JPS5146874A - Handotaisochino seizohoho - Google Patents

Handotaisochino seizohoho

Info

Publication number
JPS5146874A
JPS5146874A JP12057674A JP12057674A JPS5146874A JP S5146874 A JPS5146874 A JP S5146874A JP 12057674 A JP12057674 A JP 12057674A JP 12057674 A JP12057674 A JP 12057674A JP S5146874 A JPS5146874 A JP S5146874A
Authority
JP
Japan
Prior art keywords
handotaisochino seizohoho
handotaisochino
seizohoho
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP12057674A
Other languages
Japanese (ja)
Other versions
JPS5750070B2 (en
Inventor
Shinichi Sato
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP12057674A priority Critical patent/JPS5146874A/en
Publication of JPS5146874A publication Critical patent/JPS5146874A/en
Publication of JPS5750070B2 publication Critical patent/JPS5750070B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
JP12057674A 1974-10-18 1974-10-18 Handotaisochino seizohoho Granted JPS5146874A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12057674A JPS5146874A (en) 1974-10-18 1974-10-18 Handotaisochino seizohoho

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12057674A JPS5146874A (en) 1974-10-18 1974-10-18 Handotaisochino seizohoho

Publications (2)

Publication Number Publication Date
JPS5146874A true JPS5146874A (en) 1976-04-21
JPS5750070B2 JPS5750070B2 (en) 1982-10-25

Family

ID=14789695

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12057674A Granted JPS5146874A (en) 1974-10-18 1974-10-18 Handotaisochino seizohoho

Country Status (1)

Country Link
JP (1) JPS5146874A (en)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5743496A (en) * 1981-07-23 1982-03-11 Matsushita Electric Ind Co Ltd Method of mounting circuit element without lfad wire to printed circuit board
JPS61129835A (en) * 1984-11-22 1986-06-17 Fujitsu Ltd Semiconductor device
JPS61225829A (en) * 1985-03-29 1986-10-07 Fujitsu Ltd Semiconductor device
JPH0228342A (en) * 1988-06-10 1990-01-30 Nec Corp Semiconductor device
JPH03106047A (en) * 1989-09-20 1991-05-02 Hitachi Ltd Semiconductor device
WO1997004481A1 (en) * 1995-07-20 1997-02-06 Matsushita Electric Industrial Co., Ltd. Carrier, semiconductor device, and method of their mounting
WO1998033212A1 (en) * 1997-01-23 1998-07-30 Seiko Epson Corporation Film carrier tape, semiconductor assembly, semiconductor device, manufacturing method therefor, mounting board, and electronic equipment
CN1102476C (en) * 1996-08-27 2003-03-05 石家庄建工集团公司 Horizontal steel bar welding method and die set

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4826973A (en) * 1971-08-10 1973-04-09

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4826973A (en) * 1971-08-10 1973-04-09

Cited By (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5829640B2 (en) * 1981-07-23 1983-06-23 松下電器産業株式会社 How to attach a circuit element without lead wires to a printed wiring board
JPS5743496A (en) * 1981-07-23 1982-03-11 Matsushita Electric Ind Co Ltd Method of mounting circuit element without lfad wire to printed circuit board
JPH0457108B2 (en) * 1984-11-22 1992-09-10 Fujitsu Ltd
JPS61129835A (en) * 1984-11-22 1986-06-17 Fujitsu Ltd Semiconductor device
JPS61225829A (en) * 1985-03-29 1986-10-07 Fujitsu Ltd Semiconductor device
JPH0228342A (en) * 1988-06-10 1990-01-30 Nec Corp Semiconductor device
JPH03106047A (en) * 1989-09-20 1991-05-02 Hitachi Ltd Semiconductor device
WO1997004481A1 (en) * 1995-07-20 1997-02-06 Matsushita Electric Industrial Co., Ltd. Carrier, semiconductor device, and method of their mounting
US6037657A (en) * 1995-07-20 2000-03-14 Matsushita Electric Industrial Co., Ltd. Carrier, semiconductor device, and method of their mounting
CN1102476C (en) * 1996-08-27 2003-03-05 石家庄建工集团公司 Horizontal steel bar welding method and die set
WO1998033212A1 (en) * 1997-01-23 1998-07-30 Seiko Epson Corporation Film carrier tape, semiconductor assembly, semiconductor device, manufacturing method therefor, mounting board, and electronic equipment
US6175151B1 (en) 1997-01-23 2001-01-16 Seiko Epson Corporation Film carrier tape, semiconductor assembly, semiconductor device, and method of manufacturing the same, mounted board, and electronic instrument
US6414382B1 (en) 1997-01-23 2002-07-02 Seiko Epson Corporation Film carrier tape, semiconductor assembly, semiconductor device and method of manufacturing the same, mounted board, and electronic instrument
US6646338B2 (en) 1997-01-23 2003-11-11 Seiko Epson Corporation Film carrier tape, semiconductor assembly, semiconductor device, and method of manufacturing the same, mounted board, and electronic instrument

Also Published As

Publication number Publication date
JPS5750070B2 (en) 1982-10-25

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