JPS5750070B2 - - Google Patents
Info
- Publication number
- JPS5750070B2 JPS5750070B2 JP49120576A JP12057674A JPS5750070B2 JP S5750070 B2 JPS5750070 B2 JP S5750070B2 JP 49120576 A JP49120576 A JP 49120576A JP 12057674 A JP12057674 A JP 12057674A JP S5750070 B2 JPS5750070 B2 JP S5750070B2
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12057674A JPS5146874A (en) | 1974-10-18 | 1974-10-18 | Handotaisochino seizohoho |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12057674A JPS5146874A (en) | 1974-10-18 | 1974-10-18 | Handotaisochino seizohoho |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5146874A JPS5146874A (en) | 1976-04-21 |
| JPS5750070B2 true JPS5750070B2 (ro) | 1982-10-25 |
Family
ID=14789695
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12057674A Granted JPS5146874A (en) | 1974-10-18 | 1974-10-18 | Handotaisochino seizohoho |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5146874A (ro) |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5829640B2 (ja) * | 1981-07-23 | 1983-06-23 | 松下電器産業株式会社 | リ−ド線を有しない回路素子の印刷配線板への取付方法 |
| JPS61129835A (ja) * | 1984-11-22 | 1986-06-17 | Fujitsu Ltd | 半導体装置 |
| JPH0682715B2 (ja) * | 1985-03-29 | 1994-10-19 | 富士通株式会社 | 半導体装置 |
| JPH0682709B2 (ja) * | 1988-06-10 | 1994-10-19 | 日本電気株式会社 | 半導体装置 |
| JP2663178B2 (ja) * | 1989-09-20 | 1997-10-15 | 株式会社日立製作所 | 半導体装置 |
| JP3597913B2 (ja) * | 1995-07-20 | 2004-12-08 | 松下電器産業株式会社 | 半導体装置とその実装方法 |
| CN1102476C (zh) * | 1996-08-27 | 2003-03-05 | 石家庄建工集团公司 | 一种水平向钢筋焊接方法及模具 |
| SG89299A1 (en) * | 1997-01-23 | 2002-06-18 | Seiko Epson Corp | Film carrier tape, semiconductor assembly, semiconductor device, and method of manufacturing the same, mounted board, and electronic instrument |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4826973A (ro) * | 1971-08-10 | 1973-04-09 |
-
1974
- 1974-10-18 JP JP12057674A patent/JPS5146874A/ja active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4826973A (ro) * | 1971-08-10 | 1973-04-09 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5146874A (en) | 1976-04-21 |