JPS6461987A - Film coating process and blending agent of liquid photo solder resist - Google Patents

Film coating process and blending agent of liquid photo solder resist

Info

Publication number
JPS6461987A
JPS6461987A JP21981087A JP21981087A JPS6461987A JP S6461987 A JPS6461987 A JP S6461987A JP 21981087 A JP21981087 A JP 21981087A JP 21981087 A JP21981087 A JP 21981087A JP S6461987 A JPS6461987 A JP S6461987A
Authority
JP
Japan
Prior art keywords
solder resist
wiring board
boiling point
printed wiring
solvent
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP21981087A
Other languages
Japanese (ja)
Inventor
Takaharu Shimada
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nordson KK
Original Assignee
Nordson KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nordson KK filed Critical Nordson KK
Priority to JP21981087A priority Critical patent/JPS6461987A/en
Priority to PCT/US1988/003044 priority patent/WO1989001989A1/en
Priority to AU23066/88A priority patent/AU2306688A/en
Publication of JPS6461987A publication Critical patent/JPS6461987A/en
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/08—Auxiliary devices therefor
    • B23K3/082—Flux dispensers; Apparatus for applying flux
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C4/00—Coating by spraying the coating material in the molten state, e.g. by flame, plasma or electric discharge
    • C23C4/12—Coating by spraying the coating material in the molten state, e.g. by flame, plasma or electric discharge characterised by the method of spraying
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0091—Apparatus for coating printed circuits using liquid non-metallic coating compositions
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/0989—Coating free areas, e.g. areas other than pads or lands free of solder resist
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1333—Deposition techniques, e.g. coating
    • H05K2203/1366—Spraying coating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1509—Horizontally held PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)

Abstract

PURPOSE:To improve the efficiency of a soldering process as well as the quality of a printed wiring board by a method wherein liquid flat solder resist is sprayed from an airless spraying flat nozzle to coat the printed wiring board surface with the resist by applying a dovetail type liquid film part produced at a certain distance from the spraying flat nozzle to the surface. CONSTITUTION:Liquid flat solder resist is sprayed from an airless spray nozzle 1 to coat the PP plane of a printed wiring board with the resist by applying the bottom (B line) of dovetail type liquid film part Fd to the PP plane. The length 'l' from the nozzle 2 to the 'B' line at the bottom of said film may be around 5mm to coat the printed wiring board. Furthermore, the non-volatile content of liquid flat solder resist is to be 10-40%; the solvent as the other volatile content is a compound type solvent comprising the high boiling point type at 100-210 deg.C and the low boiling point type at 30-100 deg.C to be a blending agent with the blending weight ratio of 40-95% for the high boiling point solvent and 60-5% for the low boiling point solvent.
JP21981087A 1987-08-31 1987-09-02 Film coating process and blending agent of liquid photo solder resist Pending JPS6461987A (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP21981087A JPS6461987A (en) 1987-09-02 1987-09-02 Film coating process and blending agent of liquid photo solder resist
PCT/US1988/003044 WO1989001989A1 (en) 1987-08-31 1988-08-31 Method for applying a film coating of a liquid hot solder resist agent and a resist composition for use with the method
AU23066/88A AU2306688A (en) 1987-09-02 1988-08-31 Method for applying a film coating of a liquid hot solder resist agent and a resist composition for use with the method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP21981087A JPS6461987A (en) 1987-09-02 1987-09-02 Film coating process and blending agent of liquid photo solder resist

Publications (1)

Publication Number Publication Date
JPS6461987A true JPS6461987A (en) 1989-03-08

Family

ID=16741389

Family Applications (1)

Application Number Title Priority Date Filing Date
JP21981087A Pending JPS6461987A (en) 1987-08-31 1987-09-02 Film coating process and blending agent of liquid photo solder resist

Country Status (2)

Country Link
JP (1) JPS6461987A (en)
WO (1) WO1989001989A1 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AU2010214786B2 (en) * 2008-03-06 2013-10-17 Aspen Motion Technologies, Inc Fan Control System with Sensors
CN104994966A (en) * 2013-02-11 2015-10-21 杜尔系统有限责任公司 Application method and application facility

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2417139A (en) * 2004-08-13 2006-02-15 Siemens Aktiengesellschaft Printed circuit board

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62154794A (en) * 1985-12-27 1987-07-09 ノードソン株式会社 Method of covering mounting circuit board with moisture-proof insulating film

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61482A (en) * 1984-06-14 1986-01-06 Aisin Seiki Co Ltd Method for applying coating solution

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62154794A (en) * 1985-12-27 1987-07-09 ノードソン株式会社 Method of covering mounting circuit board with moisture-proof insulating film

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AU2010214786B2 (en) * 2008-03-06 2013-10-17 Aspen Motion Technologies, Inc Fan Control System with Sensors
CN104994966A (en) * 2013-02-11 2015-10-21 杜尔系统有限责任公司 Application method and application facility
JP2016507372A (en) * 2013-02-11 2016-03-10 デュール システムズ ゲゼルシャフト ミット ベシュレンクテル ハフツング Application method and application system
JP2020022965A (en) * 2013-02-11 2020-02-13 デュール システムズ アーゲーＤｕｒｒ Ｓｙｓｔｅｍｓ ＡＧ Coating method and coating system
US11117160B2 (en) 2013-02-11 2021-09-14 Dürr Systems GmbH Application method and application system
US11872588B2 (en) 2013-02-11 2024-01-16 Dürr Systems Ag Application method and application system

Also Published As

Publication number Publication date
WO1989001989A1 (en) 1989-03-09

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