JPS5753272A - Apparatus for applying photosensitive agent onto printed circuit board - Google Patents

Apparatus for applying photosensitive agent onto printed circuit board

Info

Publication number
JPS5753272A
JPS5753272A JP12945880A JP12945880A JPS5753272A JP S5753272 A JPS5753272 A JP S5753272A JP 12945880 A JP12945880 A JP 12945880A JP 12945880 A JP12945880 A JP 12945880A JP S5753272 A JPS5753272 A JP S5753272A
Authority
JP
Japan
Prior art keywords
photosensitive agent
printed circuit
circuit board
treatment vessel
board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP12945880A
Other languages
Japanese (ja)
Other versions
JPS5822260B2 (en
Inventor
Kazuhiko Yanagihara
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP55129458A priority Critical patent/JPS5822260B2/en
Publication of JPS5753272A publication Critical patent/JPS5753272A/en
Publication of JPS5822260B2 publication Critical patent/JPS5822260B2/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0091—Apparatus for coating printed circuits using liquid non-metallic coating compositions
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0094—Filling or covering plated through-holes or blind plated vias, e.g. for masking or for mechanical reinforcement

Landscapes

  • Coating Apparatus (AREA)

Abstract

PURPOSE: To apply a photosensitive agent with a uniform thickness onto the surface of a printed circuit board and the inside wall surface of through-holes, when the photosensitive agent is applied onto a printed circuit board provided with the through-holes, by applying the photosensitive agent with the first treatment vessel having an agitating function and the second treatment vessel provided with a gas spray nozzle.
CONSTITUTION: A printed circuit board 1 is inclinedly held with a board-holding part 24 by operating air cylinders 26, 28 and piston rods 25, 27 attached to a conveying mechanism 21 running on a rail 20a, and dipped in a photosensitive agent 12 in the first treatment vessel 11. At the same time, a pump 15 is driven to circulate and agitate the photosensitive agent 12 through a photosensitive agent circulating pipe 14. Thereafter, the conveying mechanism 21 is moved above the second treatment vessel 18, and the printed circuit board 1 held vertically with operation 25, 27 is dipped in the photosensitive agent 12. After the board 1 is raised, air is sprayed onto both surfaces of the board 1 through a couple of gas-spray nozzles 19a, 19b. Thus, the photosensitive agent is uniformly applied onto the surfaces of the substrate 1 and the inside wall surfaces of the through-holes.
COPYRIGHT: (C)1982,JPO&Japio
JP55129458A 1980-09-18 1980-09-18 Photosensitive agent coating equipment for printed wiring boards Expired JPS5822260B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP55129458A JPS5822260B2 (en) 1980-09-18 1980-09-18 Photosensitive agent coating equipment for printed wiring boards

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP55129458A JPS5822260B2 (en) 1980-09-18 1980-09-18 Photosensitive agent coating equipment for printed wiring boards

Publications (2)

Publication Number Publication Date
JPS5753272A true JPS5753272A (en) 1982-03-30
JPS5822260B2 JPS5822260B2 (en) 1983-05-07

Family

ID=15009982

Family Applications (1)

Application Number Title Priority Date Filing Date
JP55129458A Expired JPS5822260B2 (en) 1980-09-18 1980-09-18 Photosensitive agent coating equipment for printed wiring boards

Country Status (1)

Country Link
JP (1) JPS5822260B2 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60194465U (en) * 1984-05-31 1985-12-25 捧　典雄 Cutting tools

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4939910A (en) * 1972-08-26 1974-04-15
JPS49112808U (en) * 1972-11-22 1974-09-26

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4939910A (en) * 1972-08-26 1974-04-15
JPS49112808U (en) * 1972-11-22 1974-09-26

Also Published As

Publication number Publication date
JPS5822260B2 (en) 1983-05-07

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