JPS575338A - Molding die - Google Patents

Molding die

Info

Publication number
JPS575338A
JPS575338A JP7902380A JP7902380A JPS575338A JP S575338 A JPS575338 A JP S575338A JP 7902380 A JP7902380 A JP 7902380A JP 7902380 A JP7902380 A JP 7902380A JP S575338 A JPS575338 A JP S575338A
Authority
JP
Japan
Prior art keywords
ejector pin
resin
liner
center
sides
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP7902380A
Other languages
English (en)
Inventor
Takeshi Shimizu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP7902380A priority Critical patent/JPS575338A/ja
Publication of JPS575338A publication Critical patent/JPS575338A/ja
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/40—Removing or ejecting moulded articles

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
JP7902380A 1980-06-13 1980-06-13 Molding die Pending JPS575338A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7902380A JPS575338A (en) 1980-06-13 1980-06-13 Molding die

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7902380A JPS575338A (en) 1980-06-13 1980-06-13 Molding die

Publications (1)

Publication Number Publication Date
JPS575338A true JPS575338A (en) 1982-01-12

Family

ID=13678337

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7902380A Pending JPS575338A (en) 1980-06-13 1980-06-13 Molding die

Country Status (1)

Country Link
JP (1) JPS575338A (ja)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5926244U (ja) * 1982-08-09 1984-02-18 坂東　一雄 半導体樹脂封入成形用の成形装置
JPS59231823A (ja) * 1983-06-13 1984-12-26 Mitsubishi Electric Corp 半導体装置の樹脂封止成形装置
US5480296A (en) * 1992-02-15 1996-01-02 Goldstar Electron Co., Ltd. Transfer molding apparatus for encapsulating an electrical element in resin
JP2016185701A (ja) * 2015-03-27 2016-10-27 高槻電器工業株式会社 金型、金型の制御方法、および半導体装置

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5926244U (ja) * 1982-08-09 1984-02-18 坂東　一雄 半導体樹脂封入成形用の成形装置
JPS59231823A (ja) * 1983-06-13 1984-12-26 Mitsubishi Electric Corp 半導体装置の樹脂封止成形装置
US5480296A (en) * 1992-02-15 1996-01-02 Goldstar Electron Co., Ltd. Transfer molding apparatus for encapsulating an electrical element in resin
JP2016185701A (ja) * 2015-03-27 2016-10-27 高槻電器工業株式会社 金型、金型の制御方法、および半導体装置

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