JPS5759346A - Auxiliary holder for semiconductor substrate - Google Patents

Auxiliary holder for semiconductor substrate

Info

Publication number
JPS5759346A
JPS5759346A JP13541580A JP13541580A JPS5759346A JP S5759346 A JPS5759346 A JP S5759346A JP 13541580 A JP13541580 A JP 13541580A JP 13541580 A JP13541580 A JP 13541580A JP S5759346 A JPS5759346 A JP S5759346A
Authority
JP
Japan
Prior art keywords
semiconductor substrates
blade
carrier
auxiliary holder
semiconductor substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP13541580A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6130421B2 (enrdf_load_stackoverflow
Inventor
Shinsui Saruwatari
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Kyushu Ltd
Original Assignee
NEC Kyushu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Kyushu Ltd filed Critical NEC Kyushu Ltd
Priority to JP13541580A priority Critical patent/JPS5759346A/ja
Publication of JPS5759346A publication Critical patent/JPS5759346A/ja
Publication of JPS6130421B2 publication Critical patent/JPS6130421B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/67313—Horizontal boat type carrier whereby the substrates are vertically supported, e.g. comprising rod-shaped elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Packaging For Recording Disks (AREA)
  • Packaging Frangible Articles (AREA)
JP13541580A 1980-09-29 1980-09-29 Auxiliary holder for semiconductor substrate Granted JPS5759346A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13541580A JPS5759346A (en) 1980-09-29 1980-09-29 Auxiliary holder for semiconductor substrate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13541580A JPS5759346A (en) 1980-09-29 1980-09-29 Auxiliary holder for semiconductor substrate

Publications (2)

Publication Number Publication Date
JPS5759346A true JPS5759346A (en) 1982-04-09
JPS6130421B2 JPS6130421B2 (enrdf_load_stackoverflow) 1986-07-14

Family

ID=15151190

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13541580A Granted JPS5759346A (en) 1980-09-29 1980-09-29 Auxiliary holder for semiconductor substrate

Country Status (1)

Country Link
JP (1) JPS5759346A (enrdf_load_stackoverflow)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6169633A (ja) * 1984-09-10 1986-04-10 Mitsubishi Electric Corp 薄板体の立替方法及びその立替装置
JPS63122954U (enrdf_load_stackoverflow) * 1987-02-05 1988-08-10
JP2009073544A (ja) * 2007-09-22 2009-04-09 Konica Minolta Opto Inc 基板取り出し治具及び記録媒体用ガラス基板の製造方法
US11275004B2 (en) 2016-03-15 2022-03-15 Nisshin Steel Co., Ltd. Strength test method for metal roofing material, strength test equipment, and virtual strength test program

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5348591U (enrdf_load_stackoverflow) * 1976-09-27 1978-04-24

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5348591U (enrdf_load_stackoverflow) * 1976-09-27 1978-04-24

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6169633A (ja) * 1984-09-10 1986-04-10 Mitsubishi Electric Corp 薄板体の立替方法及びその立替装置
JPS63122954U (enrdf_load_stackoverflow) * 1987-02-05 1988-08-10
JP2009073544A (ja) * 2007-09-22 2009-04-09 Konica Minolta Opto Inc 基板取り出し治具及び記録媒体用ガラス基板の製造方法
US11275004B2 (en) 2016-03-15 2022-03-15 Nisshin Steel Co., Ltd. Strength test method for metal roofing material, strength test equipment, and virtual strength test program

Also Published As

Publication number Publication date
JPS6130421B2 (enrdf_load_stackoverflow) 1986-07-14

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