JPS5780020A - Reclamation of copper laminate board - Google Patents

Reclamation of copper laminate board

Info

Publication number
JPS5780020A
JPS5780020A JP15740880A JP15740880A JPS5780020A JP S5780020 A JPS5780020 A JP S5780020A JP 15740880 A JP15740880 A JP 15740880A JP 15740880 A JP15740880 A JP 15740880A JP S5780020 A JPS5780020 A JP S5780020A
Authority
JP
Japan
Prior art keywords
copper layer
laminate board
substrate
copper
filler
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP15740880A
Other languages
Japanese (ja)
Inventor
Toshiyuki Nakajima
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Priority to JP15740880A priority Critical patent/JPS5780020A/en
Publication of JPS5780020A publication Critical patent/JPS5780020A/en
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29B—PREPARATION OR PRETREATMENT OF THE MATERIAL TO BE SHAPED; MAKING GRANULES OR PREFORMS; RECOVERY OF PLASTICS OR OTHER CONSTITUENTS OF WASTE MATERIAL CONTAINING PLASTICS
    • B29B17/00—Recovery of plastics or other constituents of waste material containing plastics
    • B29B17/02—Separating plastics from other materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2705/00—Use of metals, their alloys or their compounds, for preformed parts, e.g. for inserts
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2705/00—Use of metals, their alloys or their compounds, for preformed parts, e.g. for inserts
    • B29K2705/08—Transition metals
    • B29K2705/10—Copper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2009/00—Layered products
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2009/00—Layered products
    • B29L2009/005—Layered products coated
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02W—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO WASTEWATER TREATMENT OR WASTE MANAGEMENT
    • Y02W30/00—Technologies for solid waste management
    • Y02W30/50—Reuse, recycling or recovery technologies
    • Y02W30/62—Plastics recycling; Rubber recycling

Abstract

PURPOSE:To reclaim effectively the fag end, the defective and recovered things as the filler for plastics molded articles without discarding, by removing the copper layer of the copper laminate board and pulverizing the substrate. CONSTITUTION:The copper layer of the copper laminate board[being formed by adhesive bonding or non-electrolytic plating etc. of the copper layer of the substrate composed of synthetic resin impregnating paper (40-60%)]is removed by the physical method such as mechanical grinding by the grinder, gravitational separation method due to the difference of specific gravity etc., or the chemical method like corrosion and removal by an etching agent. Then it is washed, dried and pulverized. The particle size of the pulverized substrate is preferably 50-200 mesh and the ball mill milling is most suitable for fine pulverization over 100 mesh. It is light weight and has good miscibility in case of utilizing it as the filler for plastics articles to be molded.
JP15740880A 1980-11-07 1980-11-07 Reclamation of copper laminate board Pending JPS5780020A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15740880A JPS5780020A (en) 1980-11-07 1980-11-07 Reclamation of copper laminate board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15740880A JPS5780020A (en) 1980-11-07 1980-11-07 Reclamation of copper laminate board

Publications (1)

Publication Number Publication Date
JPS5780020A true JPS5780020A (en) 1982-05-19

Family

ID=15648970

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15740880A Pending JPS5780020A (en) 1980-11-07 1980-11-07 Reclamation of copper laminate board

Country Status (1)

Country Link
JP (1) JPS5780020A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58199866A (en) * 1982-05-14 1983-11-21 Nippon Soda Co Ltd Method and device for treating waste printed wiring board
JP2006192702A (en) * 2005-01-13 2006-07-27 Asahi Kasei Construction Materials Co Ltd Separation method of flexible face material of resin foam with flexible face material and resin foam

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58199866A (en) * 1982-05-14 1983-11-21 Nippon Soda Co Ltd Method and device for treating waste printed wiring board
JPH032935B2 (en) * 1982-05-14 1991-01-17 Nippon Soda Co
JP2006192702A (en) * 2005-01-13 2006-07-27 Asahi Kasei Construction Materials Co Ltd Separation method of flexible face material of resin foam with flexible face material and resin foam
JP4545597B2 (en) * 2005-01-13 2010-09-15 旭化成建材株式会社 Separating method of flexible foam of resin foam with flexible face material and resin foam

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