JPS5795856A - Joining method - Google Patents
Joining methodInfo
- Publication number
- JPS5795856A JPS5795856A JP17170980A JP17170980A JPS5795856A JP S5795856 A JPS5795856 A JP S5795856A JP 17170980 A JP17170980 A JP 17170980A JP 17170980 A JP17170980 A JP 17170980A JP S5795856 A JPS5795856 A JP S5795856A
- Authority
- JP
- Japan
- Prior art keywords
- joining
- plate
- solder
- hologram
- objects
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C27/00—Joining pieces of glass to pieces of other inorganic material; Joining glass to glass other than by fusing
- C03C27/06—Joining glass to glass by processes other than fusing
- C03C27/08—Joining glass to glass by processes other than fusing with the aid of intervening metal
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Ceramic Engineering (AREA)
- Life Sciences & Earth Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Geochemistry & Mineralogy (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Laminated Bodies (AREA)
- Joining Of Glass To Other Materials (AREA)
Abstract
PURPOSE: To perform joining of high joining strength and airtight sealability by disposing a frame-like joining material beforehand on members to be joined and melting this by heating in joining plate-like objects by means of solder or the like.
CONSTITUTION: In joining plate-like objects, such as airtight sealing of a hologram or the like, first the 1st glass plate 2 formed with a hologram 1 is placed on the 2nd glass plate 4. A joining material 6 of solder or the like formed into a frame shape is placed by enclosing the 1st plate 2, and these are contained in a jig 7. Thence, the material 6 is heated and is melted by applying ultrasonic oscillations by the use of an ultrasonic wave applying jig 8 or the like. By this method, the interface between the material 6 and the solder layers coated beforehand on the plates 2, 4 is annihilated and both are fused, whereby the firmly joined and airtightly sealed structural body is obtained.
COPYRIGHT: (C)1982,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP17170980A JPS5795856A (en) | 1980-12-05 | 1980-12-05 | Joining method |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP17170980A JPS5795856A (en) | 1980-12-05 | 1980-12-05 | Joining method |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5795856A true JPS5795856A (en) | 1982-06-14 |
Family
ID=15928216
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP17170980A Pending JPS5795856A (en) | 1980-12-05 | 1980-12-05 | Joining method |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5795856A (en) |
-
1980
- 1980-12-05 JP JP17170980A patent/JPS5795856A/en active Pending
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