JPS577983A - Display device - Google Patents

Display device

Info

Publication number
JPS577983A
JPS577983A JP8211680A JP8211680A JPS577983A JP S577983 A JPS577983 A JP S577983A JP 8211680 A JP8211680 A JP 8211680A JP 8211680 A JP8211680 A JP 8211680A JP S577983 A JPS577983 A JP S577983A
Authority
JP
Japan
Prior art keywords
led
electrodes
constituted
fixed
multicolored
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP8211680A
Other languages
Japanese (ja)
Inventor
Tetsuo Sadamasa
Osamu Ichikawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP8211680A priority Critical patent/JPS577983A/en
Publication of JPS577983A publication Critical patent/JPS577983A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
    • H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Led Device Packages (AREA)
  • Led Devices (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)

Abstract

PURPOSE:To increase the efficiency of manufacturing work as well as to cut down cost by a method wherein the cathode electrodes or anode electrodes of a plurality of LED pellets, having different luminescent wavelength, are formed in one body through the intermediary of a ferromagnetic conductive material in such manner that said electrodes are formed electrically conductive to each other. CONSTITUTION:A P type GaP layer 312 is formed on an N type CaP substrate 311 and then a cathode electrode 313 and an anode electrode 314 are formed. The LED wafers 315 and 316 thus formed are fixed on a nickel plate 312 using alloy 322, having a low melting point and a multicolored LED wafer 323 is constituted. Then, the multicolored LED wafer 323 is separated by cutting and a multicolor light emitting LED331, formed in one body, is constituted. Then, LED's 345-347 which are formed in one body are attracted by magnetic heads 341-343, transferred to a substrate 354 and fixed there.
JP8211680A 1980-06-19 1980-06-19 Display device Pending JPS577983A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8211680A JPS577983A (en) 1980-06-19 1980-06-19 Display device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8211680A JPS577983A (en) 1980-06-19 1980-06-19 Display device

Publications (1)

Publication Number Publication Date
JPS577983A true JPS577983A (en) 1982-01-16

Family

ID=13765433

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8211680A Pending JPS577983A (en) 1980-06-19 1980-06-19 Display device

Country Status (1)

Country Link
JP (1) JPS577983A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0342730A2 (en) * 1988-05-02 1989-11-23 Theodorus Schouten Device for determining the erythrocyte sedimentation rate of blood samples
JPH0229686A (en) * 1988-07-19 1990-01-31 Koito Ind Ltd Information display device
JPH0489735U (en) * 1990-06-29 1992-08-05
US6919581B2 (en) * 2000-08-18 2005-07-19 Sony Corporation Image display unit and production method thereof
CN107425101A (en) * 2017-07-11 2017-12-01 华灿光电（浙江）有限公司 A kind of method of micro-led chip flood tide transfer

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0342730A2 (en) * 1988-05-02 1989-11-23 Theodorus Schouten Device for determining the erythrocyte sedimentation rate of blood samples
JPH0229686A (en) * 1988-07-19 1990-01-31 Koito Ind Ltd Information display device
JPH0489735U (en) * 1990-06-29 1992-08-05
US6919581B2 (en) * 2000-08-18 2005-07-19 Sony Corporation Image display unit and production method thereof
CN107425101A (en) * 2017-07-11 2017-12-01 华灿光电（浙江）有限公司 A kind of method of micro-led chip flood tide transfer
CN107425101B (en) * 2017-07-11 2019-03-01 华灿光电（浙江）有限公司 A kind of method of micro-led chip flood tide transfer

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