JPS5793529A - Processing method and tool for semiconductor wafer - Google Patents

Processing method and tool for semiconductor wafer

Info

Publication number
JPS5793529A
JPS5793529A JP17008180A JP17008180A JPS5793529A JP S5793529 A JPS5793529 A JP S5793529A JP 17008180 A JP17008180 A JP 17008180A JP 17008180 A JP17008180 A JP 17008180A JP S5793529 A JPS5793529 A JP S5793529A
Authority
JP
Japan
Prior art keywords
rear surface
strain
differring
cutting edge
wafer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP17008180A
Other languages
Japanese (ja)
Inventor
Fumio Shimura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP17008180A priority Critical patent/JPS5793529A/en
Publication of JPS5793529A publication Critical patent/JPS5793529A/en
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/02—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills
    • B28D5/022—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23D—PLANING; SLOTTING; SHEARING; BROACHING; SAWING; FILING; SCRAPING; LIKE OPERATIONS FOR WORKING METAL BY REMOVING MATERIAL, NOT OTHERWISE PROVIDED FOR
    • B23D61/00—Tools for sawing machines or sawing devices; Clamping devices for these tools
    • B23D61/02—Circular saw blades

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)

Abstract

PURPOSE:To make a process unnecessary by which a strain is produced on the rear surface by cutting with a cutting edge having grinding grains differring in qualities and by forming a strain layer of a crystal defect on the wafer rear surface actively when a semiconductor ingot is cut. CONSTITUTION:Grinding grains differring in particle sizes and hardness are provided on both surface of an edge part of a stainless steel plate 4 of a cutting edge. When using such the cutting edge 9, a semiconductor ingot 1 fixed by means of wax 2 is cut on a pedestal 3, a processed wafer having both of right and left surfaces differring in mechanical damages being large and small are provided. A strain layer on the surface 11 is removed. Hereby, a strain layer is left on the rear surface, and thereby a strain forming process for the wafer rear surface is not required.
JP17008180A 1980-12-02 1980-12-02 Processing method and tool for semiconductor wafer Pending JPS5793529A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP17008180A JPS5793529A (en) 1980-12-02 1980-12-02 Processing method and tool for semiconductor wafer

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP17008180A JPS5793529A (en) 1980-12-02 1980-12-02 Processing method and tool for semiconductor wafer

Publications (1)

Publication Number Publication Date
JPS5793529A true JPS5793529A (en) 1982-06-10

Family

ID=15898281

Family Applications (1)

Application Number Title Priority Date Filing Date
JP17008180A Pending JPS5793529A (en) 1980-12-02 1980-12-02 Processing method and tool for semiconductor wafer

Country Status (1)

Country Link
JP (1) JPS5793529A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02107406A (en) * 1988-10-18 1990-04-19 Furukawa Electric Co Ltd:The Cutting method for wafer and cutting rotary blade

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02107406A (en) * 1988-10-18 1990-04-19 Furukawa Electric Co Ltd:The Cutting method for wafer and cutting rotary blade

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