JPS5795630A - Automatic plasma treating method - Google Patents

Automatic plasma treating method

Info

Publication number
JPS5795630A
JPS5795630A JP16119881A JP16119881A JPS5795630A JP S5795630 A JPS5795630 A JP S5795630A JP 16119881 A JP16119881 A JP 16119881A JP 16119881 A JP16119881 A JP 16119881A JP S5795630 A JPS5795630 A JP S5795630A
Authority
JP
Japan
Prior art keywords
wafers
processing
pickup
wafer
pressure
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP16119881A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6148254B2 (enrdf_load_stackoverflow
Inventor
Akira Uehara
Hisashi Nakane
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Ohka Kogyo Co Ltd
Original Assignee
Tokyo Ohka Kogyo Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Ohka Kogyo Co Ltd filed Critical Tokyo Ohka Kogyo Co Ltd
Priority to JP16119881A priority Critical patent/JPS5795630A/ja
Publication of JPS5795630A publication Critical patent/JPS5795630A/ja
Publication of JPS6148254B2 publication Critical patent/JPS6148254B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3411—Constructional aspects of the reactor
    • H01J37/3435—Target holders (includes backing plates and endblocks)

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Drying Of Semiconductors (AREA)
JP16119881A 1981-10-09 1981-10-09 Automatic plasma treating method Granted JPS5795630A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP16119881A JPS5795630A (en) 1981-10-09 1981-10-09 Automatic plasma treating method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP16119881A JPS5795630A (en) 1981-10-09 1981-10-09 Automatic plasma treating method

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP15979877A Division JPS5493363A (en) 1977-07-18 1977-12-31 Improved plasma reactive processor

Publications (2)

Publication Number Publication Date
JPS5795630A true JPS5795630A (en) 1982-06-14
JPS6148254B2 JPS6148254B2 (enrdf_load_stackoverflow) 1986-10-23

Family

ID=15730446

Family Applications (1)

Application Number Title Priority Date Filing Date
JP16119881A Granted JPS5795630A (en) 1981-10-09 1981-10-09 Automatic plasma treating method

Country Status (1)

Country Link
JP (1) JPS5795630A (enrdf_load_stackoverflow)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08255784A (ja) * 1995-03-17 1996-10-01 Nec Corp 真空処理装置および真空処理方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08255784A (ja) * 1995-03-17 1996-10-01 Nec Corp 真空処理装置および真空処理方法

Also Published As

Publication number Publication date
JPS6148254B2 (enrdf_load_stackoverflow) 1986-10-23

Similar Documents

Publication Publication Date Title
US4208159A (en) Apparatus for the treatment of a wafer by plasma reaction
EP1061557A3 (en) Substrate processing apparatus
EP0398366A3 (en) Semiconductor processing apparatus and method
TW375765B (en) Method for reducing particles deposited onto a semiconductor wafer during plasma processing
JPS5795630A (en) Automatic plasma treating method
JPS5831532A (ja) プラズマ処理装置
JPS5752138A (en) Etching device for semiconductor substrate
JPS5860552A (ja) 縦型自動プラズマ処理装置
JPS564244A (en) Continuous vacuum treatment device for wafer
JPS56161539A (en) Feeding method for photoresist solution
JPS5719219A (en) Wafer carrier jig conveyor
JPS5698478A (en) Vacuum treating device
JPS6431431A (en) Conveying method
JPS6459828A (en) Automatic cleaning apparatus of semiconductor wafer
KR100808820B1 (ko) 진공처리 장치
JPS564233A (en) Continuous handling apparatus for wafer
JPS6423526A (en) Equipment for manufactureing semiconductor device
JPH0219969B2 (enrdf_load_stackoverflow)
JPS5613720A (en) Heat treating device
JPS5447282A (en) Depalletizer
JPS54125975A (en) Anti-contamination method for wafer inside reaction tube
JPS55150920A (en) Plasma continuous treatment apparatus
JPS6468933A (en) Apparatus for treating semiconductor-substrate
JPS6411684A (en) Method and device for cleaning sample carrying-in chamber
JPS57118823A (en) Device for press die