JPS5745934A - Separating method for frame - Google Patents

Separating method for frame

Info

Publication number
JPS5745934A
JPS5745934A JP55121159A JP12115980A JPS5745934A JP S5745934 A JPS5745934 A JP S5745934A JP 55121159 A JP55121159 A JP 55121159A JP 12115980 A JP12115980 A JP 12115980A JP S5745934 A JPS5745934 A JP S5745934A
Authority
JP
Japan
Prior art keywords
frames
frame
upper side
uppermost
lead frame
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP55121159A
Other languages
Japanese (ja)
Inventor
Yoshiyuki Abe
Tsutomu Mimata
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP55121159A priority Critical patent/JPS5745934A/en
Publication of JPS5745934A publication Critical patent/JPS5745934A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Supply And Installment Of Electrical Components (AREA)

Abstract

PURPOSE:To effectively separate frames one by one by injecting fluid to the upper side surface of the laminate of the frames. CONSTITUTION:A laminated lead frame 2 set to a guide 1 is lifted by a lifter 4 to the upper stopping position, air is injected from the upper side surface by a nozzle 3 to float the uppermost lead frame 8, the uppermost frame 8 is thus readily isolated from the other frames, and is removed by a chuck 5. According to this construction, the frames can be effectively separated one by one.
JP55121159A 1980-09-03 1980-09-03 Separating method for frame Pending JPS5745934A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP55121159A JPS5745934A (en) 1980-09-03 1980-09-03 Separating method for frame

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP55121159A JPS5745934A (en) 1980-09-03 1980-09-03 Separating method for frame

Publications (1)

Publication Number Publication Date
JPS5745934A true JPS5745934A (en) 1982-03-16

Family

ID=14804302

Family Applications (1)

Application Number Title Priority Date Filing Date
JP55121159A Pending JPS5745934A (en) 1980-09-03 1980-09-03 Separating method for frame

Country Status (1)

Country Link
JP (1) JPS5745934A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5534798A (en) * 1978-08-31 1980-03-11 Siemens Ag Text correcting device
EP0867917A2 (en) * 1997-03-27 1998-09-30 Canon Kabushiki Kaisha Method and apparatus for separating composite member using fluid

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5534798A (en) * 1978-08-31 1980-03-11 Siemens Ag Text correcting device
JPS6242291B2 (en) * 1978-08-31 1987-09-08 Siemens Ag
EP0867917A2 (en) * 1997-03-27 1998-09-30 Canon Kabushiki Kaisha Method and apparatus for separating composite member using fluid
EP0867917A3 (en) * 1997-03-27 2000-05-17 Canon Kabushiki Kaisha Method and apparatus for separating composite member using fluid
EP1134790A2 (en) * 1997-03-27 2001-09-19 Canon Kabushiki Kaisha Apparatus for separating a composite member using fluid jet
EP1134790A3 (en) * 1997-03-27 2001-12-19 Canon Kabushiki Kaisha Apparatus for separating a composite member using fluid jet
US6382292B1 (en) 1997-03-27 2002-05-07 Canon Kabushiki Kaisha Method and apparatus for separating composite member using fluid
US6475323B1 (en) 1997-03-27 2002-11-05 Canon Kabushiki Kaisha Method and apparatus for separating composite member using fluid
US6746559B2 (en) 1997-03-27 2004-06-08 Canon Kabushiki Kaisha Method and apparatus for separating composite member using fluid

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