JPS5766654A - Ebullition type cooling module - Google Patents
Ebullition type cooling moduleInfo
- Publication number
- JPS5766654A JPS5766654A JP55143124A JP14312480A JPS5766654A JP S5766654 A JPS5766654 A JP S5766654A JP 55143124 A JP55143124 A JP 55143124A JP 14312480 A JP14312480 A JP 14312480A JP S5766654 A JPS5766654 A JP S5766654A
- Authority
- JP
- Japan
- Prior art keywords
- module
- large number
- cooling module
- type cooling
- cylindrical projections
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H10W40/73—
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP55143124A JPS5766654A (en) | 1980-10-14 | 1980-10-14 | Ebullition type cooling module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP55143124A JPS5766654A (en) | 1980-10-14 | 1980-10-14 | Ebullition type cooling module |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5766654A true JPS5766654A (en) | 1982-04-22 |
| JPH0157503B2 JPH0157503B2 (Direct) | 1989-12-06 |
Family
ID=15331468
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP55143124A Granted JPS5766654A (en) | 1980-10-14 | 1980-10-14 | Ebullition type cooling module |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5766654A (Direct) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2002011506A3 (en) * | 2000-08-02 | 2002-04-04 | Incep Technologies Inc | Vapor chamber with integrated pin array |
| WO2002071479A1 (en) * | 2001-02-28 | 2002-09-12 | Intel Corporation | Heat dissipation device |
| US6490160B2 (en) | 1999-07-15 | 2002-12-03 | Incep Technologies, Inc. | Vapor chamber with integrated pin array |
| US6801431B2 (en) | 1999-07-15 | 2004-10-05 | Incep Technologies, Inc. | Integrated power delivery and cooling system for high power microprocessors |
| JP2016072604A (ja) * | 2014-09-30 | 2016-05-09 | 旭徳科技股▲ふん▼有限公司 | 放熱モジュール |
| JP2023513716A (ja) * | 2020-02-11 | 2023-04-03 | アイスオトープ・グループ・リミテッド | 複数の電子機器の液浸冷却のためのハウジング |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7352848B2 (ja) * | 2019-05-21 | 2023-09-29 | 株式会社ロータス・サーマル・ソリューション | 冷却装置における冷却液の熱を取り出す熱交換構造、及び該熱交換構造を備える冷却装置 |
-
1980
- 1980-10-14 JP JP55143124A patent/JPS5766654A/ja active Granted
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6490160B2 (en) | 1999-07-15 | 2002-12-03 | Incep Technologies, Inc. | Vapor chamber with integrated pin array |
| US6801431B2 (en) | 1999-07-15 | 2004-10-05 | Incep Technologies, Inc. | Integrated power delivery and cooling system for high power microprocessors |
| WO2002011506A3 (en) * | 2000-08-02 | 2002-04-04 | Incep Technologies Inc | Vapor chamber with integrated pin array |
| WO2002071479A1 (en) * | 2001-02-28 | 2002-09-12 | Intel Corporation | Heat dissipation device |
| JP2016072604A (ja) * | 2014-09-30 | 2016-05-09 | 旭徳科技股▲ふん▼有限公司 | 放熱モジュール |
| JP2023513716A (ja) * | 2020-02-11 | 2023-04-03 | アイスオトープ・グループ・リミテッド | 複数の電子機器の液浸冷却のためのハウジング |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0157503B2 (Direct) | 1989-12-06 |
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