JPS5772322A - Method of generating alloyed metallic contact layer to surface of semiconductor - Google Patents

Method of generating alloyed metallic contact layer to surface of semiconductor

Info

Publication number
JPS5772322A
JPS5772322A JP56132549A JP13254981A JPS5772322A JP S5772322 A JPS5772322 A JP S5772322A JP 56132549 A JP56132549 A JP 56132549A JP 13254981 A JP13254981 A JP 13254981A JP S5772322 A JPS5772322 A JP S5772322A
Authority
JP
Japan
Prior art keywords
semiconductor
generating
contact layer
metallic contact
alloyed metallic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP56132549A
Other languages
English (en)
Japanese (ja)
Inventor
Patarongu Fuuberuto
Efu Kurinmeru Ebaaharuto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens Schuckertwerke AG
Siemens Corp
Original Assignee
Siemens Schuckertwerke AG
Siemens Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Schuckertwerke AG, Siemens Corp filed Critical Siemens Schuckertwerke AG
Publication of JPS5772322A publication Critical patent/JPS5772322A/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D64/00—Electrodes of devices having potential barriers
    • H10D64/01—Manufacture or treatment
    • H10D64/011—Manufacture or treatment of electrodes ohmically coupled to a semiconductor
    • H10D64/0111—Manufacture or treatment of electrodes ohmically coupled to a semiconductor to Group IV semiconductors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D64/00—Electrodes of devices having potential barriers
    • H10D64/01—Manufacture or treatment
    • H10D64/011—Manufacture or treatment of electrodes ohmically coupled to a semiconductor
    • H10D64/0111—Manufacture or treatment of electrodes ohmically coupled to a semiconductor to Group IV semiconductors
    • H10D64/0112—Manufacture or treatment of electrodes ohmically coupled to a semiconductor to Group IV semiconductors using conductive layers comprising silicides
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D64/00—Electrodes of devices having potential barriers
    • H10D64/60—Electrodes characterised by their materials
    • H10D64/62—Electrodes ohmically coupled to a semiconductor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P34/00—Irradiation with electromagnetic or particle radiation of wafers, substrates or parts of devices
    • H10P34/40—Irradiation with electromagnetic or particle radiation of wafers, substrates or parts of devices with high-energy radiation
    • H10P34/42—Irradiation with electromagnetic or particle radiation of wafers, substrates or parts of devices with high-energy radiation with electromagnetic radiation, e.g. laser annealing
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • H10P95/50—Alloying conductive materials with semiconductor bodies
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • H10P95/90—Thermal treatments, e.g. annealing or sintering

Landscapes

  • Electrodes Of Semiconductors (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
  • Recrystallisation Techniques (AREA)
  • Thyristors (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
JP56132549A 1980-08-28 1981-08-24 Method of generating alloyed metallic contact layer to surface of semiconductor Pending JPS5772322A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19803032461 DE3032461A1 (de) 1980-08-28 1980-08-28 Verfahren zum herstellen von legierten metallkontaktschichten auf kristallorientierten halbleiteroberflaechen mittels energiepulsbestrahlung

Publications (1)

Publication Number Publication Date
JPS5772322A true JPS5772322A (en) 1982-05-06

Family

ID=6110613

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56132549A Pending JPS5772322A (en) 1980-08-28 1981-08-24 Method of generating alloyed metallic contact layer to surface of semiconductor

Country Status (2)

Country Link
JP (1) JPS5772322A (https=)
DE (1) DE3032461A1 (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6878574B2 (en) 2002-01-17 2005-04-12 Sony Corporation Alloying method for a image display device using laser irradiation

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS51111061A (en) * 1975-03-26 1976-10-01 Hitachi Ltd Electrode forming method
JPS5723223A (en) * 1980-07-18 1982-02-06 Fujitsu Ltd Manufacture of compound semiconductor device

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL6413441A (https=) * 1964-11-19 1966-05-20
GB1057687A (en) * 1964-12-11 1967-02-08 Associated Semiconductor Mft Improvements in and relating to methods of manufacturing semiconductor devices
SE392783B (sv) * 1975-06-19 1977-04-18 Asea Ab Halvledaranordning innefattande en tyristor och en felteffekttransistordel
US4059461A (en) * 1975-12-10 1977-11-22 Massachusetts Institute Of Technology Method for improving the crystallinity of semiconductor films by laser beam scanning and the products thereof
DE2825212C2 (de) * 1978-06-08 1980-03-27 Siemens Ag, 1000 Berlin Und 8000 Muenchen Verfahren zur Herstellung von Halbleiterbauelementen mittels eines kurzen, intensiven Laserlichtpulses
CH638641A5 (de) * 1978-11-17 1983-09-30 Univ Bern Inst Fuer Angewandte Halbleiterbauelement, verfahren zu dessen herstellung und verwendung des halbleiterbauelements.

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS51111061A (en) * 1975-03-26 1976-10-01 Hitachi Ltd Electrode forming method
JPS5723223A (en) * 1980-07-18 1982-02-06 Fujitsu Ltd Manufacture of compound semiconductor device

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6878574B2 (en) 2002-01-17 2005-04-12 Sony Corporation Alloying method for a image display device using laser irradiation
US7008827B2 (en) 2002-01-17 2006-03-07 Sony Corporation Alloy method using laser irradiation
US7011990B2 (en) 2002-01-17 2006-03-14 Sony Corporation Alloying method using laser irradiation for a light emitting device
US7049227B2 (en) 2002-01-17 2006-05-23 Sony Corporation Method for alloying a wiring portion for a image display device
US7319052B2 (en) 2002-01-17 2008-01-15 Sony Corporation Alloying method, and wiring forming method, display device forming method, and image display unit fabricating method

Also Published As

Publication number Publication date
DE3032461C2 (https=) 1989-04-13
DE3032461A1 (de) 1982-04-01

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