JPS5760877A - Fabrication of piezo-electric ceramic substrate - Google Patents
Fabrication of piezo-electric ceramic substrateInfo
- Publication number
- JPS5760877A JPS5760877A JP55137199A JP13719980A JPS5760877A JP S5760877 A JPS5760877 A JP S5760877A JP 55137199 A JP55137199 A JP 55137199A JP 13719980 A JP13719980 A JP 13719980A JP S5760877 A JPS5760877 A JP S5760877A
- Authority
- JP
- Japan
- Prior art keywords
- ceramic substrate
- piezo
- fabrication
- powder
- baked
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/01—Manufacture or treatment
- H10N30/09—Forming piezoelectric or electrostrictive materials
- H10N30/093—Forming inorganic materials
- H10N30/097—Forming inorganic materials by sintering
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/80—Constructional details
- H10N30/85—Piezoelectric or electrostrictive active materials
- H10N30/853—Ceramic compositions
- H10N30/8548—Lead based oxides
Abstract
PURPOSE:To stabilize the fabrication of a piezoelectric ceramic substrate by a method wherein a green sheet of piezo-electric ceramics 30mu-300mu thick is laminated and baked by using ZrO2 powders with impurity of 95% or larger and with sizing of 2mu-7mu in particle diameter. CONSTITUTION:A green sheet is produced by adding an organic binder and a plastic agent to Pb(Mg1/3Nb2/3)O3-Pb TiO3-PbZrO3 powder, and then after cutting into a fixed shape, ZrO2 powder sized for 2mu-7mu particle diameter and having the impurity of 95% or larger as an inserting powder for reactive use is superimposed, and this chip is baked as determined. Thus, a ceramic substrate with thin plate, especially 100mu or less thick, is produced with high stability.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP55137199A JPS6048115B2 (en) | 1980-09-30 | 1980-09-30 | Method of manufacturing piezoelectric ceramic substrate |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP55137199A JPS6048115B2 (en) | 1980-09-30 | 1980-09-30 | Method of manufacturing piezoelectric ceramic substrate |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5760877A true JPS5760877A (en) | 1982-04-13 |
JPS6048115B2 JPS6048115B2 (en) | 1985-10-25 |
Family
ID=15193102
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP55137199A Expired JPS6048115B2 (en) | 1980-09-30 | 1980-09-30 | Method of manufacturing piezoelectric ceramic substrate |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6048115B2 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7100254B2 (en) * | 1998-02-18 | 2006-09-05 | Sony Corporation | Method of manufacturing an ink-jet printhead |
-
1980
- 1980-09-30 JP JP55137199A patent/JPS6048115B2/en not_active Expired
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7100254B2 (en) * | 1998-02-18 | 2006-09-05 | Sony Corporation | Method of manufacturing an ink-jet printhead |
Also Published As
Publication number | Publication date |
---|---|
JPS6048115B2 (en) | 1985-10-25 |
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