JPS5793225A - Vacuum sealing method of vacuum container for pressure transducer - Google Patents

Vacuum sealing method of vacuum container for pressure transducer

Info

Publication number
JPS5793225A
JPS5793225A JP55170659A JP17065980A JPS5793225A JP S5793225 A JPS5793225 A JP S5793225A JP 55170659 A JP55170659 A JP 55170659A JP 17065980 A JP17065980 A JP 17065980A JP S5793225 A JPS5793225 A JP S5793225A
Authority
JP
Japan
Prior art keywords
hole
vacuum
pressure
silicon
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP55170659A
Other languages
English (en)
Inventor
Yutaka Mihashi
Toshio Sogo
Shoichi Kakimoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP55170659A priority Critical patent/JPS5793225A/ja
Publication of JPS5793225A publication Critical patent/JPS5793225A/ja
Pending legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
    • G01L19/0061—Electrical connection means
    • G01L19/0084—Electrical connection means to the outside of the housing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Measuring Fluid Pressure (AREA)
JP55170659A 1980-12-01 1980-12-01 Vacuum sealing method of vacuum container for pressure transducer Pending JPS5793225A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP55170659A JPS5793225A (en) 1980-12-01 1980-12-01 Vacuum sealing method of vacuum container for pressure transducer

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP55170659A JPS5793225A (en) 1980-12-01 1980-12-01 Vacuum sealing method of vacuum container for pressure transducer

Publications (1)

Publication Number Publication Date
JPS5793225A true JPS5793225A (en) 1982-06-10

Family

ID=15908977

Family Applications (1)

Application Number Title Priority Date Filing Date
JP55170659A Pending JPS5793225A (en) 1980-12-01 1980-12-01 Vacuum sealing method of vacuum container for pressure transducer

Country Status (1)

Country Link
JP (1) JPS5793225A (ja)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0552466A2 (en) * 1992-01-24 1993-07-28 Honda Giken Kogyo Kabushiki Kaisha Method for joining semiconductor substrates
JPH09237901A (ja) * 1996-02-28 1997-09-09 S I I R D Center:Kk 半導体装置
EP0849578A1 (en) * 1996-12-19 1998-06-24 Murata Manufacturing Co., Ltd. Evacuatable package and a method of producing the same
EP0951069A1 (en) * 1998-04-17 1999-10-20 Interuniversitair Microelektronica Centrum Vzw Method of fabrication of a microstructure having an inside cavity
EP0951068A1 (en) * 1998-04-17 1999-10-20 Interuniversitair Micro-Elektronica Centrum Vzw Method of fabrication of a microstructure having an inside cavity
WO2003106957A1 (de) * 2002-06-13 2003-12-24 Robert Bosch Gmbh Sensor mit in eine dichtmasse eingepresstem chipgehäuse
FR3037141A1 (fr) * 2015-06-03 2016-12-09 Sagem Defense Securite Dispositif de detection de pression

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0552466A2 (en) * 1992-01-24 1993-07-28 Honda Giken Kogyo Kabushiki Kaisha Method for joining semiconductor substrates
JPH09237901A (ja) * 1996-02-28 1997-09-09 S I I R D Center:Kk 半導体装置
EP0849578A1 (en) * 1996-12-19 1998-06-24 Murata Manufacturing Co., Ltd. Evacuatable package and a method of producing the same
US6416831B1 (en) 1996-12-19 2002-07-09 Murata Manufacturing Co., Ltd. Evacuated package and a method of producing the same
EP0951069A1 (en) * 1998-04-17 1999-10-20 Interuniversitair Microelektronica Centrum Vzw Method of fabrication of a microstructure having an inside cavity
EP0951068A1 (en) * 1998-04-17 1999-10-20 Interuniversitair Micro-Elektronica Centrum Vzw Method of fabrication of a microstructure having an inside cavity
US6297072B1 (en) * 1998-04-17 2001-10-02 Interuniversitair Micro-Elktronica Centrum (Imec Vzw) Method of fabrication of a microstructure having an internal cavity
WO2003106957A1 (de) * 2002-06-13 2003-12-24 Robert Bosch Gmbh Sensor mit in eine dichtmasse eingepresstem chipgehäuse
FR3037141A1 (fr) * 2015-06-03 2016-12-09 Sagem Defense Securite Dispositif de detection de pression

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