JPS5766653A - Ebullition type cooling module - Google Patents

Ebullition type cooling module

Info

Publication number
JPS5766653A
JPS5766653A JP14312380A JP14312380A JPS5766653A JP S5766653 A JPS5766653 A JP S5766653A JP 14312380 A JP14312380 A JP 14312380A JP 14312380 A JP14312380 A JP 14312380A JP S5766653 A JPS5766653 A JP S5766653A
Authority
JP
Japan
Prior art keywords
module
cooling
type cooling
cooling module
ebullition
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP14312380A
Other languages
Japanese (ja)
Inventor
Kishio Yokouchi
Nobuo Kamehara
Koichi Niwa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP14312380A priority Critical patent/JPS5766653A/en
Publication of JPS5766653A publication Critical patent/JPS5766653A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/153—Connection portion
    • H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
    • H01L2924/15312—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a pin array, e.g. PGA

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

PURPOSE:To form a compact and lightweight ebullition type cooling module, by using a container having a rectangular cross-section as the sections corresponding to inner and outer fins of the module. CONSTITUTION:A substrate 5 mounted with semiconductor elements 6 and a rectangularly corrugated container 8 are combined through a packing 9 to form a cooling type module 10. A coolant 11 is enclosed in the module 10. Because the module 10 has a rectangulary corrugated shape, it is possible to obtain the same cooling effect as one having cooling fins inside and outside the module 10.
JP14312380A 1980-10-14 1980-10-14 Ebullition type cooling module Pending JPS5766653A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14312380A JPS5766653A (en) 1980-10-14 1980-10-14 Ebullition type cooling module

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14312380A JPS5766653A (en) 1980-10-14 1980-10-14 Ebullition type cooling module

Publications (1)

Publication Number Publication Date
JPS5766653A true JPS5766653A (en) 1982-04-22

Family

ID=15331444

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14312380A Pending JPS5766653A (en) 1980-10-14 1980-10-14 Ebullition type cooling module

Country Status (1)

Country Link
JP (1) JPS5766653A (en)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0201652A1 (en) * 1985-05-10 1986-11-20 BBC Aktiengesellschaft Brown, Boveri & Cie. Boiler cooling for semiconductors, particularly for power rectifiers
JPH0742182U (en) * 1993-12-27 1995-07-21 株式会社高岳製作所 Heat dissipation device for electrical equipment
US5458189A (en) * 1993-09-10 1995-10-17 Aavid Laboratories Two-phase component cooler
US5587880A (en) * 1995-06-28 1996-12-24 Aavid Laboratories, Inc. Computer cooling system operable under the force of gravity in first orientation and against the force of gravity in second orientation
US6357517B1 (en) 1994-07-04 2002-03-19 Denso Corporation Cooling apparatus boiling and condensing refrigerant
WO2002071479A1 (en) * 2001-02-28 2002-09-12 Intel Corporation Heat dissipation device
JP2019038100A (en) * 2017-08-01 2019-03-14 アナログ・ディヴァイシス・グローバル・アンリミテッド・カンパニー Monolithic phase change heat dissipating device

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0201652A1 (en) * 1985-05-10 1986-11-20 BBC Aktiengesellschaft Brown, Boveri & Cie. Boiler cooling for semiconductors, particularly for power rectifiers
US5458189A (en) * 1993-09-10 1995-10-17 Aavid Laboratories Two-phase component cooler
JPH0742182U (en) * 1993-12-27 1995-07-21 株式会社高岳製作所 Heat dissipation device for electrical equipment
US6357517B1 (en) 1994-07-04 2002-03-19 Denso Corporation Cooling apparatus boiling and condensing refrigerant
US5587880A (en) * 1995-06-28 1996-12-24 Aavid Laboratories, Inc. Computer cooling system operable under the force of gravity in first orientation and against the force of gravity in second orientation
WO2002071479A1 (en) * 2001-02-28 2002-09-12 Intel Corporation Heat dissipation device
JP2019038100A (en) * 2017-08-01 2019-03-14 アナログ・ディヴァイシス・グローバル・アンリミテッド・カンパニー Monolithic phase change heat dissipating device
US10597286B2 (en) 2017-08-01 2020-03-24 Analog Devices Global Monolithic phase change heat sink

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