JPS5768061A - Lead material for semiconductor device - Google Patents
Lead material for semiconductor deviceInfo
- Publication number
- JPS5768061A JPS5768061A JP14390880A JP14390880A JPS5768061A JP S5768061 A JPS5768061 A JP S5768061A JP 14390880 A JP14390880 A JP 14390880A JP 14390880 A JP14390880 A JP 14390880A JP S5768061 A JPS5768061 A JP S5768061A
- Authority
- JP
- Japan
- Prior art keywords
- strength
- heat resistance
- elements
- alloy
- contained
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000463 material Substances 0.000 title abstract 2
- 239000004065 semiconductor Substances 0.000 title 1
- 229910045601 alloy Inorganic materials 0.000 abstract 2
- 239000000956 alloy Substances 0.000 abstract 2
- 229910000881 Cu alloy Inorganic materials 0.000 abstract 1
- 238000007792 addition Methods 0.000 abstract 1
- 238000000137 annealing Methods 0.000 abstract 1
- 238000005452 bending Methods 0.000 abstract 1
- 238000005097 cold rolling Methods 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49579—Lead-frames or other flat leads characterised by the materials of the lead frames or layers thereon
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Lead Frames For Integrated Circuits (AREA)
- Conductive Materials (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP14390880A JPS5768061A (en) | 1980-10-15 | 1980-10-15 | Lead material for semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP14390880A JPS5768061A (en) | 1980-10-15 | 1980-10-15 | Lead material for semiconductor device |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5768061A true JPS5768061A (en) | 1982-04-26 |
JPS6332854B2 JPS6332854B2 (enrdf_load_stackoverflow) | 1988-07-01 |
Family
ID=15349871
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP14390880A Granted JPS5768061A (en) | 1980-10-15 | 1980-10-15 | Lead material for semiconductor device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5768061A (enrdf_load_stackoverflow) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59140341A (ja) * | 1983-01-29 | 1984-08-11 | Furukawa Electric Co Ltd:The | リ−ドフレ−ム用銅合金 |
JPS605550A (ja) * | 1983-06-24 | 1985-01-12 | Toshiba Corp | 電子部品 |
US5853505A (en) * | 1997-04-18 | 1998-12-29 | Olin Corporation | Iron modified tin brass |
US5882442A (en) * | 1995-10-20 | 1999-03-16 | Olin Corporation | Iron modified phosphor-bronze |
US6132528A (en) * | 1997-04-18 | 2000-10-17 | Olin Corporation | Iron modified tin brass |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH06304889A (ja) * | 1993-04-21 | 1994-11-01 | Nakatetsuku Kk | 吸着ユニット及びこれを用いたキャップ箱詰め装置 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5424811A (en) * | 1977-07-27 | 1979-02-24 | Hitachi Cable Ltd | Copper alloy for lead conductor of semiconductor device |
JPS5426219A (en) * | 1977-07-30 | 1979-02-27 | Furukawa Electric Co Ltd:The | Electric conductive copper alloy of superior solderability |
-
1980
- 1980-10-15 JP JP14390880A patent/JPS5768061A/ja active Granted
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5424811A (en) * | 1977-07-27 | 1979-02-24 | Hitachi Cable Ltd | Copper alloy for lead conductor of semiconductor device |
JPS5426219A (en) * | 1977-07-30 | 1979-02-27 | Furukawa Electric Co Ltd:The | Electric conductive copper alloy of superior solderability |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59140341A (ja) * | 1983-01-29 | 1984-08-11 | Furukawa Electric Co Ltd:The | リ−ドフレ−ム用銅合金 |
JPS605550A (ja) * | 1983-06-24 | 1985-01-12 | Toshiba Corp | 電子部品 |
US5882442A (en) * | 1995-10-20 | 1999-03-16 | Olin Corporation | Iron modified phosphor-bronze |
US5853505A (en) * | 1997-04-18 | 1998-12-29 | Olin Corporation | Iron modified tin brass |
US6132528A (en) * | 1997-04-18 | 2000-10-17 | Olin Corporation | Iron modified tin brass |
Also Published As
Publication number | Publication date |
---|---|
JPS6332854B2 (enrdf_load_stackoverflow) | 1988-07-01 |
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