JPS575323A - Heat treating method for semiconductor wafer - Google Patents
Heat treating method for semiconductor waferInfo
- Publication number
- JPS575323A JPS575323A JP7834080A JP7834080A JPS575323A JP S575323 A JPS575323 A JP S575323A JP 7834080 A JP7834080 A JP 7834080A JP 7834080 A JP7834080 A JP 7834080A JP S575323 A JPS575323 A JP S575323A
- Authority
- JP
- Japan
- Prior art keywords
- jig
- boat
- push rod
- semiconductor wafer
- connector
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 title abstract 2
- 238000010438 heat treatment Methods 0.000 abstract 3
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7834080A JPS575323A (en) | 1980-06-12 | 1980-06-12 | Heat treating method for semiconductor wafer |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7834080A JPS575323A (en) | 1980-06-12 | 1980-06-12 | Heat treating method for semiconductor wafer |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS575323A true JPS575323A (en) | 1982-01-12 |
JPS628009B2 JPS628009B2 (ja) | 1987-02-20 |
Family
ID=13659245
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP7834080A Granted JPS575323A (en) | 1980-06-12 | 1980-06-12 | Heat treating method for semiconductor wafer |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS575323A (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63193414A (ja) * | 1987-02-04 | 1988-08-10 | 日本碍子株式会社 | 懸垂碍子 |
-
1980
- 1980-06-12 JP JP7834080A patent/JPS575323A/ja active Granted
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63193414A (ja) * | 1987-02-04 | 1988-08-10 | 日本碍子株式会社 | 懸垂碍子 |
Also Published As
Publication number | Publication date |
---|---|
JPS628009B2 (ja) | 1987-02-20 |
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