JPS577132A - Resin sealing device for semiconductor device - Google Patents

Resin sealing device for semiconductor device

Info

Publication number
JPS577132A
JPS577132A JP8164480A JP8164480A JPS577132A JP S577132 A JPS577132 A JP S577132A JP 8164480 A JP8164480 A JP 8164480A JP 8164480 A JP8164480 A JP 8164480A JP S577132 A JPS577132 A JP S577132A
Authority
JP
Japan
Prior art keywords
resin
molded product
rods
dies
cavities
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP8164480A
Other languages
Japanese (ja)
Inventor
Naoto Kimura
Katsuhiro Nishimura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Kyushu Ltd
Original Assignee
NEC Kyushu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Kyushu Ltd filed Critical NEC Kyushu Ltd
Priority to JP8164480A priority Critical patent/JPS577132A/en
Publication of JPS577132A publication Critical patent/JPS577132A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/565—Moulds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)

Abstract

PURPOSE:To readily take out a molded product in a sealing step by forming a cavity to which no resin is charged at the position where upper and lower dies face each other and mounting an elevationally movable exhausting rod in each cavity. CONSTITUTION:A lead frame 13 is interposed between upper and lower dies 11 and 12, resin 14 is filled in the mold, and a molded product is formed. Cavities 18, 19 are so formed in addition to the resin filling part in the dies 11, 12 as to confront each other, and exhausting rods 15, 16 are respectively mounted in the cavities 18, 19. After the resin 14 is charged and discharged, the dies 11, 12 are opened, the rods 15, 16 are moved in the direction indicated by the arrows 20, 21, the lead frame 13 is then pushed, and the molded product is removed from the mold. Thus, the operation of the rods can be readily performed, and the resin is not filled therein. Accordingly, it can prevent the production of burr at the molded product.
JP8164480A 1980-06-17 1980-06-17 Resin sealing device for semiconductor device Pending JPS577132A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8164480A JPS577132A (en) 1980-06-17 1980-06-17 Resin sealing device for semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8164480A JPS577132A (en) 1980-06-17 1980-06-17 Resin sealing device for semiconductor device

Publications (1)

Publication Number Publication Date
JPS577132A true JPS577132A (en) 1982-01-14

Family

ID=13752040

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8164480A Pending JPS577132A (en) 1980-06-17 1980-06-17 Resin sealing device for semiconductor device

Country Status (1)

Country Link
JP (1) JPS577132A (en)

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