-06-28 | Nec Corporation | Large scale integrated circuit package |
US6797409B2 (en) * | 2001-12-20 | 2004-09-28 | The Governors Of The University Of Alberta | Electrodeposition process and a layered composite material produced thereby |
CN101811236A (zh) * | 2010-02-25 | 2010-08-25 | 东莞市万丰纳米材料有限公司 | 一种微焊条的制备方法 |
CN102912175A (zh) * | 2012-08-23 | 2013-02-06 | 云南大学 | 一种金锡合金钎料箔材的制备方法 |
CN110711970A (zh) * | 2019-10-24 | 2020-01-21 | 中电国基南方集团有限公司 | 一种抗氧化金锡焊料的制备方法 |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103100825A (zh) * | 2013-01-07 | 2013-05-15 | 广州先艺电子科技有限公司 | 一种预合金化金锡预成型焊片的制备方法 |
-
1981
- 1981-12-10 JP JP19906481A patent/JPS58100993A/ja active Granted
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4754371A (en) * | 1984-04-27 | 1988-06-28 | Nec Corporation | Large scale integrated circuit package |
JPS6186097A (ja) * | 1984-10-01 | 1986-05-01 | Tanaka Kikinzoku Kogyo Kk | Ti入り複合ろう材の製造方法 |
US6797409B2 (en) * | 2001-12-20 | 2004-09-28 | The Governors Of The University Of Alberta | Electrodeposition process and a layered composite material produced thereby |
CN101811236A (zh) * | 2010-02-25 | 2010-08-25 | 东莞市万丰纳米材料有限公司 | 一种微焊条的制备方法 |
CN102912175A (zh) * | 2012-08-23 | 2013-02-06 | 云南大学 | 一种金锡合金钎料箔材的制备方法 |
CN102912175B (zh) * | 2012-08-23 | 2014-07-02 | 云南大学 | 一种金锡合金钎料箔材的制备方法 |
CN110711970A (zh) * | 2019-10-24 | 2020-01-21 | 中电国基南方集团有限公司 | 一种抗氧化金锡焊料的制备方法 |
CN110711970B (zh) * | 2019-10-24 | 2021-09-17 | 中电国基南方集团有限公司 | 一种抗氧化金锡焊料的制备方法 |
Also Published As
Publication number | Publication date |
---|---|
JPH024398B2 (enrdf_load_stackoverflow) | 1990-01-29 |
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