JPS5797633A - Hybrid integrated circuit - Google Patents
Hybrid integrated circuitInfo
- Publication number
- JPS5797633A JPS5797633A JP17487680A JP17487680A JPS5797633A JP S5797633 A JPS5797633 A JP S5797633A JP 17487680 A JP17487680 A JP 17487680A JP 17487680 A JP17487680 A JP 17487680A JP S5797633 A JPS5797633 A JP S5797633A
- Authority
- JP
- Japan
- Prior art keywords
- faces
- integrated circuit
- hybrid integrated
- metal substrate
- oxide
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/27—Manufacturing methods
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/741—Apparatus for manufacturing means for bonding, e.g. connectors
- H01L24/743—Apparatus for manufacturing layer connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/741—Apparatus for manufacturing means for bonding, e.g. connectors
- H01L2224/743—Apparatus for manufacturing layer connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/8319—Arrangement of the layer connectors prior to mounting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/838—Bonding techniques
- H01L2224/8385—Bonding techniques using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester
- H01L2224/83855—Hardening the adhesive by curing, i.e. thermosetting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01013—Aluminum [Al]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/06—Polymers
- H01L2924/078—Adhesive characteristics other than chemical
- H01L2924/07802—Adhesive characteristics other than chemical not being an ohmic electrical conductor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/156—Material
- H01L2924/15786—Material with a principal constituent of the material being a non metallic, non metalloid inorganic material
- H01L2924/15787—Ceramics, e.g. crystalline carbides, nitrides or oxides
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/35—Mechanical effects
- H01L2924/351—Thermal stress
- H01L2924/3511—Warping
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/44—Manufacturing insulated metal core circuits or other insulated electrically conductive core circuits
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Insulated Metal Substrates For Printed Circuits (AREA)
- Die Bonding (AREA)
Abstract
PURPOSE:To suppress warp of a substrate and to enhance heat radiating effect of a hybrid integrated circuit by a method wherein sandblast is performed on both faces of the metal substrate. CONSTITUTION:Sandblast is performed on both the faces of the metal substrate 11 of pure aluminum, and unevenness of the grade of 20-30mu is formed on both the faces to form rough faces. An inert gas is made to flow between electrodes of a plasma flame spray gun 12 on one face side of the metal substrate 11, electric arc is made to be generated to generate hot plasma. An oxide 13 of ceramic, etc., is introduced in the flame of hot plasma thereof, and an oxide layer 14 is formed in melting condition. A thermosetting resin 15 is made to be impregnated in the oxide (ceramic) layer 14 formed by this way, a circuit consisting of conductive layers 16, etc., is formed thereon, and semiconductor elements 17 of transistor, etc., are assembled therein to form the hybrid integrated circuit.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP17487680A JPS5797633A (en) | 1980-12-11 | 1980-12-11 | Hybrid integrated circuit |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP17487680A JPS5797633A (en) | 1980-12-11 | 1980-12-11 | Hybrid integrated circuit |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5797633A true JPS5797633A (en) | 1982-06-17 |
Family
ID=15986200
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP17487680A Pending JPS5797633A (en) | 1980-12-11 | 1980-12-11 | Hybrid integrated circuit |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5797633A (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59151469U (en) * | 1983-03-30 | 1984-10-11 | 株式会社フジクラ | enamel board |
JPS62149867U (en) * | 1986-03-14 | 1987-09-22 | ||
JP2004343035A (en) * | 2003-04-24 | 2004-12-02 | Ngk Spark Plug Co Ltd | Heat radiating component, circuit board, and semiconductor device |
CN108807595A (en) * | 2018-06-13 | 2018-11-13 | 苏州澳京光伏科技有限公司 | A kind of manufacturing method of low warpage polysilicon solar cell substrate |
-
1980
- 1980-12-11 JP JP17487680A patent/JPS5797633A/en active Pending
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59151469U (en) * | 1983-03-30 | 1984-10-11 | 株式会社フジクラ | enamel board |
JPS62149867U (en) * | 1986-03-14 | 1987-09-22 | ||
JP2004343035A (en) * | 2003-04-24 | 2004-12-02 | Ngk Spark Plug Co Ltd | Heat radiating component, circuit board, and semiconductor device |
CN108807595A (en) * | 2018-06-13 | 2018-11-13 | 苏州澳京光伏科技有限公司 | A kind of manufacturing method of low warpage polysilicon solar cell substrate |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
TW350071B (en) | Chip resistor and a method of producing the same | |
ES487701A1 (en) | Method of applying electrical contacts to a photovoltaic cell | |
JP2694668B2 (en) | Substrate holding device | |
MY117905A (en) | Chip resistor device and method of making the same. | |
MY117343A (en) | Electric circuit card and method of manufacture | |
JPS57188670A (en) | Treatment of electrically conductive member | |
JPS5797633A (en) | Hybrid integrated circuit | |
US5264376A (en) | Method of making a thin film solar cell | |
JPS55158649A (en) | Manufacture of electrode wiring | |
JPS5730374A (en) | Semiconductor device and manufacture thereof | |
JPS58117677A (en) | Improvement in dc electroluminescent unit | |
JPS6439728A (en) | Manufacture of semiconductor by plasma reaction | |
JPS6478724A (en) | Electric discharge machining wire | |
JPS5633891A (en) | Light emitting semiconductor device | |
KR20010063394A (en) | Ceramic Coating Method And Coated Ceramic On It's Surface | |
US20090205858A1 (en) | Circuit carrier | |
Nemchinsky | Electrode evaporation in an arc with pulsing current | |
KR100945029B1 (en) | Metal printed circuit board for hi-effective light-emitting diode and the method thereof | |
KR100537014B1 (en) | Coating System for Preventable EMI and Color Metal of Poly Carbonate of Plain Acrylic Glass using Ion Plating Method | |
JPS5743341A (en) | Face discharge type gas discharge panel | |
JPS6459887A (en) | Superconductive circuit board | |
JPS56130949A (en) | Manufacture of semiconductor device | |
JPS5750455A (en) | Hybrid integrated circuit | |
JPS5473555A (en) | Manufacture of gas discharge panel | |
JPS58106733A (en) | Ion gun |