WO2002011506A3 - Vapor chamber with integrated pin array - Google Patents

Vapor chamber with integrated pin array Download PDF

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Publication number
WO2002011506A3
WO2002011506A3 PCT/US2001/024477 US0124477W WO0211506A3 WO 2002011506 A3 WO2002011506 A3 WO 2002011506A3 US 0124477 W US0124477 W US 0124477W WO 0211506 A3 WO0211506 A3 WO 0211506A3
Authority
WO
WIPO (PCT)
Prior art keywords
thermally conductive
conductive chamber
pin array
vapor chamber
chamber portion
Prior art date
Application number
PCT/US2001/024477
Other languages
French (fr)
Other versions
WO2002011506A2 (en
Inventor
Joseph Ted Ii Dibene
Farhad Raiszadeh
Original Assignee
Incep Technologies Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to AU7816501A priority Critical patent/AU7816501A/en
Application filed by Incep Technologies Inc filed Critical Incep Technologies Inc
Publication of WO2002011506A2 publication Critical patent/WO2002011506A2/en
Publication of WO2002011506A3 publication Critical patent/WO2002011506A3/en

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/18—Packaging or power distribution
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/18—Packaging or power distribution
    • G06F1/181—Enclosures
    • G06F1/182—Enclosures with special features, e.g. for use in industrial environments; grounding or shielding against radio frequency interference [RFI] or electromagnetical interference [EMI]
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/18—Packaging or power distribution
    • G06F1/189—Power distribution
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/51—Fixed connections for rigid printed circuits or like structures
    • H01R12/52—Fixed connections for rigid printed circuits or like structures connecting to other rigid printed circuits or like structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/7088—Arrangements for power supply
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/1517—Multilayer substrate
    • H01L2924/15192—Resurf arrangement of the internal vias
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0263—High current adaptations, e.g. printed high current conductors or using auxiliary non-printed means; Fine and coarse circuit patterns on one circuit board
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10325—Sockets, i.e. female type connectors comprising metallic connector elements integrated in, or bonded to a common dielectric support
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10704—Pin grid array [PGA]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/368—Assembling printed circuits with other printed circuits parallel to each other

Landscapes

  • Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Human Computer Interaction (AREA)
  • General Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electromagnetism (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

A heat transfer device wherein a vapor chamber is combined with a pin structure that allows the highly conductive cooling vapors to flow within the pins of a pin array maximizing the efficiency of both components of the heat sink into one unit is disclosed. In one embodiment the heat transfer device comprises a thermally conductive chamber having a first thermally conductive chamber portion having a base thermally coupleable to a heat dissipating device; a second thermally conductive chamber portion having a plurality of hollow protrusions extending away from and in fluid communication with the first thermally conductive chamber portion wherein the thermally conductive chamber comprises a fluid vaporizable when in thermal communication with the heat dissipating device and condensable when in thermal communication with the hollow protrusions.
PCT/US2001/024477 2000-08-02 2001-08-02 Vapor chamber with integrated pin array WO2002011506A2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
AU7816501A AU7816501A (en) 2000-08-02 2001-08-01 Vapor chamber with integrated pin array

Applications Claiming Priority (32)

Application Number Priority Date Filing Date Title
US22238600P 2000-08-02 2000-08-02
US22240700P 2000-08-02 2000-08-02
US60/222,407 2000-08-02
US60/222,386 2000-08-02
US23297100P 2000-09-14 2000-09-14
US60/232,971 2000-09-14
US25122300P 2000-12-04 2000-12-04
US25122200P 2000-12-04 2000-12-04
US25118400P 2000-12-04 2000-12-04
US60/251,223 2000-12-04
US60/251,222 2000-12-04
US60/251,184 2000-12-04
US26694101P 2001-02-06 2001-02-06
US60/266,941 2001-02-06
US27736901P 2001-03-19 2001-03-19
US60/277,369 2001-03-19
US28786001P 2001-05-01 2001-05-01
US60/287,860 2001-05-01
US29174901P 2001-05-16 2001-05-16
US29177201P 2001-05-16 2001-05-16
US60/291,772 2001-05-16
US60/291,749 2001-05-16
US29212501P 2001-05-18 2001-05-18
US60/292,125 2001-05-18
US29957301P 2001-06-19 2001-06-19
US60/299,573 2001-06-19
US30175301P 2001-06-27 2001-06-27
US60/301,753 2001-06-27
US30493001P 2001-07-11 2001-07-11
US30492901P 2001-07-11 2001-07-11
US60/304,930 2001-07-11
US60/304,929 2001-07-11

Publications (2)

Publication Number Publication Date
WO2002011506A2 WO2002011506A2 (en) 2002-02-07
WO2002011506A3 true WO2002011506A3 (en) 2002-04-04

Family

ID=27585828

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2001/024477 WO2002011506A2 (en) 2000-08-02 2001-08-02 Vapor chamber with integrated pin array

Country Status (2)

Country Link
AU (1) AU7816501A (en)
WO (1) WO2002011506A2 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20230164953A1 (en) * 2021-11-24 2023-05-25 Microsoft Technology Licensing, Llc Systems and methods for three-dimensional vapor chambers in immersion-cooled datacenters

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5766654A (en) * 1980-10-14 1982-04-22 Fujitsu Ltd Ebullition type cooling module
JPS58175851A (en) * 1983-03-18 1983-10-15 Hitachi Ltd Enclosed type boiling cooler
EP0910235A1 (en) * 1997-09-30 1999-04-21 Lucent Technologies Inc. Composite heat sink

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5766654A (en) * 1980-10-14 1982-04-22 Fujitsu Ltd Ebullition type cooling module
JPS58175851A (en) * 1983-03-18 1983-10-15 Hitachi Ltd Enclosed type boiling cooler
EP0910235A1 (en) * 1997-09-30 1999-04-21 Lucent Technologies Inc. Composite heat sink

Non-Patent Citations (3)

* Cited by examiner, † Cited by third party
Title
"PIN FIN ARRAY HEAT PIPE APPARATUS", IBM TECHNICAL DISCLOSURE BULLETIN, IBM CORP. NEW YORK, US, vol. 37, no. 9, 1 September 1994 (1994-09-01), pages 171, XP000473373, ISSN: 0018-8689 *
PATENT ABSTRACTS OF JAPAN vol. 006, no. 144 (E - 122) 3 August 1982 (1982-08-03) *
PATENT ABSTRACTS OF JAPAN vol. 008, no. 013 (E - 222) 20 January 1984 (1984-01-20) *

Also Published As

Publication number Publication date
WO2002011506A2 (en) 2002-02-07
AU7816501A (en) 2002-02-13

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