JPS576482A - Bubble memory device - Google Patents

Bubble memory device

Info

Publication number
JPS576482A
JPS576482A JP7775780A JP7775780A JPS576482A JP S576482 A JPS576482 A JP S576482A JP 7775780 A JP7775780 A JP 7775780A JP 7775780 A JP7775780 A JP 7775780A JP S576482 A JPS576482 A JP S576482A
Authority
JP
Japan
Prior art keywords
ceramic
chip
case
bubble memory
wire
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP7775780A
Other languages
Japanese (ja)
Inventor
Wataru Nozaki
Susumu Kurokawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP7775780A priority Critical patent/JPS576482A/en
Publication of JPS576482A publication Critical patent/JPS576482A/en
Pending legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11C—STATIC STORES
    • G11C19/00—Digital stores in which the information is moved stepwise, e.g. shift registers
    • G11C19/02—Digital stores in which the information is moved stepwise, e.g. shift registers using magnetic elements
    • G11C19/08—Digital stores in which the information is moved stepwise, e.g. shift registers using magnetic elements using thin films in plane structure
    • G11C19/085—Generating magnetic fields therefor, e.g. uniform magnetic field for magnetic domain stabilisation

Abstract

PURPOSE:To obtain a bubble memory device which is satisfactory in moistureproof, and also inexpensive, by enclosing a bubble memory chip in a case made of ceramic, which case is provided with a standardized simple shape and a hermetic lead wire, and installing it to a desired substrate. CONSTITUTION:A chip 4 is made to die-bond to the bottom face of a case 1 made of ceramic by means of silver pasting. Wire-bonding is made between a bonding pad 5 of a hermetic drawing wiring, and a bonding pad of the chip 4 by use of a metallic wire or an aluminum wire. A cover 6 is made to adhere closely by a reflow solder layer 7 which is provided in advance on an outside circumferential wall end. Subsequently, a notch 8 is sealed by soler 9. The surface of ceramic for making an adhering operation is covered in advance with a metallic layer of gold, etc. The case 1 made of ceramic in which the chip 4 is enclosed hermetically is installed to a plastic substrate according to a kind of the device. In this way, a bubble memory device which is satisfactory in moisturepoof, and also inexpensive is obtained.
JP7775780A 1980-06-11 1980-06-11 Bubble memory device Pending JPS576482A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7775780A JPS576482A (en) 1980-06-11 1980-06-11 Bubble memory device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7775780A JPS576482A (en) 1980-06-11 1980-06-11 Bubble memory device

Publications (1)

Publication Number Publication Date
JPS576482A true JPS576482A (en) 1982-01-13

Family

ID=13642793

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7775780A Pending JPS576482A (en) 1980-06-11 1980-06-11 Bubble memory device

Country Status (1)

Country Link
JP (1) JPS576482A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6060099U (en) * 1983-09-30 1985-04-26 富士通株式会社 magnetic bubble memory package

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6060099U (en) * 1983-09-30 1985-04-26 富士通株式会社 magnetic bubble memory package
JPS6320000Y2 (en) * 1983-09-30 1988-06-03

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